Patents by Inventor Kostas I. Papthomas

Kostas I. Papthomas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making halogen-free circuitized substrate with reduced thermal expansion
    Patent number: 8499440
    Abstract: A method of making a circuitized substrate including a composite layer having a first dielectric sub-layer including a halogen-free resin and fibers dispersed therein and a second dielectric sub-layer without fibers but also including a halogen-free resin with inorganic particulates therein.
    Type: Grant
    Filed: March 2, 2009
    Date of Patent: August 6, 2013
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Robert M. Japp, Voya R. Markovich, Kostas I. Papthomas
  • Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same
    Patent number: 7687722
    Abstract: A circuitized substrate including a composite layer comprising a first dielectric sub-layer comprised of a halogen-free resin and fibers dispersed therein and a second dielectric sub-layer without fibers but also including a halogen-free resin with inorganic particulates therein. A method of making such a substrate is also provided, as is a multilayered assembly including one or more such circuitized substrates, possibly in combination with other substrates. An information handling system designed for having one or more such circuitized substrates is also provided.
    Type: Grant
    Filed: October 3, 2006
    Date of Patent: March 30, 2010
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Robert M. Japp, Voya R. Markovich, Kostas I. Papthomas
  • Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same
    Publication number: 20090175000
    Abstract: A circuitized substrate including a composite layer comprising a first dielectric sub-layer comprised of a halogen-free resin and fibers dispersed therein and a second dielectric sub-layer without fibers but also including a halogen-free resin with inorganic particulates therein. A method of making such a substrate is also provided, as is a multilayered assembly including one or more such circuitized substrates, possibly in combination with other substrates. An information handling system designed for having one or more such circuitized substrates is also provided.
    Type: Application
    Filed: March 2, 2009
    Publication date: July 9, 2009
    Inventors: Robert M. Japp, Voya R. Markovich, Kostas I. Papthomas
  • Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing
    Publication number: 20080078570
    Abstract: A circuitized substrate including a composite layer comprising a first dielectric sub-layer comprised of a halogen-free resin and fibers dispersed therein and a second dielectric sub-layer without fibers but also including a halogen-free resin with inorganic particulates therein. A method of making such a substrate is also provided, as is a multilayered assembly including one or more such circuitized substrates, possibly in combination with other substrates. An information handling system designed for having one or more such circuitized substrates is also provided.
    Type: Application
    Filed: October 3, 2006
    Publication date: April 3, 2008
    Applicant: Endicott Interconnect Technologies, Inc.
    Inventors: Robert M. Japp, Voya R. Markovich, Kostas I. Papthomas