Abstract: A back surface potential lead-out portion has one end portion disposed in a side of a back surface of a semiconductor wafer held by a semiconductor wafer holding portion and the other end portion disposed in a side of a front surface of the semiconductor wafer held by the semiconductor wafer holding portion. The semiconductor wafer and the semiconductor wafer holding portion that holds the semiconductor wafer are movable in an in-plane direction of the semiconductor wafer. In a case where the semiconductor wafer and the semiconductor wafer holding portion that holds the semiconductor wafer are moved in the in-plane direction, a portion of the back surface potential lead-out portion located in the in-plane direction from the semiconductor wafer is fixed close to the outside of a movement region of the semiconductor wafer.

Abstract: A measuring apparatus includes a stage on which an object to be measured is placed, an insulating base plate, a probe fixed on the insulating base plate, a measuring unit which measures an electrical characteristic of the object to be measured through the probe, a side wall part having such a shape as to surround the probe and smaller in width than the stage, and a supply tube through which an insulating liquid is supplied, wherein when an electrical characteristic of the object to be measured is measured, the stage, the side wall part and the insulating base plate form a measurement region surrounding the object to be measured, and the insulating liquid is applied from the supply tube to the object to be measured in the measurement region.

Abstract: A back surface potential lead-out portion has one end portion disposed in a side of a back surface of a semiconductor wafer held by a semiconductor wafer holding portion and the other end portion disposed in a side of a front surface of the semiconductor wafer held by the semiconductor wafer holding portion. The semiconductor wafer and the semiconductor wafer holding portion that holds the semiconductor wafer are movable in an in-plane direction of the semiconductor wafer. In a case where the semiconductor wafer and the semiconductor wafer holding portion that holds the semiconductor wafer are moved in the in-plane direction, a portion of the back surface potential lead-out portion located in the in-plane direction from the semiconductor wafer is fixed close to the outside of a movement region of the semiconductor wafer.

Abstract: A measuring apparatus includes a stage on which an object to be measured is placed, an insulating base plate, a probe fixed on the insulating base plate, a measuring unit which measures an electrical characteristic of the object to be measured through the probe, a side wall part having such a shape as to surround the probe and smaller in width than the stage, and a supply tube through which an insulating liquid is supplied, wherein when an electrical characteristic of the object to be measured is measured, the stage, the side wall part and the insulating base plate form a measurement region surrounding the object to be measured, and the insulating liquid is applied from the supply tube to the object to be measured in the measurement region.