Abstract: Embodiments disclosed herein include polymer thermal interface materials. In an embodiment a thermal interface material (TIM) comprises a polymer matrix and a liquid metal filler in the polymer matrix. In an embodiment, the liquid metal filler comprises a liquid core and an oxide layer around the liquid core. In an embodiment, the liquid core comprises gallium or a gallium alloy, and the oxide layer comprises a metal oxide other than gallium oxide.

Abstract: Embodiments herein relate to systems, apparatuses, or processes for a layer for etched identification marks on a package. Embodiments include applying a layer to a side of a package, and laser etching the layer with an identification mark associated with the package to provide a visible identification on the package. In particular, the layer may be an EMI shielding layer of film laminate applied to the side of the package to protect the package from EMI or to protect surrounding components from EMI generated by the package. A laser or some other etching technique may then be performed on the layer to make a visible identification on the package.

Abstract: Described is an apparatus which comprises: a die with a first side; a plurality of metal bumps on the first side of the die; a plurality of solders disposed on the plurality of metal bumps; and a patterned printable resist disposed next to at least one of the solders of the plurality of solders. Described is a method which comprises: printing a photoresist ink onto a bumped wafer surface; thermally or Ultra-Violet curing the photoresist ink; and printing or electroplating solder(s) onto the bumped wafer surface. Described is a machine readable storage media having one or more instructions that when executed cause a machine to perform an operations according to the method described above.