Patents by Inventor Kosuke Igawa

Kosuke Igawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THREE-DIMENSIONAL MODELING PATTERN MATERIAL, CURED PRODUCT, CUBIC MOLDED ARTICLE, AND METHOD FOR PRODUCING MOLD BY USING SAID CUBIC MOLDED ARTICLE
    Publication number: 20220325023
    Abstract: A three-dimensional pattern material capable of forming a cured product having excellent hardness and castability, a cured product, a cubic molded article, and a method for producing a mold by using the cubic molded article are provided. The three-dimensional modeling pattern material contains a curable resin composition containing a (meth) acrylate compound (A) represented by Structural Formula (1) and an aliphatic (meth) acrylate compound (B). The three-dimensional modeling pattern material has a content of the (meth) acrylate compound (A) of 50% by mass or more in a total mass of the (meth) acrylate compound (A) and the (meth) acrylate compound (B).
    Type: Application
    Filed: June 22, 2022
    Publication date: October 13, 2022
    Applicant: DIC Corporation
    Inventors: Yujiro Hara, Masakazu Yoshizawa, Kosuke Igawa, Atsushi Oshio