Patents by Inventor Kosuke Iha

Kosuke Iha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9721694
    Abstract: A method suitable for mass production of nanoparticles with a uniform particle diameter is provided. It is an object to provide a powder of the nanoparticle obtained by this method, a dispersion containing the nanoparticles, and a paste containing the nanoparticles. There is provided a method for manufacturing silver particles including the step of reducing silver in a silver solution containing a protective agent composed of an organic material and a copper component in an amount of 1 to 1,000 ppm relative to the amount of silver to obtain particles having an average particle diameter (DTEM) of 5 to 100 nm as measured using a transmission electron microscope.
    Type: Grant
    Filed: April 3, 2015
    Date of Patent: August 1, 2017
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Shuji Kaneda, Kimikazu Motomura, Tatsuya Kariyasu, Yutaka Hisaeda, Kosuke Iha
  • Publication number: 20150243400
    Abstract: A method suitable for mass production of nanoparticles with a uniform particle diameter is provided. It is an object to provide a powder of the nanoparticle obtained by this method, a dispersion containing the nanoparticles, and a paste containing the nanoparticles. There is provided a method for manufacturing silver particles including the step of reducing silver in a silver solution containing a protective agent composed of an organic material and a copper component in an amount of 1 to 1,000 ppm relative to the amount of silver to obtain particles having an average particle diameter (DTEM) of 5 to 100 nm as measured using a transmission electron microscope.
    Type: Application
    Filed: April 3, 2015
    Publication date: August 27, 2015
    Applicant: DOWA Electronics Materials Co., Ltd.
    Inventors: Shuji KANEDA, Kimikazu MOTOMURA, Tatsuya KARIYASU, Yutaka HISAEDA, Kosuke IHA
  • Patent number: 9034214
    Abstract: A method suitable for mass production of nanoparticles with a uniform particle diameter is provided. It is an object to provide a powder of the nanoparticle obtained by this method, a dispersion containing the nanoparticles, and a paste containing the nanoparticles. There is provided a method for manufacturing silver particles including the step of reducing silver in a silver solution containing a protective agent composed of an organic material and a copper component in an amount of 1 to 1,000 ppm relative to the amount of silver to obtain particles having an average particle diameter (DTEM) of 5 to 100 nm as measured using a transmission electron microscope.
    Type: Grant
    Filed: December 25, 2009
    Date of Patent: May 19, 2015
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Shuji Kaneda, Kimikazu Motomura, Tatsuya Kariyasu, Yutaka Hisaeda, Kosuke Iha
  • Publication number: 20110253949
    Abstract: A method suitable for mass production of nanoparticles with a uniform particle diameter is provided. It is an object to provide a powder of the nanoparticle obtained by this method, a dispersion containing the nanoparticles, and a paste containing the nanoparticles. There is provided a method for manufacturing silver particles including the step of reducing silver in a silver solution containing a protective agent composed of an organic material and a copper component in an amount of 1 to 1,000 ppm relative to the amount of silver to obtain particles having an average particle diameter (DTEM) of 5 to 100 nm as measured using a transmission electron microscope.
    Type: Application
    Filed: December 25, 2009
    Publication date: October 20, 2011
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Shuji Kaneda, Kimikazu Motomura, Tatsuya Kariyasu, Yutaka Hisaeda, Kosuke Iha
  • Publication number: 20110155968
    Abstract: A metal-containing composition that can provide, by low-temperature heat treatment, a sintered state comparable to that obtained by high-temperature heat treatment, a conductive paste, a metal film are provided. A method for manufacturing a metal-containing composition that can manufacture the metal-containing composition by simple operation steps is also provided. The metal-containing composition contains fine metal particles, and the ratio ?f of a true density ?200 to a true density ?150 (=?200/?150) is 1.10 or less where ?150 is the true density of the metal-containing composition after heating at 150° C. for 60 minutes, and ?200 is the true density after heating at 200° C. for 60 minutes. The ratio of ?150 to ?M (?150/?M) and the ratio of ?200 to ?M (?200/?M) are 0.8 or more, where ?M is the density of the fine metal particles in a bulk form. An organic material having a molecular weight of 200 or less is caused to adhere to the fine metal particles.
    Type: Application
    Filed: August 7, 2008
    Publication date: June 30, 2011
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Kosuke Iha, Yutaka Hisaeda, Toshihiko Ueyama