Patents by Inventor Kosuke Ikeda

Kosuke Ikeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11934110
    Abstract: A developing roll has a metal core, an elastic layer, and a surface layer. A value X is 65.6 N/mm3 or more and a value Y is 229 ?m or more. The value X is P1/(D1×A)?P2/(D2×A). P1 is the load to displace the roll 100 ?m when a metal probe is pressed against the roll. D1 is the displacement of the roll caused by the probe under the load P1. A is the area of the probe. P2 is the load to displace a material roll by 100 ?m when the probe presses against the material roll with the core and the elastic layer and without the surface layer. D2 is the displacement of the material roll caused by the probe under the load P2. The value Y is the displacement of the roll when the probe pierces the surface layer.
    Type: Grant
    Filed: March 16, 2021
    Date of Patent: March 19, 2024
    Assignee: NOK CORPORATION
    Inventors: Kosuke Oura, Atsushi Ikeda, Satoshi Fukuoka, Kenji Sasaki
  • Publication number: 20240077238
    Abstract: A refrigeration cycle device with a main circuit, a bypass circuit and a supercooling heat exchanger further includes: a controller to control an opening degree of the bypass expansion valve; a first sensor to detect a temperature at the refrigerant inflow side of the evaporator; and a second sensor to detect a pressure of the non-azeotropic mixed refrigerant flowing from the evaporator, wherein the controller controls the opening degree of the bypass expansion valve using temperatures of the evaporator, that is, the temperature at the refrigerant inflow side and a saturated gas temperature of the non-azeotropic mixed refrigerant calculated from the pressure so as to adjust a flow rate of the non-azeotropic mixed refrigerant flowing into the evaporator, to eliminate the temperature difference in the evaporator for suppressing uneven frost formation on the evaporator, and thus to prevent heat exchange performance from degrading.
    Type: Application
    Filed: February 2, 2021
    Publication date: March 7, 2024
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yuki MIZUNO, Soshi IKEDA, Kosuke MIYAWAKI, Jun NISHIO, Yuji MOTOMURA, Hiroki WASHIYAMA
  • Patent number: 11921439
    Abstract: A developing roll used in an electrophotographic image forming apparatus has a metal core member, an elastic layer made of a rubber disposed around the core member, and a surface layer disposed around the elastic layer. The texture aspect ratio of the surface Str of the surface layer is equal to or greater than 0.55.
    Type: Grant
    Filed: April 2, 2021
    Date of Patent: March 5, 2024
    Assignee: NOK CORPORATION
    Inventors: Kosuke Oura, Atsushi Ikeda, Kenji Sasaki
  • Publication number: 20230380055
    Abstract: A wiring substrate includes a core substrate, a build-up part formed on a surface of the substrate and including insulating layers and conductor layers, and a covering insulating layer formed on the build-up part such that the covering layer is covering the outermost surface of the build-up part. The build-up part is formed such that the insulating layers include a first insulating layer forming the outermost one of the insulating layers, that the conductor layers include a first conductor layer formed on the first insulating layer and including a first conductor pad, and that a tensile strength of the first insulating layer is higher than a tensile strength of each insulating layer other than the first insulating layer in the first build-up part, and the covering layer is formed such that the covering layer has opening entirely exposing an upper surface and a side surface of the first conductor pad.
    Type: Application
    Filed: April 26, 2023
    Publication date: November 23, 2023
    Applicant: IBIDEN CO., LTD.
    Inventors: Masataka KATO, Shunsuke SAKAI, Masahide TAWATARI, Kosuke IKEDA
  • Publication number: 20230380076
    Abstract: A wiring substrate includes a core substrate, a build-up part formed on a surface of the substrate and including insulating layers and conductor layers, and a covering insulating layer formed on the build-up part such that the covering layer is covering the outermost surface of the build-up part. The build-up part is formed such that the insulating layers include a first insulating layer forming the outermost one of the insulating layers, that the conductor layers include a first conductor layer formed on the first insulating layer and including a first conductor pad, and that an elongation rate of the first insulating layer is greater than an elongation rate of each insulating layer other than the first insulating layer in the build-up part, and the covering layer is formed such that the covering layer has an opening entirely exposing an upper surface and a side surface of the first conductor pad.
    Type: Application
    Filed: April 26, 2023
    Publication date: November 23, 2023
    Applicant: IBIDEN CO., LTD.
    Inventors: Masataka KATO, Shunsuke SAKAI, Masahide TAWATARI, Kosuke IKEDA
  • Patent number: 11776937
    Abstract: An electronic module has a first substrate 11; a first electronic element 13 provided on one side of the first substrate 11; a first connection body 60 provided on the one side of the first electronic element 13; a second electronic element 23 provided on the one side of the first connection body 60; and a second connection body 70 provided on the one side of the second electronic element 23. The first electronic element 13 and the second electronic element 23 do not overlap in a plane direction.
    Type: Grant
    Filed: July 4, 2018
    Date of Patent: October 3, 2023
    Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventor: Kosuke Ikeda
  • Patent number: 11729912
    Abstract: A wiring substrate includes an insulating layer including inorganic fillers and resin, and a conductor layer formed on a surface of the insulating layer and having a conductor pattern. The surface of the insulating layer has an arithmetic average roughness Ra in the range of 0.05 ?m to 0.5 ?m, the conductor layer includes a metal film formed on the surface of the insulating layer, and the inorganic fillers include a first inorganic filler including particles such that each of the particles has a portion of a surface separated from the resin and forming a gap with respect to the resin of the insulating layer and that the metal film of the conductor layer includes part formed in the gap between the first inorganic filler and the resin.
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: August 15, 2023
    Assignee: IBIDEN CO., LTD.
    Inventor: Kosuke Ikeda
  • Publication number: 20230180385
    Abstract: A wiring substrate includes an insulating layer including inorganic filler particles and resin, and a conductor layer including a metal film formed on a surface of the insulating layer and having a conductor pattern. The inorganic filler particles include first inorganic filler particles such that each of the first inorganic filler particles has a portion exposed on the surface of the insulating layer and is at least partially separated from the resin, the conductor layer is formed such that a part of the metal film is between the first inorganic filler particles and the resin from the surface of the insulating layer and that a distance between the surface of the insulating layer and the surface of the insulating layer at a deepest part of the part of the metal film is in the range of 0.1 ?m to 0.5 ?m.
    Type: Application
    Filed: December 6, 2022
    Publication date: June 8, 2023
    Applicant: IBIDEN CO., LTD.
    Inventors: Shogo FUKUI, Kosuke IKEDA, Kosei ICHIKAWA, Ryo ANDO
  • Patent number: 11658109
    Abstract: An electronic module has a first substrate 11, a first electronic element 13, a second electronic element 23, a second substrate 21, a first terminal part 110 provided on a side of the first substrate 11 and a second terminal part 120 provided on a side of the second substrate 21. The first terminal part 110 has a first surface direction extending part 114 and a first normal direction extending part 113 extending toward one side or the other side. The second terminal part 120 has a second surface direction extending part 124 and a second normal direction extending part 123 extending toward one side or the other side. The second surface direction extending part 124 is provided on one side of the first surface direction extending part 114, and the first surface direction extending part 114 and the second surface direction extending part 124 overlap one another in a surface direction.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: May 23, 2023
    Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Kosuke Ikeda, Osamu Matsuzaki
  • Patent number: 11486904
    Abstract: An electronic module has an electronic element 210; a connection body 250 provided on a front face of the electronic element 210; and a detection part 100 having a winding wire part 10 provided so as to surround the connection body 250, and a winding return wire part 50 connected to a terminal end part of the winding wire part 10 and returns from the terminal end part toward a starting end part.
    Type: Grant
    Filed: July 4, 2018
    Date of Patent: November 1, 2022
    Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Kosuke Ikeda, Kazuyuki Sashida
  • Publication number: 20220300390
    Abstract: There is provided a determination apparatus including: a result acquisition unit configured to acquire test results of tests on a plurality of items which are performed on a device under measurement; and a first determination unit configured to determine whether to retest a device under measurement that has failed the test, in which the first determination unit is configured to perform the determination based on reproducibility of the test results in a case where the tests have been performed on a plurality of devices under measurement multiple times in advance.
    Type: Application
    Filed: June 6, 2022
    Publication date: September 22, 2022
    Inventors: Kosuke IKEDA, Hajime SUGIMURA
  • Patent number: 11437298
    Abstract: An electronic module has a first substrate 11, an electronic element 13, 23 disposed on one side of the first substrate 11, a second substrate 21 disposed on one side of the electronic element 13, 23, a first coupling body 210 disposed between the first substrate 11 and the second substrate 21, a second coupling body 220 disposed between the first substrate 11 and the second substrate 21, and shorter than the first coupling body 210, and a sealing part 90 which seals at least the electronic element. The first coupling body 210 is not electrically connected to the electronic element. The second coupling body 220 is electrically connected to the electronic element 13, 23.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: September 6, 2022
    Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Osamu Matsuzaki, Kosuke Ikeda
  • Patent number: 11437340
    Abstract: An electronic module has a first electronic element 13, a first connector 60 provided in one side of the first electronic element 13, and having a first columnar part 62 extending to another side and a first groove part 64 provided in a one-side surface, and a second electronic element 23 provided in one side of the first connector 60 via a conductive adhesive agent provided inside a circumference of the first groove part 64. The first connector 60 has a first concave part 67 on one side at a position corresponding to the first columnar part 62.
    Type: Grant
    Filed: May 19, 2017
    Date of Patent: September 6, 2022
    Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Kosuke Ikeda, Osamu Matsuzaki
  • Patent number: 11322448
    Abstract: An electronic module has a first substrate 11; a second substrate 21 provided in one side of the first substrate 11; and a chip module 100 provided between the first substrate 11 and the second substrate 21. The chip module 100 has an electronic element 13, 23 and a connecting body 60, 70, 80 electrically connected to the electronic element 13, 23. The electronic element 13, 23 extends along a first direction that is a thickness direction of the electronic module.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: May 3, 2022
    Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventor: Kosuke Ikeda
  • Patent number: 11309250
    Abstract: An electronic module has a first substrate 11; an electronic element 13, 23 provided on one side of the first substrate 11; a sealing part 90 that seals at least the electronic element 13, 23; a connection terminal 110 electrically connected to the electronic element 13, 23 and exposed from a side surface of the sealing part 90; and a stress relaxation terminal 150, which is not electrically connected to the electronic element 13, 23, exposed from the side surface of the sealing part 90.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: April 19, 2022
    Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventor: Kosuke Ikeda
  • Patent number: 11309273
    Abstract: An electronic module has a first substrate 11, a first electronic element 13 provided on one side of the first substrate 11, a first connection body 60 provided on one side of the first electronic element 13, a second electronic element 23 provided on one side of the first connection body 60, a second substrate 21 provided on one side of the second electronic element 23, and an abutment body 250 that abuts on a face on one side of the second electronic element 23 and is capable of imparting a force toward one side with respect to the second substrate 21.
    Type: Grant
    Filed: May 19, 2017
    Date of Patent: April 19, 2022
    Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Kosuke Ikeda, Osamu Matsuzaki
  • Patent number: 11276663
    Abstract: An electronic module has a first substrate 11, a first conductor layer 12 that is provided on one side of the first substrate 11, a first electronic element 13 that is provided on one side of the first conductor layer 12, a second electronic element 23 that is provided on one side of the first electronic element 23, and a second connecting body 70 that has a second head part 71 provided on one side of the second electronic element 23 and an extending part 75 extending from the second head part 71 to the other side and abutting against the first substrate 11 or the first conductor layer 12.
    Type: Grant
    Filed: May 19, 2017
    Date of Patent: March 15, 2022
    Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Kosuke Ikeda, Osamu Matsuzaki
  • Patent number: 11264351
    Abstract: A method of manufacturing a chip module comprises a step of disposing a first electronic element 13 on a first jig 500, a step of disposing a first connector 60 on the first electronic element 13 via a conductive adhesive 5, a step of disposing a second electronic element 23 on the first connector 60 via a conductive adhesive 5, a step of disposing a second connector 70 on a second jig 550, a step of reversing the second jig in a state where the second connector 70 is fixed to the second jig 550 and disposing the second connector 70 on the second electronic element 23 via a conductive adhesive 5, and a step of curing the conductive adhesives 5.
    Type: Grant
    Filed: May 19, 2017
    Date of Patent: March 1, 2022
    Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Kosuke Ikeda, Osamu Matsuzaki
  • Publication number: 20220046795
    Abstract: A wiring substrate includes an insulating layer including inorganic fillers and resin, and a conductor layer formed on a surface of the insulating layer and having a conductor pattern. The surface of the insulating layer has an arithmetic average roughness Ra in the range of 0.05 ?m to 0.5 ?m, the conductor layer includes a metal film formed on the surface of the insulating layer, and the inorganic fillers include a first inorganic filler including particles such that each of the particles has a portion of a surface separated from the resin and forming a gap with respect to the resin of the insulating layer and that the metal film of the conductor layer includes part formed in the gap between the first inorganic filler and the resin.
    Type: Application
    Filed: July 29, 2021
    Publication date: February 10, 2022
    Applicant: IBIDEN CO., LTD.
    Inventor: Kosuke IKEDA
  • Patent number: 11244443
    Abstract: Provided is an examination apparatus including a target image acquiring section that acquires a target image obtained by capturing an examination target; a target image masking section that masks a portion of the target image; a masked region predicting section that predicts an image of a masked region that is masked in the target image; a reproduced image generating section that generates a reproduced image using a plurality of predicted images predicted respectively for the plurality of masked regions; and a difference detecting section that detects a difference between the target image and the reproduced image.
    Type: Grant
    Filed: July 28, 2019
    Date of Patent: February 8, 2022
    Assignee: ADVANTEST CORPORATION
    Inventors: Kosuke Ikeda, Ira Leventhal, Keith Schaub