Patents by Inventor Kosuke Ishida

Kosuke Ishida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11282623
    Abstract: A coil component comprising a first coil conductor layer wound on a plane, a lead-out conductor led out on the same plane as the first coil conductor layer from an outer-circumferential end of the first coil conductor layer, an insulating layer laminated on the first coil conductor layer and the lead-out conductor, and a second coil conductor layer laminated on the insulating layer and wound on a plane. The first coil conductor layer and the second coil conductor layer concentrically overlap with each other when viewed in a lamination direction, and the lead-out conductor has a connecting portion connected to the first coil conductor layer and provided with a coil extension part extending to overlap with the second coil conductor layer when viewed in the lamination direction.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: March 22, 2022
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Ryo Okura, Yoichi Nakatsuji, Kosuke Ishida
  • Patent number: 11255836
    Abstract: Provided are a soil estimation device, a soil estimation method and a program that are capable of improving the accuracy of estimation of a state in soil without increasing the number of sensors that detect the state in the soil. The soil estimation device 100 is provided with an estimated model generation unit 10. The estimated model generation unit 10 generates an estimated model based on at least one among geographical information that specifies a geographical feature of a field of interest and soil distribution information that specifies a soil distribution in the field. The estimated model is a model for estimating, from a measured value that indicates the state in the soil at one location within the field, the state in the soil at a location other than the one location.
    Type: Grant
    Filed: March 22, 2017
    Date of Patent: February 22, 2022
    Assignee: NEC CORPORATION
    Inventors: Kosuke Ishida, Shinji Oominato, Masami Sakaguchi, Shunsuke Akimoto
  • Patent number: 11189416
    Abstract: A coil component comprising a coil conductor layer wound on a plane, an outer-circumferential lead-out conductor led out on the same plane as the coil conductor layer from an outer-circumferential end of the coil conductor layer, and an inner-circumferential lead-out conductor led out on the same plane as the coil conductor layer from an inner-circumferential end of the coil conductor layer. The coil component further comprises a branch conductor disposed to branch from at least one of the outer-circumferential lead-out conductor and the inner-circumferential lead-out conductor, and extending on the same plane as the coil conductor layer.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: November 30, 2021
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoichi Nakatsuji, Kosuke Ishida, Ryo Okura
  • Patent number: 10748698
    Abstract: An electronic component having a main body includes a plurality of insulator layers laminated in a lamination direction. A primary coil is disposed in the main body and includes one or more primary coil conductor layers. A secondary coil is disposed in the main body and includes one or more secondary coil conductor layers. A tertiary coil is disposed in the main body and includes one or more tertiary coil conductor layers. The plurality of insulator layers includes a first insulator layer including a portion interposed between the primary coil conductor layer and the secondary coil conductor layer, a second insulator layer including a portion interposed between the secondary coil conductor layer and the tertiary coil conductor layer, and a third insulator layer including a portion interposed between the tertiary coil conductor layer and the primary coil conductor layer.
    Type: Grant
    Filed: August 10, 2017
    Date of Patent: August 18, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Ryo Okura, Mizuho Katsuta, Kosuke Ishida
  • Patent number: 10714254
    Abstract: An electronic component includes a body, a first inductor, and a low expansion portion. The body includes a laminated body including a plurality of insulating layers laminated in a lamination direction. The insulating layers contain a first resin as a material. The first inductor includes a first inductor conductor layer that adjoins one of the insulating layers. The low expansion portion has a coefficient of linear expansion lower than a coefficient of linear expansion of the plurality of insulating layers. The low expansion portion contains a second resin as a material. At least part of the low expansion portion is embedded in the laminated body. The second resin has a coefficient of linear expansion that is lower than a coefficient of linear expansion of the first resin.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: July 14, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoichi Nakatsuji, Kosuke Ishida, Mizuho Katsuta
  • Patent number: 10622135
    Abstract: An electronic component having a laminated body made up of a plurality of laminated insulator layers and having an upper surface and a bottom surface. A plurality of inner conductors is disposed on the insulator layers in the laminated body. A plurality of terminal electrodes is electrically connected to the plurality of inner conductors. The plurality of terminal electrodes each is exposed on a bottom surface side of the laminated body. Some or all of the plurality of terminal electrodes constitute a terminal electrode unit. The terminal electrode unit includes a first terminal electrode and a plurality of second terminal electrodes arranged around the first terminal electrode at substantially the same intervals from the first terminal electrode.
    Type: Grant
    Filed: August 22, 2017
    Date of Patent: April 14, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kosuke Ishida, Hiromu Fukushima
  • Patent number: 10560066
    Abstract: An electronic component capable of downsizing and narrowing of a mounting space. The electronic component includes: a laminated body made up of a plurality of laminated insulator layers and having an upper surface and a bottom surface; a plurality of inner conductors disposed in the laminated body; and a plurality of terminal electrodes electrically connected to the plurality of inner conductors and exposed from the laminated body. The electronic component has a plurality of recesses formed on a bottom surface of the laminated body. The plurality of terminal electrodes includes first conductive parts formed on wall surfaces of the plurality of recesses.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: February 11, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Kosuke Ishida
  • Publication number: 20200025742
    Abstract: Provided are a soil estimation device, a soil estimation method and a program that are capable of improving the accuracy of estimation of a state in soil without increasing the number of sensors that detect the state in the soil. The soil estimation device 100 is provided with an estimated model generation unit 10. The estimated model generation unit 10 generates an estimated model based on at least one among geographical information that specifies a geographical feature of a field of interest and soil distribution information that specifies a soil distribution in the field. The estimated model is a model for estimating, from a measured value that indicates the state in the soil at one location within the field, the state in the soil at a location other than the one location.
    Type: Application
    Filed: March 22, 2017
    Publication date: January 23, 2020
    Applicant: NEC CORPORATION
    Inventors: Kosuke ISHIDA, Shinji OOMINATO, Masami SAKAGUCHI, Shunsuke AKIMOTO
  • Patent number: 10497510
    Abstract: An electronic component having an electric element including a coil, a magnetic layer covering at least a portion of the electric element, a plurality of external terminals electrically connected to the electric element and embedded in the magnetic layer to be partially exposed from one surface of the magnetic layer, and a nonmagnetic layer embedded in the magnetic layer. The plurality of external terminals include at least one or more first external terminals. The first external terminals are surrounded by the nonmagnetic layer when viewed from the one surface side of the magnetic layer.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: December 3, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Kosuke Ishida
  • Patent number: 10476466
    Abstract: An electronic component includes a multilayer body constituted by insulator layers that are laminated in a laminating direction, a primary coil including one or more primary coil conductor layers, a secondary coil including one or more secondary coil conductor layers, and a tertiary coil including one or more tertiary coil conductor layers. The primary coil conductor layers, the secondary coil conductor layers, and the tertiary coil conductor layers are arrayed in the laminating direction. The primary coil, the secondary coil, and tertiary coil constitute a common mode filter, and intervals between two among the one or more primary coil conductor layers, the one or more secondary coil conductor layers, and the one or more tertiary coil conductor layers, every two of those being adjacent to each other in the laminating direction, are not even.
    Type: Grant
    Filed: October 19, 2016
    Date of Patent: November 12, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Jun Karino, Mizuho Katsuta, Kosuke Ishida
  • Patent number: 10332674
    Abstract: An electronic component includes a first inductor which is provided on a first direction side relative to a first main surface, which includes one or more first inductor conductive layers having substantially a spiral shape when viewed from the first direction side, and which includes a first end portion and a second end portion; a first outer electrode and a second outer electrode provided on a surface different from the first main surface of a substrate; and a first surface mounted electronic component which is provided on the first direction side relative to the first inductor, which overlaps the first inductor when viewed from the first direction side, and which includes a third outer electrode and a fourth outer electrode.
    Type: Grant
    Filed: March 6, 2017
    Date of Patent: June 25, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Kosuke Ishida
  • Patent number: 10249431
    Abstract: An electronic component includes a first outer electrode, a second outer electrode, a third outer electrode, and a fourth outer electrode which are provided to correspond to four corners of a second main surface; a fifth outer electrode which is provided on the second main surface; a multilayer body; a first inductor which includes a first end portion and a second end portion; and a first surface mounted electronic component which is mounted on the multilayer body and which includes a sixth outer electrode and a seventh outer electrode. The first end portion is electrically connected to the first outer electrode. The second end portion is electrically connected to the second outer electrode and the sixth outer electrode. The seventh outer electrode is electrically connected to the fifth outer electrode.
    Type: Grant
    Filed: March 6, 2017
    Date of Patent: April 2, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kosuke Ishida, Katsufumi Sasaki
  • Publication number: 20190035527
    Abstract: A coil component comprising a first coil conductor layer wound on a plane, a lead-out conductor led out on the same plane as the first coil conductor layer from an outer-circumferential end of the first coil conductor layer, an insulating layer laminated on the first coil conductor layer and the lead-out conductor, and a second coil conductor layer laminated on the insulating layer and wound on a plane. The first coil conductor layer and the second coil conductor layer concentrically overlap with each other when viewed in a lamination direction, and the lead-out conductor has a connecting portion connected to the first coil conductor layer and provided with a coil extension part extending to overlap with the second coil conductor layer when viewed in the lamination direction.
    Type: Application
    Filed: July 13, 2018
    Publication date: January 31, 2019
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Ryo OKURA, Yoichi NAKATSUJI, Kosuke ISHIDA
  • Patent number: 10181374
    Abstract: In an electronic component, a primary coil is electrically connected between a first outer electrode and a fourth outer electrode, a secondary coil is electrically connected between a second outer electrode and a fifth outer electrode, a tertiary coil is electrically connected between a third outer electrode and a sixth outer electrode, and a first inter-layer connection conductor, a second inter-layer connection conductor, and a third inter-layer connection conductor are electrically connected to the end portions at an inner side of a first coil conductor layer, a second coil conductor layer, and a third coil conductor layer, respectively. The first inter-layer connection conductor, the second inter-layer connection conductor, and the third inter-layer connection conductor are not positioned at one side of a second perpendicular direction, compared with a magnetic core, when viewed from a laminating direction.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: January 15, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Mizuho Katsuta, Kosuke Ishida, Jun Karino
  • Patent number: 10176918
    Abstract: An electronic component includes a first ceramic substrate having a first principal surface on the upper side and a second principal surface on the lower side, a multilayer body constituted by a plurality of insulator layers each made of a material containing resin and laminated on the first principal surface, a first coil disposed in and/or on the multilayer body, a first relay conductor connected to the first coil, and a first outer electrode disposed on the first ceramic substrate and electrically connected to the first relay conductor. The plurality of insulator layers include one or more first insulator layers in each of which a first corner has a shape cut away as a first cut-away portion, the first relay conductor is disposed in the first cut-away portion, and the plurality of insulator layers include a second insulator layer that is contacted with the first relay conductor from below.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: January 8, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kosuke Ishida, Mizuho Katsuta, Jun Karino, Yoichi Nakatsuji
  • Publication number: 20180350506
    Abstract: A coil component comprising a coil conductor layer wound on a plane, an outer-circumferential lead-out conductor led out on the same plane as the coil conductor layer from an outer-circumferential end of the coil conductor layer, and an inner-circumferential lead-out conductor led out on the same plane as the coil conductor layer from an inner-circumferential end of the coil conductor layer. The coil component further comprises a branch conductor disposed to branch from at least one of the outer-circumferential lead-out conductor and the inner-circumferential lead-out conductor, and extending on the same plane as the coil conductor layer.
    Type: Application
    Filed: May 17, 2018
    Publication date: December 6, 2018
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Yoichi NAKATSUJI, Kosuke ISHIDA, Ryo OKURA
  • Patent number: 10115519
    Abstract: An electronic component includes a primary coil including n primary coil conductor layers and a parallel primary coil conductor layer, and secondary and tertiary coils including respectively n secondary and tertiary coil conductor layers. Respective ones of the primary, secondary and tertiary coil conductor layers are arrayed alternately in this order from one side toward other side in laminating direction. The parallel primary coil conductor layer is electrically connected to a predetermined primary coil conductor layer, has the substantially same shape as the predetermined primary coil conductor layer in a plan view, and is disposed on the other side in the laminating direction relative to the tertiary coil conductor layer disposed at a farthest position on the other side in the laminating direction.
    Type: Grant
    Filed: October 19, 2016
    Date of Patent: October 30, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Jun Karino, Mizuho Katsuta, Kosuke Ishida
  • Publication number: 20180090260
    Abstract: An electronic component having a laminated body made up of a plurality of laminated insulator layers and having an upper surface and a bottom surface. A plurality of inner conductors is disposed on the insulator layers in the laminated body. A plurality of terminal electrodes is electrically connected to the plurality of inner conductors. The plurality of terminal electrodes each is exposed on a bottom surface side of the laminated body. Some or all of the plurality of terminal electrodes constitute a terminal electrode unit. The terminal electrode unit includes a first terminal electrode and a plurality of second terminal electrodes arranged around the first terminal electrode at substantially the same intervals from the first terminal electrode.
    Type: Application
    Filed: August 22, 2017
    Publication date: March 29, 2018
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Kosuke ISHIDA, Hiromu FUKUSHIMA
  • Publication number: 20180061670
    Abstract: An electronic component capable of downsizing and narrowing of a mounting space. The electronic component includes: a laminated body made up of a plurality of laminated insulator layers and having an upper surface and a bottom surface; a plurality of inner conductors disposed in the laminated body; and a plurality of terminal electrodes electrically connected to the plurality of inner conductors and exposed from the laminated body. The electronic component has a plurality of recesses formed on a bottom surface of the laminated body. The plurality of terminal electrodes includes first conductive parts formed on wall surfaces of the plurality of recesses.
    Type: Application
    Filed: June 29, 2017
    Publication date: March 1, 2018
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Kosuke ISHIDA
  • Publication number: 20180061554
    Abstract: An electronic component having a main body includes a plurality of insulator layers laminated in a lamination direction. A primary coil is disposed in the main body and includes one or more primary coil conductor layers. A secondary coil is disposed in the main body and includes one or more secondary coil conductor layers. A tertiary coil is disposed in the main body and includes one or more tertiary coil conductor layers. The plurality of insulator layers includes a first insulator layer including a portion interposed between the primary coil conductor layer and the secondary coil conductor layer, a second insulator layer including a portion interposed between the secondary coil conductor layer and the tertiary coil conductor layer, and a third insulator layer including a portion interposed between the tertiary coil conductor layer and the primary coil conductor layer.
    Type: Application
    Filed: August 10, 2017
    Publication date: March 1, 2018
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Ryo OKURA, Mizuho KATSUTA, Kosuke ISHIDA