Abstract: A learning device 1X mainly includes a first acquisition means 31X, a second acquisition means 32X, and a learning means 34X. The first acquisition means 31X acquires a partial waveform of electrocardiogram data regarding an electrocardiogram of a subject. The second acquisition means 32X acquires an attention interval, which is used as a basis for a diagnosis of a target disease, in a sequential waveform of the electrocardiogram data. The learning means 34X trains a model configured to diagnose the target disease, based on the partial waveform and the attention interval.

Abstract: There is provided an optical waveguide device including: a substrate; an optical waveguide formed on the substrate; and a working electrode that controls a light wave propagating through the optical waveguide, in which the working electrode includes a first base layer made of a first material, a first conductive layer on the first base layer, a second base layer made of a second material different from the first material, which is on the first conductive layer, and a second conductive layer on the second base layer, and an edge of the second base layer is covered with the second conductive layer, in a cross-section perpendicular to an extending direction of the optical waveguide.

Abstract: The present invention provides a method for producing a laminate suitable for a flexible circuit board which is free from visual defects such as wrinkles and curls that appear when a plurality of laminating materials containing a thermally fusible laminating material are formed by thermally laminating these materials each other using a thermal-press forming device, which comprises the steps of: arranging a heat resistant protective material between a pressing surface and the laminating materials, laminating the materials by thermal pressure at not lower than 200° C.

Abstract: The present invention provides a reformed polyimide fluorocarbon resin laminated film having superior adhesive property with metals.The reformed polyimide fluorocarbon resin laminated film according to the present invention is constructed by that a surface of fluorocarbon resin of polyimide fluorocarbon resin laminated film having fluorocarbon resin being laminated on a single surface or both surfaces of a polyimide film is coated with a coupling agent, or executed with corona treatment.

Abstract: A fluoro-carbon resinous laminate has a crack-resistant surface on a fluoro-carbon resinous layer thereof produced by coating a single surface or both surfaces of a plastic film with a single layer of a fluoro-carbon resinous dispersion, and a method of producing the laminate. To produce the fluoro-carbon resinous laminate, which is a minimum of 10 .mu.m in thickness, a single surface or both surfaces of a plastic film are coating with a single layer of concentration-adjusted fluoro-carbon resinous dispersion and then dried, followed by curing the resinous dispersion in a thermal treating furnace with heated atmospheric air or by adding organic solvent to the resinous dispersion, the enabling production of a fluoro-carbon resinous laminate having a surface appearance in which cracks cannot visually be identified.

Abstract: The invention solves a problem of that sufficient adhesive intensity to satisfy recent demand for high adhesive property cannot be obtained by conventional surface treatment, and provides a method of improving adhesive property of polyimide film and achieving distinctly improved effect of adhesive property. The invention further provides novel polyimide film having improved adhesive property.

Abstract: The object of the invention is to embody further thinning of a double layer flexible printed circuit board (FPC) and provide a flexible copper-coated laminate capable of producing such a novel flexible printed circuit board distinguished in bending characteristic and heat-resistant property and provide a printed circuit board using the novel flexible copper-coated laminate. To achieve the above object, novel flexible copper-coated laminates 10 and 12 according to the present invention are respectively composed by directly forming a copper layer 16 having a thickness of 10 .mu.m or less than 10 .mu.m on a single surface or both surfaces of polyimide film 14 which is composed of polyimide polymer containing modulus of initial tensile elasticity of 400 kg/mm.sup.2 or more than 400 kg/mm.sup.2, and which has a thickness of 10 .mu.m or less than 10 .mu.m.