Abstract: Provided is a glass composition including the following components in mass %: 45?SiO2?80; 10?B2O3?40; 0.1?Al2O3?20; 0.1?(MgO+CaO)?10; 0?(Li2O+Na2O+K2O)?5; and 0.1?T-SnO2?2, where T-SnO2 represents total tin oxide calculated as SnO2, wherein 0?MgO/(MgO+CaO)?0.50 is satisfied on a mass basis. This glass composition is suitable for stably manufacturing a low-permittivity glass fiber.

Abstract: In the case where the workpiece (1) is processed, the laser beam is S-polarized by an optical modulator (7). Thus, the laser beam is mainly diverted toward a workpiece (1) by a polarizer (6). An optical path through which the laser beam passes is caused to have a high light converging ability with respect to a target spot by an optical device (9). In the case where the workpiece (1) is not processed, the laser beam is P-polarized by the optical modulator (7). Thus, the laser beam is mainly diverted to a beam damper (10) side by the polarizer (6). However, the workpiece 1 is irradiated with the laser beam having leaked from the polarizer (6). An optical path through which the laser beam passes is caused to have a low light converging ability with respect to the target spot by the optical device (9).

Abstract: A laser processing method of processing an object to be processed. The object to be processed has a modified portion and a non-modified portion. A modified layer forming step forms a modified layer of the object to be processed by scanning an inner portion of the object with a condensing point of first laser light. The modified layer (i) has a processing speed with second laser light that is lower than a processing speed of a non-modified portion and (ii) is formed below the non-modified portion. A removing step removes a portion of the non-modified portion. The portion of the non-modified portion ranges from a surface of the object to the modified layer. The removing step includes irradiating the portion of the non-modified portion with the second laser light.

Abstract: In removal processing using a pulsed laser beam, processing deviation occurs in the depthwise direction to cause a processing error in a predetermined removal shape. A first pulsed laser beam L1 is a pulsed laser beam having a wavelength that exhibits transmittance to a workpiece 6, and a second pulsed laser beam L2 is a pulsed laser beam having a wavelength that exhibits absorption to the workpiece 6. The first pulsed laser beam L1 is focused into the workpiece 6, and a focal point P1 of the first pulsed laser beam L1 is scanned along the outline of a predetermined removal region R1 to form a modified portion 6A along the outline of the predetermined removal region R1. Next, removal processing is performed by scanning the second pulsed laser beam L2 in a region enclosed by the modified portion 6A.

Abstract: A manufacturing method provides an airtight container having a first plate structure, a second plate structure having a wiring formed on a surface facing the first plate structure, a frame arranged between the first plate structure and the second plate structure, a first bonding material arranged between the first plate structure and the frame, and a second bonding material arranged between the second plate structure and the frame. The method includes the steps of bonding the first plate structure and the frame by irradiating a first energy beam to the first bonding material by transmitting the first energy beam through the first plate structure, and bonding the second plate structure and the frame by irradiating a second energy beam to the second bonding material by transmitting the second energy beam through the first plate structure and the frame. The first energy beam and the second energy beam are scanned in close proximity to each other and at the same speed.

Abstract: A method for producing an airtight container includes preparing an assembly having a first substrate and a frame member, the first substrate having an electron-emitting element formed on a first surface thereof, the frame member mounted on the first surface outside an area where the electron-emitting element is formed; forming a temporary assembly having the assembly and a second substrate by bringing the second substrate into contact with the frame member via a joining member such that an inner space is formed; melting the joining member by irradiating the joining member with a laser beam transmitted through the second substrate; and solidifying the melted joining member. The laser beam is applied such that an incident direction at an irradiation position on the joining member does not include components toward the interior of the frame member while the laser beam moves relative to the temporary assembly.

Abstract: A method for producing an airtight container includes preparing an assembly having a first substrate and a frame member, the first substrate having an electron-emitting element formed on a first surface thereof, the frame member mounted on the first surface outside an area where the electron-emitting element is formed; forming a temporary assembly having the assembly and a second substrate by bringing the second substrate into contact with the frame member via a joining member such that an inner space is formed; melting the joining member by irradiating the joining member with a laser beam transmitted through the second substrate; and solidifying the melted joining member. The laser beam is applied such that an incident direction at an irradiation position on the joining member does not include components toward the interior of the frame member while the laser beam moves relative to the temporary assembly.

Abstract: Provided is a laser processing method capable of improving precision of a processing shape and degree of freedom of the processing shape. When a recess portion is formed in a substrate (W) which is an object to be processed, an inner portion of the substrate (W) is scanned with a condensing point (LS1) of modification laser light (L1) which is first laser light to form a modified layer (Wr) which becomes a boundary of a laser processing region (R1) in a position corresponding to a bottom part of the recess portion (modified layer forming step). Next, a surface (Wa) of the substrate (W) is irradiated with condensed processing laser light which is second laser light to remove and process the laser processing region (R1) defined by the modified layer (Wr), to thereby form the recess portion (removing/processing step).

Abstract: A method for producing an airtight container includes preparing an assembly having a first substrate and a frame member, the first substrate having an electron-emitting element formed on a first surface thereof, the frame member mounted on the first surface outside an area where the electron-emitting element is formed; forming a temporary assembly having the assembly and a second substrate by bringing the second substrate into contact with the frame member via a joining member such that an inner space is formed; melting the joining member by irradiating the joining member with a laser beam transmitted through the second substrate; and solidifying the melted joining member. The laser beam is applied such that an incident direction at an irradiation position on the joining member does not include components toward the interior of the frame member while the laser beam moves relative to the temporary assembly.

Abstract: Provided is a manufacturing method for an airtight container excelling in airtightness and adhesion and having small stress. An area where temperature easily rises compared to an area adjacent to an area of a part of a joint member and capable of melting the adjacent area by laser beam irradiation is provided in the area of a part of the joint member, and the laser beam irradiation is started therefrom.

Abstract: An airtight container manufacturing method capable of effectively utilizing an energy beam and improving a “takt time” as acquiring desired bonding intensity is provided. That is, a first bonding material is arranged between a first plate structure and a frame, a second bonding material is arranged between a second plate structure and the frame. The energy beam is irradiated to the first bonding material through the first plate structure to bond the first plate structure and the frame. The energy beam is irradiated to the second bonding material through the frame so that the beam transmits through the first plate structure and the surface of the frame on the side of the first plate structure, to bond the second plate structure and the frame. Such bonding processes are performed after an arrangement step.

Abstract: A laser beam emitted from a laser oscillator unit passes through a first substrate and irradiates a sealing member. The sealing member irradiated with the laser beam is heated in accordance with the absorptance and thus softens and melts. The laser beam is reflected by the sealing member and the reflection reaches a detector unit. A computing unit transmits information, such as a correction value of the laser power, to a laser controlling unit on the basis of the information from the detector unit so that the melting state of the surface of the sealing member is kept constant. In this manner, the melting state of the sealing material can be maintained in an appropriate state.