Patents by Inventor Kosuke Mizuno

Kosuke Mizuno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240133592
    Abstract: A refrigeration cycle apparatus includes a main circuit and a bypass circuit. The main circuit includes: a compressor; a first condenser; a first refrigerant-to-refrigerant heat exchanger; a first expansion device; a first branching portion; a first evaporator; a third branching; and a fourth branching portion. The bypass includes: a second expansion device; the first refrigerant-to-refrigerant heat exchanger; and a second branching portion. The second branching portion includes a liquid outflow pipe and a gas outflow pipe. The liquid outflow pipe defines one outlet for the refrigerant and is located below the gas outflow pipe. The gas outflow pipe defines another outlet for the refrigerant and is located above the liquid outflow pipe. The one outlet of the second branching portion communicates with the third branching portion. The other outlet of the second branching portion communicates with the fourth branching portion.
    Type: Application
    Filed: March 30, 2021
    Publication date: April 25, 2024
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kosuke MIYAWAKI, Yuki MIZUNO, Soshi IKEDA, Jun NISHIO, Yuji MOTOMURA, Koji FURUYA, Hiroki WASHIYAMA
  • Publication number: 20240077238
    Abstract: A refrigeration cycle device with a main circuit, a bypass circuit and a supercooling heat exchanger further includes: a controller to control an opening degree of the bypass expansion valve; a first sensor to detect a temperature at the refrigerant inflow side of the evaporator; and a second sensor to detect a pressure of the non-azeotropic mixed refrigerant flowing from the evaporator, wherein the controller controls the opening degree of the bypass expansion valve using temperatures of the evaporator, that is, the temperature at the refrigerant inflow side and a saturated gas temperature of the non-azeotropic mixed refrigerant calculated from the pressure so as to adjust a flow rate of the non-azeotropic mixed refrigerant flowing into the evaporator, to eliminate the temperature difference in the evaporator for suppressing uneven frost formation on the evaporator, and thus to prevent heat exchange performance from degrading.
    Type: Application
    Filed: February 2, 2021
    Publication date: March 7, 2024
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yuki MIZUNO, Soshi IKEDA, Kosuke MIYAWAKI, Jun NISHIO, Yuji MOTOMURA, Hiroki WASHIYAMA
  • Patent number: 5676786
    Abstract: A resin molding and a method for producing the molding in which a skin material having a first solid surface layer produced by slush-molding a pulverized mixture of a polypropylene resin and a styrene series thermoplastic elastomer which are then laminated onto a surface of a resinous core by integral molding. The skin material also has at least two additional layers, i.e., a foamed middle layer and a solid inner layer.
    Type: Grant
    Filed: October 27, 1995
    Date of Patent: October 14, 1997
    Assignee: Mitsuboshi Belting Ltd.
    Inventors: Kosuke Mizuno, Itsuki Sakai, Kenzo Tanaka, Koji Hayashi