Abstract: Provided is a sealant sheet formed as a sheet. The sealant sheet comprises an epoxy group-containing polysulfide. The epoxy group-containing polysulfide has a disulfide structure and an epoxy group in its molecule.

Abstract: Provided is a sealant sheet that shows reduced elongation during application to a target object. A laminate comprising a sealant sheet is provided. The laminate has a support layer satisfying the formula (1): E?×t?1×104 (N/m). In the formula (1), E? is the support layer's modulus (MPa) and t is the support layer's thickness (?m).

Abstract: Provided is a sealing method that uses a photo-curable sealant sheet. The sealing method provided comprises, in the following order, a step of obtaining a photo-curable sealant sheet, a step of subj ecting the sealant sheet to photoirradiation, and a step of applying the sealant sheet to a target object.

Abstract: Provided is a sealant sheet that is handled as a laminate with a release liner and can be cured by photoirradiation through the release liner. The release-linered sealant sheet has a photo-curable sealant: sheet, and a release liner placed on at least one face of the sealant sheet. The release liner has a light transmittance of 20% or higher in the wavelength range from 350 nm to 450 non.

Abstract: Provided is a sealant sheet formed in a sheet shape. The sealant sheet comprises an epoxy group-containing polysulfide polymer (AB) having two or more epoxy groups per molecule, a thiol compound (C) having two or more thiol groups per molecule, and a photobase generator (D); or a thiol group-containing polysulfide polymer (AC) having two or more thiol groups per molecule, an epoxy compound (B) having two or more epoxy groups per molecule, and a photobase generator (D).

Abstract: Provided is a sealant sheet formed in a sheet shape. The sealant sheet comprises an epoxy group-containing polysulfide polymer (AB) having two or more epoxy groups per molecule, and a thiol compound (C) having two or more thiol groups per molecule. In the sealant sheet, sulfur atoms in organic components of the sealant sheet has a weight fraction of 32.0% or higher and 36.0% or lower.

Abstract: Provided is a sealant sheet formed as a sheet. The sealant sheet comprises an epoxy group-containing polysulfide. The epoxy group-containing polysulfide has a disulfide structure and an epoxy group in its molecule.

Abstract: A solar photovoltaic system inspection apparatus sequentially applies AC inspection signals to a positive electrode and a negative electrode of a solar cell string, and is provided with: an impedance calculation unit configured to measure an indicator value when the signal is applied to the positive electrode, and an indicator value when the signal is applied to the negative electrode, the indicator values varying depending on the number of solar cell modules from the terminal to which the inspection signal was applied to a failure position; and a control unit configured to obtain the failure position based on the ratio of the indicator value measured when the inspection signal was applied to the positive electrode, to the indicator value measured when the inspection signal was applied to the negative electrode.

Abstract: A sealing sheet with separators on both surfaces is provided with a sealing sheet, a separator (A) stacked on one surface of the sealing sheet and having a thickness of 50 ?m or more, and a separator (B) stacked on the other surface of the sealing sheet.

Abstract: According to the present invention, a solar cell string has a plurality of solar cell parts connected in series. In each of the solar cell parts, a solar cell module is connected to/separated from a cable run by an optimizer. A ground fault detection device instructs the optimizer to perform switching to the connection or the separation, and, after the instruction, determines the presence/absence of a ground fault in the solar cell string.

Abstract: When a ground fault detection device detects a ground fault of a photovoltaic string, for example, while a power conditioner is in operation, a great current may be flowing in a switching section from the photovoltaic string, so that components resistant to a great current have been used for the switching section. A ground fault detection device includes a stop determination unit configured to determine whether a power converter for converting electric power from a solar battery is in stoppage, and a ground fault detector configured to detect a ground fault of the solar battery in a state where the solar battery and the power converter are electrically disconnected from each other by a disconnection unit arranged between the solar battery and the power converter when the stop determination unit determines that the power converter is in stoppage.

Abstract: A ground fault detection apparatus includes a PV current detection unit, a ground fault current detection circuit, an electric power delivery path switching switch that switches the connection of a solar cell string from a PCS side to the ground fault current detection circuit, and a control unit that, when the solar cell string is in a switchable state, switches the electric power delivery path switching switch to the ground fault current detection circuit side.

Abstract: A solar photovoltaic system inspection apparatus sequentially applies AC inspection signals to a positive electrode and a negative electrode of a solar cell string, and is provided with: an impedance calculation unit configured to measure an indicator value when the signal is applied to the positive electrode, and an indicator value when the signal is applied to the negative electrode, the indicator values varying depending on the number of solar cell modules from the terminal to which the inspection signal was applied to a failure position; and a control unit configured to obtain the failure position based on the ratio of the indicator value measured when the inspection signal was applied to the positive electrode, to the indicator value measured when the inspection signal was applied to the negative electrode.

Abstract: Provided is a masking sheet for anodizing, the masking sheet comprising a substrate having first and second faces, and a PSA layer placed on the first face side of the substrate. Here, the substrate is a non-metal substrate. The elastic modulus Et? of the masking sheet and the thickness Hs of the substrate satisfy the next relation 0.7 N/mm<Et?·Hs3.

Abstract: Provided is a masking sheet for chemical solution treatment, the masking sheet comprising a substrate having first and second faces, and a PSA layer placed on the first face side of the substrate. The masking sheet is constituted so that penetration of a chemical solution is visually detectable when inspected from the outer face of the masking sheet.

Abstract: Provided is a thermosetting sheet for sealing which is used to seal an electronic device. One surface of the sheet has a surface roughness (Ra) of 3 ?m or less before the sheet is cured.

Abstract: The present invention provides a thermally curable resin sheet for sealing a semiconductor chip having excellent reliability and storability while being reduced in warpage deformation due to the volume shrinkage of the thermally curable resin sheet, and a method for manufacturing a semiconductor package. The present invention relates to a thermally curable resin sheet for sealing a semiconductor chip, wherein an activation energy (Ea) satisfies the following formula (1), a glass transition temperature of a product thermally cured at 150° C. for 1 hour is 125° C. or higher, and a thermal expansion coefficient ? [ppm/K] of the thermally cured product at the glass transition temperature or lower and a storage modulus E? [GPa] at 25° C. of the thermally cured product satisfy the following formula (2): 30?Ea?120 [kJ/mol]??(1); and 10,000??×E??300,000 [Pa/K]??(2).

Abstract: Provided is a method for producing a semiconductor package. By this method, a periphery of a light-exposure planning region can be prevented from being exposed to light. The method is a semiconductor package producing method in which a film-formation planning surface of a cured product has a surface roughness of a predetermined value or less.