Patents by Inventor KOSUKE NISHINO
KOSUKE NISHINO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11605869Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.Type: GrantFiled: January 26, 2021Date of Patent: March 14, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takahiro Baba, Akihiro Kikuchi, Genro Kato, Kosuke Nishino, Nobuo Ikemoto
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Patent number: 11582861Abstract: An electronic device includes a circuit board and an electric element mounted on the circuit board. The electric element includes a multilayer body made of electrically insulating base materials, a transmission line portion, and connection portions. The transmission line portion and the connection portions are provided in the multilayer body. Each of the connection portions is continuous with a corresponding portion of the transmission line portion, and is connected to the circuit board by an electrically conductive bonding material. The transmission line portion other than the connection portions is not electrically connected to an electronic component on the circuit board. The electronic component not electrically connected to the electric element is disposed between the transmission line portion of the electric element and the circuit board.Type: GrantFiled: June 13, 2019Date of Patent: February 14, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takahiro Baba, Kosuke Nishino
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Patent number: 11309114Abstract: A stacked body includes a base including a plurality of insulating base material layers, a coil including a winding-shaped conductive pattern located on at least one of the plurality of the insulating base material layers, and an electrically isolated dummy pattern extending along at least a portion of the coil outside of the coil on at least one of the plurality of the insulating base material layers in a plan view, wherein the stacked body includes a step at which a thickness of the stacked body is different in a stacking direction, and the dummy pattern is located between the coil and the step at a portion defining the step where the thickness of the stacked body is larger.Type: GrantFiled: February 7, 2020Date of Patent: April 19, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Kosuke Nishino, Kuniaki Yosui
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Publication number: 20210151845Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.Type: ApplicationFiled: January 26, 2021Publication date: May 20, 2021Inventors: Takahiro BABA, Akihiro KIKUCHI, Genro KATO, Kosuke NISHINO, Nobuo IKEMOTO
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Patent number: 10944145Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.Type: GrantFiled: March 30, 2020Date of Patent: March 9, 2021Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takahiro Baba, Akihiro Kikuchi, Genro Kato, Kosuke Nishino, Nobuo Ikemoto
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Patent number: 10770773Abstract: An electronic apparatus includes a first substrate and a second substrate mounted on the first substrate and having a smaller area than the first substrate. The second substrate extends in a longitudinal direction and has a planar or substantially planar shape with a uniform or substantially uniform width across all portions of the second substrate in the longitudinal direction. The second substrate includes a signal line, and a high-frequency transmission line including the signal line, and further includes an input/output pad electrically connected to the signal line, and an auxiliary pad arranged between two input/output pads, on the mounting surface of the second substrate. The first substrate includes lands each connected to the input/output pad and the auxiliary pad. The input/output pad and the auxiliary pad are each soldered on each of the lands of the first substrate and, thus, the second substrate is surface-mounted on the first substrate.Type: GrantFiled: January 24, 2020Date of Patent: September 8, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takahiro Baba, Nobuo Ikemoto, Kosuke Nishino, Jun Sasaki
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Publication number: 20200227806Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.Type: ApplicationFiled: March 30, 2020Publication date: July 16, 2020Inventors: Takahiro BABA, Akihiro KIKUCHI, Genro KATO, Kosuke NISHINO, Nobuo IKEMOTO
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Publication number: 20200176164Abstract: A stacked body includes a base including a plurality of insulating base material layers, a coil including a winding-shaped conductive pattern located on at least one of the plurality of the insulating base material layers, and an electrically isolated dummy pattern extending along at least a portion of the coil outside of the coil on at least one of the plurality of the insulating base material layers in a plan view, wherein the stacked body includes a step at which a thickness of the stacked body is different in a stacking direction, and the dummy pattern is located between the coil and the step at a portion defining the step where the thickness of the stacked body is larger.Type: ApplicationFiled: February 7, 2020Publication date: June 4, 2020Inventors: Kosuke NISHINO, Kuniaki YOSUI
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Publication number: 20200161734Abstract: An electronic apparatus includes a first substrate and a second substrate mounted on the first substrate and having a smaller area than the first substrate. The second substrate extends in a longitudinal direction and has a planar or substantially planar shape with a uniform or substantially uniform width across all portions of the second substrate in the longitudinal direction. The second substrate includes a signal line, and a high-frequency transmission line including the signal line, and further includes an input/output pad electrically connected to the signal line, and an auxiliary pad arranged between two input/output pads, on the mounting surface of the second substrate. The first substrate includes lands each connected to the input/output pad and the auxiliary pad. The input/output pad and the auxiliary pad are each soldered on each of the lands of the first substrate and, thus, the second substrate is surface-mounted on the first substrate.Type: ApplicationFiled: January 24, 2020Publication date: May 21, 2020Inventors: Takahiro BABA, Nobuo IKEMOTO, Kosuke NISHINO, Jun SASAKI
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Patent number: 10644370Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.Type: GrantFiled: July 17, 2019Date of Patent: May 5, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takahiro Baba, Akihiro Kikuchi, Genro Kato, Kosuke Nishino, Nobuo Ikemoto
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Patent number: 10600544Abstract: A stacked body includes a base including insulating base material layers made of thermoplastic resin and stacked, a circuit including a conductive pattern located on the insulating base material layers, and a dummy pattern electrically isolated from the circuit and extending along a portion of the circuit outside of the circuit on the insulating base material layers on which the conductive pattern is located in a plan view. The conductive pattern includes a linear portions at an outermost side of the circuit in a plan view. A bent portion or a wide portion, which has a larger width than the other linear portions in a direction perpendicular or substantially perpendicular to a direction in which a linear portion extends, in a plan view, is located on at least one of the linear portion of the conductive pattern and the dummy pattern extending along the linear portion.Type: GrantFiled: October 30, 2018Date of Patent: March 24, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Kosuke Nishino, Kuniaki Yosui
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Patent number: 10594013Abstract: An electronic apparatus includes a first substrate and a second substrate mounted on the first substrate and having a smaller area than the first substrate. The second substrate extends in a longitudinal direction and has a planar or substantially planar shape with a uniform or substantially uniform width across all portions of the second substrate in the longitudinal direction. The second substrate includes a signal line, and a high-frequency transmission line including the signal line, and further includes an input/output pad electrically connected to the signal line, and an auxiliary pad arranged between two input/output pads, on the mounting surface of the second substrate. The first substrate includes lands each connected to the input/output pad and the auxiliary pad. The input/output pad and the auxiliary pad are each soldered on each of the lands of the first substrate and, thus, the second substrate is surface-mounted on the first substrate.Type: GrantFiled: March 6, 2019Date of Patent: March 17, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takahiro Baba, Nobuo Ikemoto, Kosuke Nishino, Jun Sasaki
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Patent number: 10577487Abstract: An impact resistance is improved and a molding shrinkage percentage is reduced. A thermoplastic resin composition contains: an impact-resistant styrene resin composition which contains polystyrene as a main component and a dispersed rubber phase and in which a volume fraction of the dispersed rubber phase 12 is less than 30%; dispersed phases of elastomer; and particles of a filler. The dispersed phases of the elastomer contains, as a main component, a styrene-butadiene copolymer serving as a linear copolymer constructed by a triblock consisting of a butadiene block and styrene blocks coupled with both ends of the butadiene block.Type: GrantFiled: April 28, 2017Date of Patent: March 3, 2020Assignee: CANON KABUSHIKI KAISHAInventors: Takahiro Kojima, Daisuke Kurihara, Kosuke Nishino
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Patent number: 10566135Abstract: An electromagnet includes a stacked body formed by stacking and thermocompression-bonding a plurality of insulating base materials having thermoplasticity and including wound linear conductors which define a spiral coil. In a region of each of the insulating base materials surrounded by each of the wound linear conductors, each of low mobility members is formed of a material having mobility lower than that of the insulating base materials at a temperature upon thermocompression-bonding of the insulating base materials.Type: GrantFiled: December 20, 2018Date of Patent: February 18, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Kosuke Nishino, Kuniaki Yosui
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Patent number: 10508192Abstract: In order to suppress such a situation that polyglyceryl fatty acid ester bleeds out at the time of melting of a thermoplastic resin while improving an impact resistance, a thermoplastic resin composition contains a high impact polystyrene, a calcium carbonate as a filler, and polyglyceryl fatty acid ester as a dispersing agent, and a fatty acid constructing the polyglyceryl fatty acid ester is an unsaturated fatty acid.Type: GrantFiled: April 27, 2017Date of Patent: December 17, 2019Assignee: CANON KABUSHIKI KAISHAInventors: Daisuke Kurihara, Takahiro Kojima, Kosuke Nishino
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Publication number: 20190341665Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.Type: ApplicationFiled: July 17, 2019Publication date: November 7, 2019Inventors: Takahiro BABA, Akihiro KIKUCHI, Genro KATO, Kosuke NISHINO, Nobuo IKEMOTO
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Publication number: 20190297722Abstract: An electronic device includes a circuit board and an electric element mounted on the circuit board. The electric element includes a multilayer body made of electrically insulating base materials, a transmission line portion, and connection portions. The transmission line portion and the connection portions are provided in the multilayer body. Each of the connection portions is continuous with a corresponding portion of the transmission line portion, and is connected to the circuit board by an electrically conductive bonding material. The transmission line portion other than the connection portions is not electrically connected to an electronic component on the circuit board. The electronic component not electrically connected to the electric element is disposed between the transmission line portion of the electric element and the circuit board.Type: ApplicationFiled: June 13, 2019Publication date: September 26, 2019Inventors: Takahiro BABA, Kosuke NISHINO
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Patent number: 10424824Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.Type: GrantFiled: January 17, 2017Date of Patent: September 24, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takahiro Baba, Akihiro Kikuchi, Genro Kato, Kosuke Nishino, Nobuo Ikemoto
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Publication number: 20190198960Abstract: An electronic apparatus includes a first substrate and a second substrate mounted on the first substrate and having a smaller area than the first substrate. The second substrate extends in a longitudinal direction and has a planar or substantially planar shape with a uniform or substantially uniform width across all portions of the second substrate in the longitudinal direction. The second substrate includes a signal line, and a high-frequency transmission line including the signal line, and further includes an input/output pad electrically connected to the signal line, and an auxiliary pad arranged between two input/output pads, on the mounting surface of the second substrate. The first substrate includes lands each connected to the input/output pad and the auxiliary pad. The input/output pad and the auxiliary pad are each soldered on each of the lands of the first substrate and, thus, the second substrate is surface-mounted on the first substrate.Type: ApplicationFiled: March 6, 2019Publication date: June 27, 2019Inventors: Takahiro BABA, Nobuo IKEMOTO, Kosuke NISHINO, Jun SASAKI
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Patent number: 10331076Abstract: A process cartridge including a first frame member molded by pouring a resin from a gate; a conductive sheet adhered integrally to a sheet adhering portion of the first frame member by molding of the resin; and a second frame member configured to define a toner storage portion by being coupled with the first frame member, wherein, the first frame member includes a bent portion at the sheet adhering portion, and a portion of the first frame member different in thickness is provided at an adjacent position to the adhering portion.Type: GrantFiled: September 14, 2017Date of Patent: June 25, 2019Assignee: CANON KABUSHIKI KAISHAInventor: Kosuke Nishino