Patents by Inventor Kosuke Nishio
Kosuke Nishio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240292535Abstract: A multilayer board in which interlayer connection conductors include one or more first interlayer connection conductors in a first region and passing through any of a first insulator layer, a second insulator layer, and a third insulator layer in an up-down direction and a second interlayer connection conductor located in a second region and passing through the third insulator layer in the up-down direction. The second interlayer connection conductor is joined to a conductor and a second conductor layer. An area of the second interlayer connection conductor viewed in the up-down direction is larger than a minimum value of areas of the one or more first interlayer connection conductors viewed in the up-down direction.Type: ApplicationFiled: May 1, 2024Publication date: August 29, 2024Inventor: Kosuke NISHIO
-
Publication number: 20240275015Abstract: A transmission line includes an insulator including at least one insulator layer, and first and second conductor patterns located in or on the insulator layer and arranged at positions different from each other in a thickness direction of the insulator layer. The first conductor pattern includes a first signal line and a second signal line each extending along a signal transmission direction. The second conductor pattern includes a first counter electrode and a second counter electrode. The first counter electrode overlaps the first signal line but does not overlap the second signal line when viewed in the thickness direction. The second counter electrode overlaps the second signal line but does not overlap the first signal line when viewed in the thickness direction.Type: ApplicationFiled: April 17, 2024Publication date: August 15, 2024Inventor: Kosuke NISHIO
-
Patent number: 12063738Abstract: A multilayer substrate includes a multilayer body in which insulating layers are laminated in a laminating direction, a front electrode that is provided on a front surface side of a first insulating layer which is positioned on a front surface side of the multilayer body among the insulating layers, a first internal electrode that is provided on an opposite side to the front electrode with the first insulating layer interposed therebetween, and a first interlayer connection conductor that electrically connects the front electrode and the first internal electrode with each other. The first interlayer connection conductor includes a front side connection surface that is electrically connected with the front electrode and a back side connection surface that is electrically connected with the first internal electrode.Type: GrantFiled: August 29, 2022Date of Patent: August 13, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Kosuke Nishio, Kazuya Soda
-
Patent number: 12053204Abstract: A medical device is disclosed for grinding substance inside a body lumen. The medical device includes a rotatable tubular drive shaft; a treatment member connected to the drive shaft so that rotation of the drive shaft results in rotation of the treatment member; an outer sheath configured to house the drive shaft; a handle located at a proximal portion of the drive shaft and at a proximal portion of the outer sheath; a guide wire lumen tube disposed within the tubular drive shaft and the treatment member, the guide wire lumen tube having a guide wire lumen; a distal end of the guide wire lumen tube located at a distal end of the treatment member or distal to the distal end of the treatment member; and a proximal portion of the guide wire lumen tube configured to penetrate a wall of the handle.Type: GrantFiled: November 27, 2019Date of Patent: August 6, 2024Assignee: TERUMO KABUSHIKI KAISHAInventors: Kosuke Nishio, Junichi Kobayashi, Tomonori Hatta, Taiga Nakano
-
Patent number: 12052818Abstract: A resin multilayer substrate includes a multilayer body including resin base-material layers laminated in a thickness direction and a circuit conductor therein, an end-surface ground conductor provided directly on each end surface of the multilayer body in the thickness direction, an adhesion layer on a side surface of the multilayer body, and a side-surface ground conductor on the adhesion layer. The end-surface and side-surface ground conductors are made of a ground conductor material with a coefficient of thermal expansion whose difference from a coefficient of thermal expansion of the resin base-material layers in a plane direction is smaller than a difference from a coefficient of thermal expansion of the resin base-material layers in the thickness direction. The adhesion layer is made of a material with higher adhesiveness to the side surface of the multilayer body than adhesiveness of the ground conductor material.Type: GrantFiled: August 30, 2022Date of Patent: July 30, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Atsushi Kasuya, Tomohiko Naruoka, Noriaki Okuda, Kosuke Nishio, Nobuo Ikemoto
-
Publication number: 20240055754Abstract: An antenna element includes an insulative substrate including first and second main surfaces arranged in an up-down direction. At least one antenna conductor layer is provided on the first main surface of the insulative substrate. At least one insulative substrate non-forming region is provided between the insulative substrate and the antenna conductor layer in the up-down direction. An insulator layer does not exist in the at least one insulative substrate non-forming region. When seen in the up-down direction, all of an outer boundary of at least one antenna conductor overlaps the at least one insulative substrate non-forming region and is not in contact with the insulative substrate. At least one of the at least one insulative substrate non-forming region includes a void.Type: ApplicationFiled: October 23, 2023Publication date: February 15, 2024Inventors: Nobuo IKEMOTO, Kosuke NISHIO, Kaoru SUDO, Keiichi ICHIKAWA, Nobuyuki TENNO
-
Publication number: 20240047865Abstract: An antenna element includes a first opening including an annular outer boundary in an antenna conductor layer. A first insulative substrate non-forming region is provided between an insulative substrate and the antenna conductor layer in an up-down direction. The insulative substrate does not exist in the first insulative substrate non-forming region. The outer boundary of the first opening overlaps one or more first insulative substrate non-forming regions and is not in contact with the insulative substrate. The first insulative substrate non-forming region is a first void, and a low dielectric constant material having a lower dielectric constant than that of a material of the insulative substrate or a high dielectric constant material having a higher dielectric constant than that of the material of the insulative substrate is provided in the first insulative substrate non-forming region.Type: ApplicationFiled: October 19, 2023Publication date: February 8, 2024Inventors: Nobuo IKEMOTO, Kosuke NISHIO, Kaoru SUDO, Keiichi ICHIKAWA, Nobuyuki TENNO
-
Publication number: 20240016513Abstract: A medical device insertable into a living body lumen includes a drive shaft that rotates in a predetermined direction of rotation in response to a proximal side driving force to transmit a rotational force in a distal direction. The drive shaft includes: an inner coil of plural wires wound side-by-side in a circumferential direction of the drive shaft; and an outer coil of plural wires wound side-by-side in the circumferential direction of the drive shaft and surrounding the inner coil. The inner coil wires are wound in the predetermined direction of rotation in the distal direction as viewed from the proximal side, and the outer coil wires are wound in a direction opposite the predetermined direction of rotation n the distal direction as viewed from the proximal side. The number of wires constituting the inner coil is smaller than the number of wires constituting the outer coil.Type: ApplicationFiled: September 21, 2023Publication date: January 18, 2024Applicant: TERUMO KABUSHIKI KAISHAInventor: Kosuke NISHIO
-
Publication number: 20240008168Abstract: When viewed in an up-down direction, a first line-shaped reference conductor layer extends along a first signal conductor layer such that portions thereof overlap. When viewed in the up-down direction, the first line-shaped reference conductor layer meanders such that one or more first projecting portions projecting from the first signal conductor layer in a first orthogonal direction and one or more second projecting portions projecting from the first signal conductor layer in a second orthogonal direction alternate in a transmission direction. A section of at least one or more first pairs of projecting portions excluding both ends thereof is not connected to a conductor layer other than one or more of the one or more first projecting portions and one or more of the one or more second projecting portions included in the at least one or more first pairs of projecting portions.Type: ApplicationFiled: July 24, 2023Publication date: January 4, 2024Inventor: Kosuke NISHIO
-
Publication number: 20230371973Abstract: A medical device and can remove an object inside a biological lumen while allowing a positional change of the device inside the biological lumen. The medical device includes a drive shaft, an outer tube accommodating the drive shaft, a cutting portion fixed to a distal portion of the drive shaft, and a hub unit housing proximal portions of the drive shaft and the outer tube. The hub unit has an operation unit fixed to the outer surface of the outer tube to rotate the outer tube, a first support portion rotatably supporting the operation unit, a first housing having an aspiration port for discharging fluid to outside, and causing communication of an aspiration lumen of the outer tube with the aspiration port, and a first seal between the first housing and the outer tube. The first support portion and the first seal are disposed in parallel along an axial direction.Type: ApplicationFiled: August 1, 2023Publication date: November 23, 2023Applicant: TERUMO KABUSHIKI KAISHAInventors: Taiga NAKANO, Junichi KOBAYASHI, Tomonori HATTA, Kosuke NISHIO
-
Publication number: 20230345624Abstract: A multilayer substrate includes a multilayer body including insulation layers stacked on top of one another in an up-and-down direction. The insulation layers include a porous insulation layer. The multilayer substrate includes a first region and a second region. A dimension of the porous insulation layer in the up-and-down direction is smaller in the first region than in the second region. An average void size of the porous insulation layer is smaller in the first region than in the second region, and/or the porous insulation layer is denser in the first region than in the second region.Type: ApplicationFiled: July 3, 2023Publication date: October 26, 2023Inventors: Nobuo IKEMOTO, Noriaki OKUDA, Kosuke NISHIO
-
Publication number: 20230327309Abstract: A transmission line includes an element body, a signal conductor layer, and a ground conductor layer. The element body includes an insulator layer. The signal conductor layer is below the insulator layer, and the ground conductor layer is above the insulator layer in an element body up-down direction. A hole is located at a surface of the insulator layer and penetrates the insulator layer in the element body up-down direction. At least a portion of the hole overlaps the signal conductor layer when viewed in the element body up-down direction. The hole extends between a left hole-defining surface and a right hole-defining surface. In a cross section orthogonal to the element body front-back direction, the left hole-defining surface includes a left upper end and a left lower end in the element body left-right direction, and the right hole-defining surface includes a right upper end and a right lower end in the element body left-right direction.Type: ApplicationFiled: May 24, 2023Publication date: October 12, 2023Inventors: Nobuo IKEMOTO, Noriaki OKUDA, Kosuke NISHIO
-
Publication number: 20230319980Abstract: A circuit board includes one or more insulator layers, and upper and lower principal surfaces, and conductor layers in or on the substrate body. The conductor layers include a pair of first and second conductor layers on one of the insulator layers. Each of the pairs of the first and second conductor layers includes a first proximity section in which the first and second conductor layers are aligned in an orthogonal direction to an extending direction of the first conductor layer. A distance between the first and second conductor layers in the first proximity section is defined as a proximity distance. Most proximate first and second conductor layers are defined as the first and second conductor layers with a smallest proximity distance and are located on an upper principal surface of a first insulator layer of the one or more insulating layers.Type: ApplicationFiled: June 2, 2023Publication date: October 5, 2023Inventor: Kosuke NISHIO
-
Publication number: 20230299452Abstract: In a transmission line, a multilayer body includes a hollow portion above a signal conductor layer and below a ground conductor layer and overlapping the ground conductor layer when viewed in an up-down direction, and a spacer facing the hollow portion. In a cross section orthogonal to a front-back direction, an overlapping region is a region in the hollow portion in which the hollow portion overlaps the spacer in the up-down direction. In a cross section orthogonal to the front-back direction, a non-overlapping region is a region in the hollow portion in which the hollow portion does not overlap the spacer in the up-down direction. A length of the hollow portion in the up-down direction in the overlapping region is shorter than a length of the hollow portion in the up-down direction in the non-overlapping region.Type: ApplicationFiled: May 22, 2023Publication date: September 21, 2023Inventors: Nobuo IKEMOTO, Noriaki OKUDA, Kosuke NISHIO, Keisuke ARAKI
-
Publication number: 20230290537Abstract: In a transmission line, a signal conductor layer extends in a front-back direction orthogonal to an up-down direction. A ground conductor layer is above the signal conductor layer. When viewed in a first orthogonal direction, first hollow portions are arranged in the front-back direction in a first direction of the signal conductor layer, and second hollow portions are arranged in the front-back direction in a second direction of the signal conductor layer. Each of regions between adjacent first hollow portions in the front-back direction is a first region. Each of regions between adjacent second hollow portions in the front-back direction is a second region. Each of the first hollow portions overlaps with a corresponding one of the second regions when viewed in a second orthogonal direction. Each of the second hollow portions overlaps with a corresponding one of the first regions when viewed in the second orthogonal direction.Type: ApplicationFiled: May 17, 2023Publication date: September 14, 2023Inventors: Nobuo IKEMOTO, Noriaki OKUDA, Kosuke NISHIO, Masanori OKAMOTO
-
Publication number: 20230291086Abstract: In a transmission line, a hollow portion overlaps a first ground conductor layer in an up-down direction. In a first orthogonal direction, the hollow portion includes a first portion extending in a second orthogonal direction of a signal conductor layer. In the first portion, a portion at which a width of the first portion in the second orthogonal direction has a first portion maximum width value is a first portion maximum width portion. A portion at which the width of the first portion in the second orthogonal direction has a first portion minimum width value is a first portion minimum width portion. A portion at which the width of the first portion in the second orthogonal direction has a first portion intermediate width value is a first portion intermediate width portion located between the first portion maximum width portion and the first portion minimum width portion in the front-back direction.Type: ApplicationFiled: May 17, 2023Publication date: September 14, 2023Inventors: Nobuo IKEMOTO, Noriaki OKUDA, Kosuke NISHIO, Masanori OKAMOTO, Kentarou KAWABE
-
Patent number: 11751898Abstract: A medical device and can remove an object inside a biological lumen while allowing a positional change of the device inside the biological lumen. The medical device includes a drive shaft, an outer tube accommodating the drive shaft, a cutting portion fixed to a distal portion of the drive shaft, and a hub unit housing proximal portions of the drive shaft and the outer tube. The hub unit has an operation unit fixed to the outer surface of the outer tube to rotate the outer tube, a first support portion rotatably supporting the operation unit, a first housing having an aspiration port for discharging fluid to outside, and causing communication of an aspiration lumen of the outer tube with the aspiration port, and a first seal between the first housing and the outer tube. The first support portion and the first seal are disposed in parallel along an axial direction.Type: GrantFiled: September 8, 2020Date of Patent: September 12, 2023Assignee: TERUMO KABUSHIKI KAISHAInventors: Taiga Nakano, Junichi Kobayashi, Tomonori Hatta, Kosuke Nishio
-
Publication number: 20230284381Abstract: A multilayer substrate includes laminated insulating layers each including a main surface on which a conductor is provided. The multilayer substrate also includes a signal line defined by the conductors, and a shield conductor defined by the conductors. The shield conductor includes an opening and a portion overlapping the signal line in plan view. At least one of the insulating layers includes a void that communicates with the opening and that is larger than the opening in plan view.Type: ApplicationFiled: May 12, 2023Publication date: September 7, 2023Inventor: Kosuke NISHIO
-
Publication number: 20230239996Abstract: A board main body includes first and second resin layers contacting each other and including thermoplastic resin, a first signal conductor layer on an upper main surface of the second resin layer, an overlapping region in which the first and second resin layers are present when viewed in an up-down direction, and a non-overlapping region in which the first resin layer is not present and the second resin layer is present when viewed in the up-down direction. The first signal conductor layer includes a first curved portion in which the first signal conductor layer is curved in the up-down direction such that the first signal conductor layer in the first non-overlapping region is above the first signal conductor layer in the overlapping region. The first signal conductor layer is electrically connectable to an element on the board main body in the first non-overlapping region.Type: ApplicationFiled: March 29, 2023Publication date: July 27, 2023Inventor: Kosuke NISHIO
-
Publication number: 20230156910Abstract: A circuit board includes a board body, a signal conductor, a power supply conductor, and a first reference conductor. The signal conductor is in the board body and a high frequency signal is transmitted through the signal conductor. The power supply conductor is in the board body and is connected to a power supply potential. The power supply conductor extends along at least a portion of the signal conductor. The first reference conductor is in the board body and is insulated from the signal conductor and the power supply conductor.Type: ApplicationFiled: January 19, 2023Publication date: May 18, 2023Inventors: Kosuke KIKUCHI, Kosuke NISHIO