Abstract: A semiconductor device includes a semiconductor element, a package sealing the semiconductor element, and leads for passing signals between the semiconductor element and an external device. Each of the leads has an inner-lead part sealed within the package and connected with the semiconductor element, and an outer-lead part which extends outward from the package toward a top of the package, and is to be connected to the external device. The outer-lead part includes a first-port part at a lower side of the package, and a second-port part at an upper side of the package.

Abstract: A semiconductor device is adapted to be mounted on a circuit substrate in an approximate vertical position. The semiconductor device includes a semiconductor chip, a stage having a first surface and a second surface opposite to the first surface, where the semiconductor chip is mounted on the first surface, a resin package encapsulating the semiconductor chip, where the resin package has upper and lower surfaces and side surfaces, a plurality of leads respectively having one end electrically connected to the semiconductor chip and another end extending downwardly from the lower surface of the resin package, and an upper extension, provided on the stage, extending upwardly from the upper surface of the resin package.

Abstract: A semiconductor device includes a semiconductor chip having electrode pads on the semiconductor chip, the electrode pads including a predetermined electrode. A plurality of leads are electrically connected to the electrode pads on the semiconductor chip, the leads including a predetermined lead electrically connected to the predetermined electrode. A resin package encloses the semiconductor chip and partially encloses the leads. A bypass lead portion electrically connects one of the leads, not adjacent to the predetermined electrode, to a location adjacent to the predetermined electrode, the bypass lead portion being enclosed in the resin package. A supporting lead supports the bypass lead portion such that the supporting lead prevents a deformation of the bypass lead portion, the supporting lead being enclosed in the resin package.