Patents by Inventor Kosuke SHIMOZURU

Kosuke SHIMOZURU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10237971
    Abstract: A wiring board assembly (1) includes: a flexible printed wiring board (2) which includes at least an insulating substrate (5) including a through-hole (53), and wiring patterns (61) and (62) provided on the insulating substrate (5) and extending to peripheral edge portions (531n) and (532n) of the through-hole (53); a metal reinforcing plate (3) attached to the flexible printed wiring board (2) and facing the through-hole (53); and a solder connection portion (4) covering an inner wall surface (534) of the through-hole (53) and electrically connecting the wiring patterns (61) and (62) to the metal reinforcing plate (3).
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: March 19, 2019
    Assignee: FUJIKURA LTD.
    Inventors: Ryotaro Takagi, Kosuke Shimozuru, Yuji Inatani
  • Publication number: 20160205765
    Abstract: A wiring board assembly (1) includes: a flexible printed wiring board (2) which includes at least an insulating substrate (5) including a through-hole (53), and wiring patterns (61) and (62) provided on the insulating substrate (5) and extending to peripheral edge portions (531n) and (532n) of the through-hole (53); a metal reinforcing plate (3) attached to the flexible printed wiring board (2) and facing the through-hole (53); and a solder connection portion (4) covering an inner wall surface (534) of the through-hole (53) and electrically connecting the wiring patterns (61) and (62) to the metal reinforcing plate (3).
    Type: Application
    Filed: September 30, 2014
    Publication date: July 14, 2016
    Applicant: FUJIKURA LTD.
    Inventors: Ryotaro TAKAGI, Kosuke SHIMOZURU, Yuji INATANI