Abstract: Provided is a concentration measurement device that can be miniaturized without using an optical fiber. The concentration measurement device including a measurement cell having a gas flow path and an optical path intersecting the gas flow path; a light source for emitting light inside the optical path, the light source 14 being installed at one end of the optical path; a first photodetector for detecting a light emitted from the light source as a reference light, the first photodetector being installed at a side of the light source and rearward from a distal end of the light source in a light emitting direction along an optical axis of the light source; a second photodetector for detecting a light emitted from the light source for measuring light absorption, the second photodetector being installed at another end of the optical path.

Abstract: A diaphragm valve includes a body (3) having a flow path (2), a seat (4) formed in the flow path (2), a metal diaphragm (5) for opening and closing the flow path (2), a pair of clamping parts (6) and (7) for claiming peripheral edge portions of the metal diaphragm (5) to fix the metal diaphragm (5) to the body (3), and an actuator (8) for abutting the metal diaphragm (5) to the seat (4) or separating the metal diaphragm from the seat (4), wherein a fluorine resin coating is formed on a seat side surface (5a) of the metal diaphragm (5) at least in a contact region (B-A) with the seat (4) in a region (C) surrounded by a clamping region (D-C) between the seat side surface (5a) and one of the pair of clamping portions (6, 7), excluding the clamping region (D-C).

Abstract: A diaphragm valve includes a body 3 having a flow path 2 formed therein, a sheet 4 formed in the flow path 2, a metal diaphragm 5 for opening and closing the flow path 2 by abutting on or separating from the sheet 4, a pair of clamping parts 6 and 7 for claiming peripheral edge portions of both side surfaces of the metal diaphragm 5 respectively to fix the metal diaphragm 5 to the body 3, and an actuator 8 for abutting the metal diaphragm 5 on the sheet 4 or separating the metal diaphragm from the sheet 4, wherein a fluorine resin coating is formed on a sheet side surface 5a of the metal diaphragm 5 in a region excluding a clamping region D-C between the sheet side surface 5a and the clamping part 7, and at least in a contact region B-A with the sheet 4 in a region C surrounded by the clamping region D-C.

Abstract: The present invention is to provide a surface protecting film for a semiconductor wafer which can prevent breakage of the semiconductor wafer even when the semiconductor wafer is thinned to not more than 200 ?m, and a method of protecting the semiconductor wafer using the protecting film. The present invention relates to a surface protecting adhesive film for a semiconductor wafer comprising a base film having an adhesive layer formed on one surface thereof, wherein the base film comprises a layer (A) having a storage elastic modulus of from 1×107 Pa to 1×109 Pa at a temperature range of from 20° C. to 180° C.