Patents by Inventor Kosuke Sugiura

Kosuke Sugiura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240130656
    Abstract: A biosignal electrode that includes a substrate having first and second opposed main surfaces; a conductive material pattern on the first main surface of the substrate, the conductive material pattern defining a plurality of open spaces extending through the conductive material pattern and exposing the first surface of the substrate therethrough; and a biocompatible glue material within the plurality of open spaces of the conductive material pattern.
    Type: Application
    Filed: October 3, 2023
    Publication date: April 25, 2024
    Inventors: Koji YOSHIDA, Takeshi Torita, Ichitaro Okamura, Kosuke Sugiura, Mika Fujiwaki
  • Patent number: 11851289
    Abstract: A conveyance system discriminates the front and back of a frame wafer without human intervention. A frame is partially formed asymmetrically with respect to a predetermined center line when viewed in a direction orthogonal to a surface of a wafer. The conveyance system includes a hand configured to hold the frame so that the frame extends in a predetermined virtual plane, a first sensor configured to detect a portion of the frame held on the hand and located in a predetermined first region in the virtual plane, a second sensor configured to detect a portion of the frame held on the hand and located in a second region opposite to the first region across the center line, and a controller configured to determine the front and back of the frame wafer based on a detection result obtained by the first sensor and a detection result obtained by the second sensor.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: December 26, 2023
    Assignee: Sinfonia Technology Co., Ltd.
    Inventors: Hiroaki Nakamura, Toshihiro Kawai, Kosuke Sugiura, Gengoro Ogura, Yasushi Taniyama
  • Publication number: 20230242407
    Abstract: Electroconductive two-dimensional particles composed of a layered material having one or more layers, wherein each of the one or more layers is a layer body represented by MmXn (M represents at least one group 3, 4, 5, 6 or 7 metal; X represents a carbon atom, a nitrogen atom, or a combination thereof; n represents a number from 1 to 4; m represents a number that is larger than n but not larger than 5), and a modification or terminal T (T represents at least one atom or group selected from a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom and a hydrogen atom) is present on the surface of the layer body; the Li content is from 0.0001% by mass to 0.0020% by mass; and the average value of the lengths of two-dimensional surfaces of the electroconductive two-dimensional particles is from 1.0 ?m to 20 ?m.
    Type: Application
    Filed: April 12, 2023
    Publication date: August 3, 2023
    Inventors: Masashi KOYANAGI, Takeshi TORITA, Masanori ABE, Kosuke SUGIURA, Akimaro YANAGIMACHI, Yuusuke OGAWA
  • Patent number: 11710652
    Abstract: A transport system for transporting a plurality of objects between a storage container configured to store the plurality of objects and a processing apparatus configured to collectively process the plurality of objects held on a tray, including a mounting part on which the storage container is mounted, a stage on which the plurality of objects are mounted, a tray support part configured to support the tray, a first transport device configured to transport the plurality of objects between the storage container mounted on the mounting part and the stage, and a second transport device configured to transport the plurality of objects between the stage and the tray supported by the tray support part.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: July 25, 2023
    Assignee: Sinfonia Technology Co., Ltd.
    Inventors: Toshihiro Kawai, Hiroaki Nakamura, Gengoro Ogura, Kosuke Sugiura, Yasushi Taniyama
  • Publication number: 20230165500
    Abstract: A biosignal sensing that includes a conductive composite material containing particles of a layered material including one or plural layers and a polymer, the conductive composite material defining a contact surface with a subject, wherein the one or plural layers include a layer body comprising Ti3C2 and having a modifier or terminal T existing on a surface of the layer body, wherein the modifier or terminal T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, or a hydrogen atom, and the polymer is a hydrophilic polymer having a polar group, and the polar group is a group that forms a hydrogen bond with the modifier or terminal T of the layer.
    Type: Application
    Filed: January 27, 2023
    Publication date: June 1, 2023
    Inventor: Kosuke SUGIURA
  • Publication number: 20230154642
    Abstract: A conductive composite material that includes: particles of a layered material including one or plural layers, wherein the one or plural layers include a layer body represented by: MmXn, where M is at least one metal of Group 3, 4, 5, 6, or 7, X is a carbon atom, a nitrogen atom, or a combination thereof, n is not less than 1 and not more than 4, m is more than n but not more than 5, and a modifier or terminal T exists on a surface of the layer body, where T is at least one of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, or a hydrogen atom; and a polymer material that includes a hydrogen acceptor and a hydrogen donor, a ratio of the particles of the layered material is more than 19% by volume but not more than 95% by volume.
    Type: Application
    Filed: January 23, 2023
    Publication date: May 18, 2023
    Inventors: Hiroyuki MORITA, Kosuke SUGIURA, Masanori ABE, Akari SEKO
  • Publication number: 20230033168
    Abstract: A conveyance system discriminates the front and back of a frame wafer without human intervention. A frame is partially formed asymmetrically with respect to a predetermined center line when viewed in a direction orthogonal to a surface of a wafer. The conveyance system includes a hand configured to hold the frame so that the frame extends in a predetermined virtual plane, a first sensor configured to detect a portion of the frame held on the hand and located in a predetermined first region in the virtual plane, a second sensor configured to detect a portion of the frame held on the hand and located in a second region opposite to the first region across the center line, and a controller configured to determine the front and back of the frame wafer based on a detection result obtained by the first sensor and a detection result obtained by the second sensor.
    Type: Application
    Filed: September 23, 2020
    Publication date: February 2, 2023
    Applicant: Sinfonia Technology Co., Ltd.
    Inventors: Hiroaki Nakamura, Toshihiro Kawai, Kosuke Sugiura, Gengoro Ogura, Yasushi Taniyama
  • Publication number: 20220336245
    Abstract: There is provided a technique capable of efficiently transporting a plurality of objects between a storage container configured to store the plurality of objects and a processing apparatus configured to collectively process the plurality of objects. A transport system 1 for transporting a plurality of objects between a storage container 9 configured to store the plurality of objects and a processing apparatus 2 configured to collectively process the plurality of objects held on a tray 8, includes: a mounting part 31 on which the storage container 9 is mounted; a stage 41 on which the plurality of objects are mounted; a tray support part 51 configured to support the tray 8; a first transport device 44 configured to transport the plurality of objects between the storage container 9 mounted on the mounting part 31 and the stage 41; and a second transport device 53 configured to transport the plurality of objects between the stage 41 and the tray 8 supported by the tray support part 51.
    Type: Application
    Filed: September 23, 2020
    Publication date: October 20, 2022
    Applicant: Sinfonia Technology Co., Ltd.
    Inventors: Toshihiro Kawai, Hiroaki Nakamura, Gengoro Ogura, Kosuke Sugiura, Yasushi Taniyama
  • Patent number: 11212906
    Abstract: A laminated substrate that includes a substrate body having a plurality of laminated ceramic layers containing a first glass; a wiring conductor within the substrate body and made from silver, copper, a silver alloy, or a copper alloy; and a thermal conductor within or on a main surface of the substrate body. The thermal conductor is at least one of (1) a thermal via penetrating a part of a first ceramic layer of the plurality of laminated ceramic layers in a thickness direction thereof, and (2) a heat spreader extending along a main surface of the first ceramic layer of the plurality of laminated ceramic layers. A first thermal conductivity of the thermal conductor is higher than a second thermal conductivity of the first ceramic layer, and the thermal conductor contains an insulating ceramic as a main material thereof, and further contains a second glass.
    Type: Grant
    Filed: June 8, 2020
    Date of Patent: December 28, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kosuke Sugiura, Issei Yamamoto
  • Publication number: 20200305272
    Abstract: A laminated substrate that includes a substrate body having a plurality of laminated ceramic layers containing a first glass; a wiring conductor within the substrate body and made from silver, copper, a silver alloy, or a copper alloy; and a thermal conductor within or on a main surface of the substrate body. The thermal conductor is at least one of (1) a thermal via penetrating a part of a first ceramic layer of the plurality of laminated ceramic layers in a thickness direction thereof, and (2) a heat spreader extending along a main surface of the first ceramic layer of the plurality of laminated ceramic layers. A first thermal conductivity of the thermal conductor is higher than a second thermal conductivity of the first ceramic layer, and the thermal conductor contains an insulating ceramic as a main material thereof, and further contains a second glass.
    Type: Application
    Filed: June 8, 2020
    Publication date: September 24, 2020
    Inventors: Kosuke Sugiura, Issei Yamamoto