Abstract: A particle dispersion, containing: particles; and a liquid medium, in which a distance of a HSP value of the particles with respect to a HSP value of the liquid medium is 5.50 MPa0.5 or less.

Abstract: One aspect of the present invention is a method for manufacturing an electronic component, the method including: a first step of applying a metal paste containing metal particles onto a polymer compact in a prescribed pattern to form a metal paste layer; a second step of sintering the metal particles to form metal wiring; a third step of applying a solder paste containing solder particles and a resin component onto the metal wiring to form a solder paste layer; a fourth step of disposing an electronic element on the solder paste layer; and a fifth step of heating the solder paste layer so as to form a solder layer bonding the metal wiring and the electronic element, and so as to form a resin layer covering at least a portion of the solder layer.

Abstract: One aspect of the present invention is a method for manufacturing an electronic component, the method including: a first step of applying a metal paste containing metal particles onto a polymer compact in a prescribed pattern to form a metal paste layer; a second step of sintering the metal particles to form metal wiring; a third step of applying a solder paste containing solder particles and a resin component onto the metal wiring to form a solder paste layer; a fourth step of disposing an electronic element on the solder paste layer; and a fifth step of heating the solder paste layer so as to form a solder layer bonding the metal wiring and the electronic element, and so as to form a resin layer covering at least a portion of the solder layer.

Abstract: A compound for dust core includes a metal powder including iron, a resin composition, and a metal salt, in which the metal salt is represented by R2M, R represents a saturated fatty acid group having 6 or more and 12 or less carbon atoms, and M represents at least one metal element between Ca and Ba.

Abstract: A wiring substrate includes a substrate, conductor wiring provided on the substrate, and an insulator positioned on at least a part of the periphery of the conductor wiring, in which the insulator contains a magnetic material. The wiring substrate ensures little loss in transmission even in high-frequency band.

Abstract: A monomer composition is a monomer composition for impregnating voids in a porous compact. The compact contains a metal powder and a thermosetting resin composition. The monomer composition contains at least one compound selected from the group consisting of an acrylate having a dicyclopentane structure, an acrylate having a dicyclopentene structure, a methacrylate having a dicyclopentane structure, and a methacrylate having a dicyclopentene structure.

Abstract: Provided is a paste including: a metallic element-containing powder; an epoxy group-containing compound; and a curing agent, wherein a thermogravimetric reduction rate is 5% or less after heat curing at 180° C. The paste can be suitably used as a material for a magnetic core of an inductor or as a material for filling between conductors of a coil, and is capable of easily providing a formed body having excellent insulation properties.

Abstract: A compound for bonded magnet that increases the mechanical strength (for example, crushing strength) of a bonded magnet is provided. The compound for bonded magnet includes a magnetic powder, an epoxy resin, a curing agent, a coupling agent, and a metal salt, and the metal salt is represented by R2M, in which R represents a saturated fatty acid group having 6 or more and 10 or less carbon atoms, while M represents at least one metal element between Ca and Ba.

Abstract: A compound for dust core includes a metal powder including iron, a resin composition, and a metal salt, in which the metal salt is represented by R2M, R represents a saturated fatty acid group having 6 or more and 12 or less carbon atoms, and M represents at least one metal element between Ca and Ba.

Abstract: One aspect of the present invention is a method for manufacturing an electronic component, the method including: a first step of applying a metal paste containing metal particles onto a polymer compact in a prescribed pattern to form a metal paste layer; a second step of sintering the metal particles to form metal wiring; a third step of applying a solder paste containing solder particles and a resin component onto the metal wiring to form a solder paste layer; a fourth step of disposing an electronic element on the solder paste layer; and a fifth step of heating the solder paste layer so as to form a solder layer bonding the metal wiring and the electronic element, and so as to form a resin layer covering at least a portion of the solder layer.

Abstract: There is provided an overcurrent protection device configured to protect a load from an overcurrent. A first overcurrent detector configured to detect the overcurrent, based on a value of a current flowing through the load, time for which the current flows through the load, and an overcurrent cutoff characteristic upon non-operation of the load. An overcurrent breaker that cuts off the overcurrent to the load when the first overcurrent detector detects the overcurrent.

Abstract: There is provided an overcurrent protection device configured to protect a load from an overcurrent. A first overcurrent detector configured to detect the overcurrent, based on a value of a current flowing through the load, time for which the current flows through the load, and an overcurrent cutoff characteristic upon non-operation of the load. An overcurrent breaker that cuts off the overcurrent to the load when the first overcurrent detector detects the overcurrent.