Patents by Inventor Kosuke Wada

Kosuke Wada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260159697
    Abstract: A boron nitride powder is a boron nitride powder surface-treated with a reactive silicone oil having a mass average molecular weight of 5000 or more. The boron nitride powder can be mixed with a resin to produce a heat dissipation sheet having an improved insulating property.
    Type: Application
    Filed: November 9, 2022
    Publication date: June 11, 2026
    Applicant: DENKA COMPANY LIMITED
    Inventors: Kosuke WADA, Kenji FUKAO, Takayuki IWASAKI
  • Publication number: 20260160502
    Abstract: A heat dissipation sheet of the present invention has a surface hardness of 60 degrees to 95 degrees in terms of an Asker C hardness and a dielectric breakdown voltage of 15 kV/mm or more. According to the present invention, a heat dissipation sheet having an excellent thermal conductivity and insulating property can be provided.
    Type: Application
    Filed: November 9, 2022
    Publication date: June 11, 2026
    Applicant: DENKA COMPANY LIMITED
    Inventors: Kosuke WADA, Kenji FUKAO, Kazuhiro OHSHIMA
  • Publication number: 20250269624
    Abstract: A composite sheet can include one or more metal organic frameworks dispersed in a sheet base material formed of fibers. The one or more metal organic frameworks can be supported on surfaces of the fibers. After a heat treatment, a ratio of a mass of the one or more metal organic frameworks to a mass of the entire composite sheet can be 80 mass % or more. One fiber forming a central region of the composite sheet in a thickness direction can have a surface coverage by the metal organic frameworks of 60% or more. A surface exposure ratio of the one or more metal organic frameworks can be 50% or more.
    Type: Application
    Filed: May 13, 2025
    Publication date: August 28, 2025
    Applicant: Kao Corporation
    Inventors: Junji HOSOKAWA, Minoru GOTO, Kosuke WADA
  • Publication number: 20250002771
    Abstract: The inorganic filler of the present invention has a zeta potential of ?15 mV or less at a pH of 7. The heat dissipation member of the present invention contains the inorganic filler of the present invention and a resin. The present invention can provide an inorganic filler that has good dispersibility in a resin, and a heat dissipation member containing the inorganic filler.
    Type: Application
    Filed: November 10, 2022
    Publication date: January 2, 2025
    Applicant: DENKA COMPANY LIMITED
    Inventors: Kosuke WADA, Kenji FUKAO, Masao ONOZUKA
  • Publication number: 20250002630
    Abstract: A copolymer contains a (meth)acrylic based monomer unit A having an anionic group, a (meth)acrylic based monomer unit B having a cationic group, and a (meth)acrylic based monomer unit C other than the (meth)acrylic based monomer unit A and the (meth)acrylic based monomer unit B, and the (meth)acrylic based monomer unit C has a weight average molecular weight of 2,000 to 9,000. The surfactant contains the copolymer. The resin composition contains a resin, the surfactant, and an inorganic filler. The heat dissipation sheet contains the resin composition. The present invention can provide a copolymer that is capable of reducing the viscosity of a resin composition containing a resin and an inorganic filler, a surfactant containing the copolymer, a resin composition containing the surfactant and an inorganic filler, and a heat dissipation sheet containing the resin composition.
    Type: Application
    Filed: November 10, 2022
    Publication date: January 2, 2025
    Applicant: DENKA COMPANY LIMITED
    Inventors: Kosuke WADA, Tomoyuki KANAI, Kenji FUKAO, Tatsumi ARAI, Masao ONOZUKA, Takayuki IWASAKI
  • Publication number: 20240159717
    Abstract: A pump unit for a chromatograph includes a plunger pump and an upstream check valve. The plunger pump has a pump head and pumps a mobile phase. The upstream check valve is provided upstream of the pump head. The upstream check valve includes a flow-path portion and a temperature regulator. The flow-path portion guides the mobile phase to the plunger pump. The temperature regulator regulates a temperature of the mobile phase passing through the flow-path portion.
    Type: Application
    Filed: October 28, 2023
    Publication date: May 16, 2024
    Applicant: SHIMADZU CORPORATION
    Inventors: Masanori FUJIWARA, Takafumi NAKAMURA, Yuki IIJIMA, Kosuke WADA
  • Publication number: 20240052226
    Abstract: Aggregated boron nitride particles in which hexagonal boron nitride primary particles are aggregated and which include an alkyl group-containing silane coupling agent. The present invention can provide boron nitride powder for obtaining a heat-dissipation sheet with excellent thermal conductivity, a heat-dissipation sheet with excellent thermal conductivity, and a method of producing a heat-dissipation sheet with excellent thermal conductivity.
    Type: Application
    Filed: December 28, 2021
    Publication date: February 15, 2024
    Applicant: DENKA COMPANY LIMITED
    Inventors: Kosuke WADA, Kiyotaka FUJI
  • Publication number: 20240043730
    Abstract: A heat dissipation sheet obtained by molding a heat conductive resin composition, the heat dissipation sheet having a partial discharge start voltage of 2800 to 5000 kV/mm. The method for producing the heat dissipation sheet includes a step of blending a resin and a boron nitride powder containing at least an aggregated boron nitride particle formed by an aggregation of hexagonal boron nitride primary particles to prepare a heat conductive resin composition, a step of molding the heat conductive resin composition into a sheet shape to prepare a heat conductive resin composition sheet, and a step of heating and pressurizing the heat conductive resin composition sheet under a vacuum. Thus, a heat dissipation sheet excellent in heat conductivity and insulation property and a method can produce the heat dissipation sheet.
    Type: Application
    Filed: December 17, 2021
    Publication date: February 8, 2024
    Applicant: DENKA COMPANY LIMITED
    Inventors: Kosuke WADA, Kiyotaka FUJI
  • Publication number: 20240026198
    Abstract: A boron nitride powder, containing at least an aggregated boron nitride particle formed by an aggregation of hexagonal boron nitride primary particles, the powder having a particle size distribution including at least a first maximum point, a second maximum point at which a particle size is larger than at the first maximum point, and a third maximum point at which a particle size is larger than at the second maximum point. The heat dissipation sheet is obtained by molding a heat conductive resin composition containing the boron nitride powder and a resin. The method for producing a heat dissipation sheet includes blending the boron nitride powder and a resin to prepare a heat conductive resin composition, molding the heat conductive resin composition into a sheet shape to prepare a heat conductive resin composition sheet, and heating and pressurizing the heat conductive resin composition sheet under a vacuum.
    Type: Application
    Filed: December 17, 2021
    Publication date: January 25, 2024
    Applicant: DENKA COMPANY LIMITED
    Inventors: Kosuke WADA, Kiyotaka FUJI
  • Publication number: 20230220262
    Abstract: A heat dissipation sheet having excellent thermal conductance, is a molded thermally conductive resin composition prepared by blending an inorganic filler component and a resin component, wherein the inorganic filler component particle size distribution includes a first maximum point attributable to the first inorganic filler and a second maximum point attributable to the second inorganic filler; the particle size at the first maximum point is 15 ?m or more; the particle size at the second maximum point is ? or less the particle size at the first maximum point; and an accumulated amount of the frequency between the peak start and the peak end of the peak having the first maximum point is 50% or more, and which has a surface roughness of from 1.5 to 3.0 ?m and a thickness of 0.2 mm or less.
    Type: Application
    Filed: June 11, 2021
    Publication date: July 13, 2023
    Applicant: DENKA COMPANY LIMITED
    Inventors: Kosuke WADA, Kiyotaka FUJI, Yoshitaka TANIGUCHI
  • Publication number: 20230220263
    Abstract: A heat-conductive resin composition containing an inorganic filler component and a resin component, wherein the inorganic filler component includes first and second inorganic fillers, a particle size distribution has a first maximum point caused by the first inorganic filler and a second maximum point caused by the second, the diameter at the first maximum point is 15 ?m or more, the diameter at the second is ? or less that at the first, an integrated amount of frequency between a peak start and end in a peak having the first maximum point is 50% or more, and the first inorganic filler is formed by agglomerating hexagonal boron nitride primary particles and has a crushing strength of 6 MPa or more. The heat dissipation sheet is obtained by molding the heat-conductive resin composition.
    Type: Application
    Filed: June 11, 2021
    Publication date: July 13, 2023
    Applicant: DENKA COMPANY LIMITED
    Inventors: Kosuke WADA, Kiyotaka FUJI, Yoshitaka TANIGUCHI
  • Publication number: 20230052370
    Abstract: A heat dissipation sheet containing a silicone resin and a thermally conductive filler, wherein with respect to the cross-sectional shape of the thermally conductive filler, the average value of an aspect ratio of the 1st to 24th particles from the largest of biaxial average diameters, is in a range of 0.4 or more and 1.4 or less. In addition, an area ratio (Sr) of a total area S of cross-sectional shapes of the particles to a whole area of the cross-sectional view may be in a range of 20% or more and 80% or less, and the particle number ratio may be less than 1. Further, a thermal resistance ratio of a thermal resistance value when a pressure of 0.4 MPa is applied to a thermal resistance value when a pressure of 1.0 MPa is applied may be 1 or more.
    Type: Application
    Filed: March 18, 2021
    Publication date: February 16, 2023
    Applicant: DENKA COMPANY LIMITED
    Inventors: Kosuke WADA, Yoshitaka TANIGUCHI
  • Publication number: 20220392824
    Abstract: A heat-radiating sheet, in which when after sandwiching a heat-radiating grease between a heat-radiating sheet arranged on an aluminum plate and a glass plate, a heat cycle test is performed 100 cycles, an area ratio of an area of the heat-radiating grease after performing the heat cycle test of 100 cycles to an area of the heat-radiating grease before performing the heat cycle test is 1.0 to 2.0. A heat-radiating sheet laminate includes a heat-radiating sheet and a heat-radiating grease layer formed on the surface of the heat-radiating sheet. A structure includes the heat-radiating sheet, a heat-generating element, and the heat-radiating grease intervening between the heat-radiating sheet and the heat-generating element. A heat-radiating treatment method of a heat-generating element includes a step of applying a heat-radiating grease on the heat-radiating sheet and a step of arranging a heat-generating element on the heat-radiating sheet having the heat-radiating grease applied thereon.
    Type: Application
    Filed: September 24, 2020
    Publication date: December 8, 2022
    Applicant: DENKA COMPANY LIMITED
    Inventors: Kosuke WADA, Masahide KANEKO, Ryozo NONOGAKI
  • Publication number: 20220346280
    Abstract: A heat-radiating sheet having a volume resistivity of 1.0×109 ?·cm or more as measured by a direct current voltage of 500 V according to JIS K6911 after being impregnated with an antifreeze containing 98% by mass or more of ethylene glycol at a temperature 25° C. for 250 hours. It is possible to provide a heat-radiating sheet having high tolerance against gasoline and engine oil.
    Type: Application
    Filed: September 24, 2020
    Publication date: October 27, 2022
    Applicant: DENKA COMPANY LIMITED
    Inventors: Kosuke WADA, Masahide KANEKO, Ryozo NONOGAKI
  • Publication number: 20220344242
    Abstract: A heat-radiating sheet, in which a rate of reduction (%) ((R1-R2)/R1×100) of a thermal resistance (R2) (° C./W) of the heat-radiating sheet as measured when tightened at a tightening torque of 6 kgf·cm by using a screw after being impregnated in an antifreeze containing 98% by mass or more of ethylene glycol at a temperature of 25° C. for 500 hours relative to a thermal resistance (R1) (° C./W) of the heat-radiating sheet as measured when tightened at a tightening torque of 6 kgf·cm by using a screw is 30% or less. It is possible to provide a heat-radiating sheet having high tolerance against gasoline and engine oil.
    Type: Application
    Filed: September 24, 2020
    Publication date: October 27, 2022
    Applicant: DENKA COMPANY LIMITED
    Inventors: Kosuke WADA, Masahide KANEKO, Ryozo NONOGAKI
  • Publication number: 20220278020
    Abstract: A heat-diffusion sheet when a needle electrode having a cone having a height of 3 mm and a bottom surface diameter of 0.75 mm at a distal end section, wherein a 2.0-kV current voltage having a frequency of 60 Hz, is penetrated stepwise every 10 ?m but also retained for 60 seconds before the penetration, a distance between the distal end of the needle electrode and an aluminum plate at the time of dielectric breakdown of the heat-diffusion sheet is larger than 0 ?m and 80 ?m or less, or the needle electrode short-circuits the aluminum plate without dielectric breakdown of the heat-diffusion sheet. The method includes a step of pre-heating a composition for heat-diffusion sheet at a pre-heating temperature lower than a curing starting temperature; and a curing step of heating the composition for heat-diffusion sheet at a temperature of the curing starting temperature or higher while pressurizing the pre-heated composition sheet for heat-diffusion sheet.
    Type: Application
    Filed: August 18, 2020
    Publication date: September 1, 2022
    Applicant: DENKA COMPANY LIMITED
    Inventors: Kosuke WADA, Masahide KANEKO, Ryozo NONOGAKI
  • Patent number: 11231399
    Abstract: A sample temperature adjustment device includes a temperature control space for controlling a temperature of a sample by containing the sample inside, a heat insulating layer enclosing the temperature control space so that the temperature control space is thermally separated from outside air of the sample temperature adjustment device, a cooling part for cooling the temperature control space, a heat transfer plate covering at least a part of outer surfaces of the heat insulating layer, and a heater that heats the heat transfer plate to prevent dew condensation on a surface of the heat transfer plate.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: January 25, 2022
    Assignee: Shimadzu Corporation
    Inventor: Kosuke Wada
  • Patent number: 10941877
    Abstract: A switching valve includes a valve head having a plurality of connection ports connecting a pipe, a rotor accommodated therein and including a groove for connecting the connection ports, and a rotor shaft holding the rotor and rotatably equipped, and a driver having a holder holding the valve head and a motor rotating the rotor shaft of the valve head held by the holder. Further, the valve head is provided with a home position sensor detecting a reference position in a rotation direction of the rotor shaft, and a teaching information holder holding information on a relative positional relationship between the reference position and a position of the rotor shaft when the rotor is at a predetermined position, and the reference position acquired using the home position sensor.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: March 9, 2021
    Assignee: Shimadzu Corporation
    Inventors: Kosuke Wada, Kenta Matsumoto
  • Publication number: 20200371071
    Abstract: A sample temperature adjustment device includes a temperature control space for controlling a temperature of a sample by containing the sample inside, a heat insulating layer enclosing the temperature control space so that the temperature control space is thermally separated from outside air of the sample temperature adjustment device, a cooling part for cooling the temperature control space, a heat transfer plate covering at least a part of outer surfaces of the heat insulating layer, and a heater that heats the heat transfer plate to prevent dew condensation on a surface of the heat transfer plate.
    Type: Application
    Filed: January 22, 2018
    Publication date: November 26, 2020
    Inventor: Kosuke WADA
  • Publication number: 20200182362
    Abstract: A switching valve includes a valve head having a plurality of connection ports connecting a pipe, a rotor accommodated therein and including a groove for connecting the connection ports, and a rotor shaft holding the rotor and rotatably equipped, and a driver having a holder holding the valve head and a motor rotating the rotor shaft of the valve head held by the holder. Further, the valve head is provided with a home position sensor detecting a reference position in a rotation direction of the rotor shaft, and a teaching information holder holding information on a relative positional relationship between the reference position and a position of the rotor shaft when the rotor is at a predetermined position, and the reference position acquired using the home position sensor.
    Type: Application
    Filed: September 1, 2017
    Publication date: June 11, 2020
    Inventors: Kosuke WADA, Kenta MATSUMOTO