Patents by Inventor Kosuke Wada
Kosuke Wada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11942347Abstract: A storage system includes an overhead stocker including an overhead crane track, shelving in which tiers of storages to accommodate articles therein are arranged vertically, and a crane to travel along the overhead crane track and transfer an article between the tiers of storages, an overhead transport vehicle system to perform receiving or delivering of an article from or to a predetermined transfer destination, and a transporter to vertically transport an article between the overhead stocker and the overhead transport vehicle system, the overhead transport vehicle system being provided below a lower end of the overhead stocker.Type: GrantFiled: November 14, 2019Date of Patent: March 26, 2024Assignee: MURATA MACHINERY, LTD.Inventors: Eiji Wada, Yoshiki Yuasa, Kosuke Irino
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Publication number: 20240066047Abstract: The present disclosure provides a compound having a STING agonistic activity, which may be expected to be useful as an agent for the prophylaxis or treatment of STING-related diseases. The present disclosure relates to a compound represented by the formula (I): wherein each symbol is as defined in the description, or a salt thereof.Type: ApplicationFiled: May 1, 2023Publication date: February 29, 2024Inventors: MASATO YOSHIKAWA, MORIHISA SAITOH, TAISUKE KATO, YAYOI NAKAYAMA, TOMOHIRO SEKI, YASUO NAKAGAWA, YUSUKE TOMINARI, MASAKI SETO, YUSUKE SASAKI, MASANORI OKANIWA, TSUNEO ODA, AKITO SHIBUYA, KOSUKE HIDAKA, ZENYU SHIOKAWA, SHUMPEI MURATA, ATSUTOSHI OKABE, YOSHIHISA NAKADA, MICHIYO MOCHIZUKI, BRIAN SCOTT FREEZE, TAISUKE TAWARAISHI, YASUFUMI WADA, PAUL D. GREENSPAN
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Publication number: 20240052226Abstract: Aggregated boron nitride particles in which hexagonal boron nitride primary particles are aggregated and which include an alkyl group-containing silane coupling agent. The present invention can provide boron nitride powder for obtaining a heat-dissipation sheet with excellent thermal conductivity, a heat-dissipation sheet with excellent thermal conductivity, and a method of producing a heat-dissipation sheet with excellent thermal conductivity.Type: ApplicationFiled: December 28, 2021Publication date: February 15, 2024Applicant: DENKA COMPANY LIMITEDInventors: Kosuke WADA, Kiyotaka FUJI
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Publication number: 20240043730Abstract: A heat dissipation sheet obtained by molding a heat conductive resin composition, the heat dissipation sheet having a partial discharge start voltage of 2800 to 5000 kV/mm. The method for producing the heat dissipation sheet includes a step of blending a resin and a boron nitride powder containing at least an aggregated boron nitride particle formed by an aggregation of hexagonal boron nitride primary particles to prepare a heat conductive resin composition, a step of molding the heat conductive resin composition into a sheet shape to prepare a heat conductive resin composition sheet, and a step of heating and pressurizing the heat conductive resin composition sheet under a vacuum. Thus, a heat dissipation sheet excellent in heat conductivity and insulation property and a method can produce the heat dissipation sheet.Type: ApplicationFiled: December 17, 2021Publication date: February 8, 2024Applicant: DENKA COMPANY LIMITEDInventors: Kosuke WADA, Kiyotaka FUJI
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Publication number: 20240026198Abstract: A boron nitride powder, containing at least an aggregated boron nitride particle formed by an aggregation of hexagonal boron nitride primary particles, the powder having a particle size distribution including at least a first maximum point, a second maximum point at which a particle size is larger than at the first maximum point, and a third maximum point at which a particle size is larger than at the second maximum point. The heat dissipation sheet is obtained by molding a heat conductive resin composition containing the boron nitride powder and a resin. The method for producing a heat dissipation sheet includes blending the boron nitride powder and a resin to prepare a heat conductive resin composition, molding the heat conductive resin composition into a sheet shape to prepare a heat conductive resin composition sheet, and heating and pressurizing the heat conductive resin composition sheet under a vacuum.Type: ApplicationFiled: December 17, 2021Publication date: January 25, 2024Applicant: DENKA COMPANY LIMITEDInventors: Kosuke WADA, Kiyotaka FUJI
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Publication number: 20230220262Abstract: A heat dissipation sheet having excellent thermal conductance, is a molded thermally conductive resin composition prepared by blending an inorganic filler component and a resin component, wherein the inorganic filler component particle size distribution includes a first maximum point attributable to the first inorganic filler and a second maximum point attributable to the second inorganic filler; the particle size at the first maximum point is 15 ?m or more; the particle size at the second maximum point is ? or less the particle size at the first maximum point; and an accumulated amount of the frequency between the peak start and the peak end of the peak having the first maximum point is 50% or more, and which has a surface roughness of from 1.5 to 3.0 ?m and a thickness of 0.2 mm or less.Type: ApplicationFiled: June 11, 2021Publication date: July 13, 2023Applicant: DENKA COMPANY LIMITEDInventors: Kosuke WADA, Kiyotaka FUJI, Yoshitaka TANIGUCHI
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Publication number: 20230220263Abstract: A heat-conductive resin composition containing an inorganic filler component and a resin component, wherein the inorganic filler component includes first and second inorganic fillers, a particle size distribution has a first maximum point caused by the first inorganic filler and a second maximum point caused by the second, the diameter at the first maximum point is 15 ?m or more, the diameter at the second is ? or less that at the first, an integrated amount of frequency between a peak start and end in a peak having the first maximum point is 50% or more, and the first inorganic filler is formed by agglomerating hexagonal boron nitride primary particles and has a crushing strength of 6 MPa or more. The heat dissipation sheet is obtained by molding the heat-conductive resin composition.Type: ApplicationFiled: June 11, 2021Publication date: July 13, 2023Applicant: DENKA COMPANY LIMITEDInventors: Kosuke WADA, Kiyotaka FUJI, Yoshitaka TANIGUCHI
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Publication number: 20230052370Abstract: A heat dissipation sheet containing a silicone resin and a thermally conductive filler, wherein with respect to the cross-sectional shape of the thermally conductive filler, the average value of an aspect ratio of the 1st to 24th particles from the largest of biaxial average diameters, is in a range of 0.4 or more and 1.4 or less. In addition, an area ratio (Sr) of a total area S of cross-sectional shapes of the particles to a whole area of the cross-sectional view may be in a range of 20% or more and 80% or less, and the particle number ratio may be less than 1. Further, a thermal resistance ratio of a thermal resistance value when a pressure of 0.4 MPa is applied to a thermal resistance value when a pressure of 1.0 MPa is applied may be 1 or more.Type: ApplicationFiled: March 18, 2021Publication date: February 16, 2023Applicant: DENKA COMPANY LIMITEDInventors: Kosuke WADA, Yoshitaka TANIGUCHI
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Publication number: 20220392824Abstract: A heat-radiating sheet, in which when after sandwiching a heat-radiating grease between a heat-radiating sheet arranged on an aluminum plate and a glass plate, a heat cycle test is performed 100 cycles, an area ratio of an area of the heat-radiating grease after performing the heat cycle test of 100 cycles to an area of the heat-radiating grease before performing the heat cycle test is 1.0 to 2.0. A heat-radiating sheet laminate includes a heat-radiating sheet and a heat-radiating grease layer formed on the surface of the heat-radiating sheet. A structure includes the heat-radiating sheet, a heat-generating element, and the heat-radiating grease intervening between the heat-radiating sheet and the heat-generating element. A heat-radiating treatment method of a heat-generating element includes a step of applying a heat-radiating grease on the heat-radiating sheet and a step of arranging a heat-generating element on the heat-radiating sheet having the heat-radiating grease applied thereon.Type: ApplicationFiled: September 24, 2020Publication date: December 8, 2022Applicant: DENKA COMPANY LIMITEDInventors: Kosuke WADA, Masahide KANEKO, Ryozo NONOGAKI
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Publication number: 20220346280Abstract: A heat-radiating sheet having a volume resistivity of 1.0×109 ?·cm or more as measured by a direct current voltage of 500 V according to JIS K6911 after being impregnated with an antifreeze containing 98% by mass or more of ethylene glycol at a temperature 25° C. for 250 hours. It is possible to provide a heat-radiating sheet having high tolerance against gasoline and engine oil.Type: ApplicationFiled: September 24, 2020Publication date: October 27, 2022Applicant: DENKA COMPANY LIMITEDInventors: Kosuke WADA, Masahide KANEKO, Ryozo NONOGAKI
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Publication number: 20220344242Abstract: A heat-radiating sheet, in which a rate of reduction (%) ((R1-R2)/R1×100) of a thermal resistance (R2) (° C./W) of the heat-radiating sheet as measured when tightened at a tightening torque of 6 kgf·cm by using a screw after being impregnated in an antifreeze containing 98% by mass or more of ethylene glycol at a temperature of 25° C. for 500 hours relative to a thermal resistance (R1) (° C./W) of the heat-radiating sheet as measured when tightened at a tightening torque of 6 kgf·cm by using a screw is 30% or less. It is possible to provide a heat-radiating sheet having high tolerance against gasoline and engine oil.Type: ApplicationFiled: September 24, 2020Publication date: October 27, 2022Applicant: DENKA COMPANY LIMITEDInventors: Kosuke WADA, Masahide KANEKO, Ryozo NONOGAKI
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Publication number: 20220278020Abstract: A heat-diffusion sheet when a needle electrode having a cone having a height of 3 mm and a bottom surface diameter of 0.75 mm at a distal end section, wherein a 2.0-kV current voltage having a frequency of 60 Hz, is penetrated stepwise every 10 ?m but also retained for 60 seconds before the penetration, a distance between the distal end of the needle electrode and an aluminum plate at the time of dielectric breakdown of the heat-diffusion sheet is larger than 0 ?m and 80 ?m or less, or the needle electrode short-circuits the aluminum plate without dielectric breakdown of the heat-diffusion sheet. The method includes a step of pre-heating a composition for heat-diffusion sheet at a pre-heating temperature lower than a curing starting temperature; and a curing step of heating the composition for heat-diffusion sheet at a temperature of the curing starting temperature or higher while pressurizing the pre-heated composition sheet for heat-diffusion sheet.Type: ApplicationFiled: August 18, 2020Publication date: September 1, 2022Applicant: DENKA COMPANY LIMITEDInventors: Kosuke WADA, Masahide KANEKO, Ryozo NONOGAKI
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Patent number: 11231399Abstract: A sample temperature adjustment device includes a temperature control space for controlling a temperature of a sample by containing the sample inside, a heat insulating layer enclosing the temperature control space so that the temperature control space is thermally separated from outside air of the sample temperature adjustment device, a cooling part for cooling the temperature control space, a heat transfer plate covering at least a part of outer surfaces of the heat insulating layer, and a heater that heats the heat transfer plate to prevent dew condensation on a surface of the heat transfer plate.Type: GrantFiled: January 22, 2018Date of Patent: January 25, 2022Assignee: Shimadzu CorporationInventor: Kosuke Wada
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Patent number: 10941877Abstract: A switching valve includes a valve head having a plurality of connection ports connecting a pipe, a rotor accommodated therein and including a groove for connecting the connection ports, and a rotor shaft holding the rotor and rotatably equipped, and a driver having a holder holding the valve head and a motor rotating the rotor shaft of the valve head held by the holder. Further, the valve head is provided with a home position sensor detecting a reference position in a rotation direction of the rotor shaft, and a teaching information holder holding information on a relative positional relationship between the reference position and a position of the rotor shaft when the rotor is at a predetermined position, and the reference position acquired using the home position sensor.Type: GrantFiled: September 1, 2017Date of Patent: March 9, 2021Assignee: Shimadzu CorporationInventors: Kosuke Wada, Kenta Matsumoto
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Publication number: 20200371071Abstract: A sample temperature adjustment device includes a temperature control space for controlling a temperature of a sample by containing the sample inside, a heat insulating layer enclosing the temperature control space so that the temperature control space is thermally separated from outside air of the sample temperature adjustment device, a cooling part for cooling the temperature control space, a heat transfer plate covering at least a part of outer surfaces of the heat insulating layer, and a heater that heats the heat transfer plate to prevent dew condensation on a surface of the heat transfer plate.Type: ApplicationFiled: January 22, 2018Publication date: November 26, 2020Inventor: Kosuke WADA
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Publication number: 20200182362Abstract: A switching valve includes a valve head having a plurality of connection ports connecting a pipe, a rotor accommodated therein and including a groove for connecting the connection ports, and a rotor shaft holding the rotor and rotatably equipped, and a driver having a holder holding the valve head and a motor rotating the rotor shaft of the valve head held by the holder. Further, the valve head is provided with a home position sensor detecting a reference position in a rotation direction of the rotor shaft, and a teaching information holder holding information on a relative positional relationship between the reference position and a position of the rotor shaft when the rotor is at a predetermined position, and the reference position acquired using the home position sensor.Type: ApplicationFiled: September 1, 2017Publication date: June 11, 2020Inventors: Kosuke WADA, Kenta MATSUMOTO
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Patent number: 10424529Abstract: It is an object of the present invention to obtain a ceramic circuit substrate having high bonding strength, excellent heat cycle resistance, enhanced reliability of operation as an electronic device, and excellent heat dissipation properties. The present invention provides a ceramic circuit substrate in which metal plates, particularly copper plates, and both main surfaces of a ceramic substrate are bonded vial silver-copper brazing material layers. The silver-copper brazing material layers are formed from a silver-copper brazing material including i) 0.3-7.5 parts by mass of carbon fibers, and ii) 1.0-9.0 parts by mass of at least one active metal selected from titanium, zirconium, hafnium, niobium, tantalum, vanadium, and tin; with respect to iii) a total of 100 parts by mass of a) 75-98 parts by mass of silver powder and b) 2-25 parts by mass of copper powder. The carbon fibers having an average length of 15-400 ?m, an average diameter of 5-25 ?m and an average aspect ratio of 3-28.Type: GrantFiled: February 20, 2015Date of Patent: September 24, 2019Assignee: DENKA COMPANY LIMITEDInventors: Ryota Aono, Kosuke Wada, Masao Tsuichihara, Takeshi Miyakawa
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Publication number: 20160358840Abstract: [Problem] To obtain a ceramic circuit substrate having high bonding strength, excellent heat cycle resistance, enhanced reliability of operation as an electronic device, and excellent heat dissipation properties. [Solution] A ceramic circuit substrate in which metal plates and both main surfaces of a ceramic substrate are bonded via silver-copper brazing material layers, the ceramic Cit quit substrate characterized in that the silver-copper brazing material layers are formed from a silver-copper brazing material including 0.3-7.5 parts by mass of carbon fibers and 1.0-9.0 parts by mass of at least one active metal selected from titanium, zirconium, hafnium, niobium, tantalum, vanadium, and tin with respect to 75-98 parts by mass of silver powder and 2-25 parts by mass of copper powder totaling 100 part by mass, with the carbon fibers having an average length of 15-400 ?m, an average diameter of 5-25 ?m and an average aspect ratio of 3-28.Type: ApplicationFiled: February 20, 2015Publication date: December 8, 2016Applicant: DENKA COMPANY LIMITEDInventors: Ryota AONO, Kosuke WADA, Masao TSUICHIHARA, Takeshi MIYAKAWA
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Patent number: 6652821Abstract: The present invention provides a purifying agent having an effect of removing or decomposing toxic substances contained in flue gas or incinerated ash. The purifying agent of the present invention contains one or more kinds of salts selected from alkali metal silicates, fluoride ion, hydrogencarbonate ion, and water-soluble alcohols or derivatives thereof.Type: GrantFiled: October 18, 2000Date of Patent: November 25, 2003Inventors: Yasuo Fukutani, Yoshiyuki Futahashi, Yukio Wada, Eiichiro Nakayama, Kikuko Fukutani, Masami Kojima, Kosuke Wada, Masayoshi Uchida, Shunji Suzuki, Naoya Fujii
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Patent number: 6518225Abstract: The object of the present invention is to provide a water-base lubricating fluid or a water-base hydraulic fluid in place of an oily liquid which has been used as a lubricating oil or a hydraulic oil applied onto the operating part of a machine and a device. The lubricating fluid of the present invention comprises fluoride ion, hydrogencarbonate ion, and water-soluble alcohols or their derivatives.Type: GrantFiled: January 4, 2001Date of Patent: February 11, 2003Inventors: Yasuo Fukutani, Kikuko Fukutani, Yukio Wada, Eiichiro Nakayama, Yoshiyuki Futahashi, Chiyo Wada, Naomi Kitagawa, Mie Fukutani, Kosuke Wada, Shinya Fukushima, Sadayuki Futahashi, Yuko Okamoto, Sadao Futahashi, Kazuma Suzuki, Tamiko Tsuruta, Shunji Suzuki, Hitohiro Fukutani