Patents by Inventor Kosuke Yamada

Kosuke Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240128362
    Abstract: Provided is a semiconductor device comprising: a plurality of trench portions include a gate trench portion and a dummy trench portion; a first lower end region of a second conductivity type that is provided to be in contact with lower ends of two or more trench portions which include the gate trench portion; a well region of a second conductivity type that is arranged in a different location from the first lower end region in a top view, and a second lower end region of a second conductivity type that is provided between the first lower end region and the well region in a top view being separated from the first lower end region and the well region, and provided to be in contact with lower ends of one or more trench portions including the gate trench portion.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 18, 2024
    Inventors: Yosuke SAKURAI, Seiji NOGUCHI, Kosuke YOSHIDA, Ryutaro HAMASAKI, Takuya YAMADA
  • Publication number: 20240120413
    Abstract: Provided is a semiconductor device comprising: a plurality of trench portions; a first lower end region of a second conductivity type that is provided to be in contact with lower ends of two or more trench portions which include the gate trench portion; a well region of the second conductivity type that is arranged in a different location from the first lower end region in a top view, and a second lower end region of the second conductivity type that is provided between the first lower end region and the well region in a top view being separated from the first lower end region and the well region, and provided to be in contact with lower ends of one or more trench portions including the gate trench portion.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 11, 2024
    Inventors: Yosuke SAKURAI, Seiji NOGUCHI, Kosuke YOSHIDA, Ryutaro HAMASAKI, Takuya YAMADA
  • Publication number: 20240112990
    Abstract: A semiconductor device manufacturing method includes a first preparation step, a second preparation step, a mounting step, a third preparation step, a placing step and a curing step. In the first preparation step, a first leadframe including an island part is prepared. In the second preparation step, a semiconductor element including an element obverse surface, an element reverse surface, a first electrode and a second electrode is prepared. In the mounting step, the semiconductor element is mounted on the island part with a first conductive paste interposed between the element reverse surface and the island part. In the third preparation step, a second leadframe including a first part, a second part, a frame part, a first connecting part and a second connecting part is prepared.
    Type: Application
    Filed: December 14, 2021
    Publication date: April 4, 2024
    Inventors: Koshun SAITO, Kota ISE, Kosuke YAMADA
  • Patent number: 11945509
    Abstract: A vehicle body rear part structure includes a rear frame and a beam member. The rear frame has: a first inner bead, a first outer bead, a second inner bead, and a second outer bead. The first inner bead and the first outer bead are formed on an inner wall and an outer wall, respectively, in a region close to the beam member. The second inner bead and the second outer bead are formed on the inner wall and the outer wall, respectively, in a region that is separated to a vehicle body frontward direction from the first beads. The first outer bead is formed to have a higher fragility than the first inner bead.
    Type: Grant
    Filed: January 26, 2022
    Date of Patent: April 2, 2024
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Shungo Chino, Yuya Akaba, Toshihiro Yamaguchi, Kyosuke Yamakita, Yusuke Miura, Dai Kamata, Chihiro Sakagami, Kosuke Fushimi, Shohei Ohtsuka, Hitomi Yamada
  • Patent number: 11934119
    Abstract: A transportation device includes a first transporter, a second transporter movable between a contact position and a separate position toward and away from the first transporter to hold a to-be-transported object between the second transporter and the first transporter in the contact position, and a transportation unit that transports the to-be-transported object to a nip area where the first transporter and the second transporter hold the to-be-transported object therebetween while the second transporter is located in the separate position. The second transporter moves from the separate position to the contact position to hold the to-be-transported object transported to the nip area by the transportation unit between the second transporter and the first transporter to transport the to-be-transported object.
    Type: Grant
    Filed: September 3, 2021
    Date of Patent: March 19, 2024
    Assignee: FUJIFILM Business Innovation Corp.
    Inventors: Masato Yamashita, Yoshiki Shimodaira, Kosuke Yamada, Tetsuro Kodera, Mitsuhiro Matsumoto, Takayuki Yamashita
  • Patent number: 11921445
    Abstract: A transport device includes: a first transport body; a second transport body that is movable between a contact position and a separate position with respect to the first transport body and that nips a transported material with the first transport body at the contact position; and a transport section that includes a holder to hold a leading end portion of the transported material and that transports the transported material toward a nip region where the first transport body and the second transport body nip the transported material in a state in which the second transport body is located at the separate position. After holding of the leading end portion by the holder for the transported material transported by the transport section has been released, the second transport body nips the transported material with the first transport body and transports the transported material.
    Type: Grant
    Filed: December 3, 2021
    Date of Patent: March 5, 2024
    Assignee: FUJIFILM Business Innovation Corp.
    Inventors: Masato Yamashita, Yoshiki Shimodaira, Kosuke Yamada, Tetsuro Kodera, Mitsuhiro Matsumoto, Takayuki Yamashita
  • Patent number: 11880148
    Abstract: A heating device includes: a heating unit configured to heat a transported material being transported in a transport direction in a non-contact manner with respect to the transported material; and a facing portion that is disposed on a side opposite to the heating unit with respect to the transported material and faces the heating unit in a facing direction intersecting the transport direction, wherein a length of the heating unit in the transport direction is longer than a length of the facing portion in the transport direction, or a length of the heating unit in an intersecting direction intersecting the transport direction and the facing direction is longer than a length of the facing portion in the intersecting direction.
    Type: Grant
    Filed: November 9, 2021
    Date of Patent: January 23, 2024
    Assignee: FUJIFILM Business Innovation Corp.
    Inventors: Mitsuhiro Matsumoto, Tetsuro Kodera, Yoshiki Shimodaira, Kosuke Yamada, Masato Yamashita, Takayuki Yamashita
  • Patent number: 11754950
    Abstract: A conveying device includes: a rotation part to which a holding part configured to hold a material to be conveyed is attached and configured to rotate in a circumferential direction to convey the material to be conveyed; a conveying roller that is provided with a recess for accommodating the holding part to convey the material to be conveyed; and a guide member including a guide portion configured to guide the material to be conveyed on a downstream side of the conveying roller, and a space in an intersecting direction intersecting the circumferential direction with respect to the guide portion, the space where the holding part moving by rotation of the rotation part passes through.
    Type: Grant
    Filed: November 22, 2021
    Date of Patent: September 12, 2023
    Assignee: FUJIFILM Business Innovation Corp.
    Inventors: Masato Yamashita, Takayuki Yamashita, Yoshiki Shimodaira, Kosuke Yamada, Tetsuro Kodera, Mitsuhiro Matsumoto
  • Patent number: 11740575
    Abstract: A fixing device includes: a non-contact heating unit configured to heat a recording medium being transported on a transport path in a non-contact manner; a facing member that is disposed along the transport path at a position facing the non-contact heating unit and that is configured to move with respect to the recording medium; and a tension unit configured to tension a facing member in a direction along the transport path.
    Type: Grant
    Filed: November 18, 2021
    Date of Patent: August 29, 2023
    Assignee: FUJIFILM Business Innovation Corp.
    Inventors: Tetsuro Kodera, Kosuke Yamada, Masato Yamashita, Yoshiki Shimodaira, Takayuki Yamashita, Mitsuhiro Matsumoto
  • Publication number: 20230225260
    Abstract: To provide a mechanism for performing environment control in a plant cultivation device and process control regarding to a work process for cultivating a plant. A plant cultivation device includes a plurality of sensors for monitoring a growing condition of a plant to be cultivated; an environment controlling unit for controlling an environment which is a condition of at least one of light, air, water, and space in the plant cultivation device; and a process controlling unit for controlling a work process for cultivating the plant.
    Type: Application
    Filed: April 9, 2021
    Publication date: July 20, 2023
    Inventors: Kazutaka OHSHIMA, Shinjiro YAMADA, Takuji AKIYAMA, Shunsuke SAKAGUCHI, Kosuke YAMADA
  • Patent number: 11703786
    Abstract: A fixing device includes: a non-contact heating unit configured to heat a recording medium in a non-contact manner; and a contact heating unit configured to press and heat the recording medium on a downstream side of the non-contact heating unit in a conveyance direction of the recording medium, in which the non-contact heating unit controls an amount of heat applied to the recording medium according to information on whether the recording medium is black or not, and a thickness of the recording medium, and the contact heating unit controls the pressure applied to the recording medium according to the thickness regardless of whether the recording medium is black or not.
    Type: Grant
    Filed: November 18, 2021
    Date of Patent: July 18, 2023
    Assignee: FUJIFILM Business Innovation Corp.
    Inventors: Yoshiki Shimodaira, Masato Yamashita, Tetsuro Kodera, Mitsuhiro Matsumoto, Kosuke Yamada, Takayuki Yamashita
  • Patent number: 11693345
    Abstract: A transport device includes a rotating body including a recessed portion on an outer surface, a rotatable heat unit that is in contact with the outer surface of the rotating body and forms an interposition region in which a recording medium is interposed between the heat unit and the rotating body, a transport unit that: (i) includes a hold member capable of holding a portion of the recording medium near a leading edge, (ii) transports the recording medium by moving the hold member in a rotational direction of the rotating body with the hold member contained in the recessed portion, and (iii) causes the hold member to pass through the interposition region, and a controller that controls rotation of the rotating body such that the recessed portion stops at a position upstream or downstream of the interposition region in the rotational direction when an anomaly is detected.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: July 4, 2023
    Assignee: FUJIFILM Business Innovation Corp.
    Inventors: Tetsuro Kodera, Takayuki Yamashita, Yoshiki Shimodaira, Mitsuhiro Matsumoto, Kosuke Yamada, Masato Yamashita
  • Patent number: 11676935
    Abstract: A bonding method is capable of realizing high bonding strength and connection reliability even at a connection part in a high temperature area by means of simple operation low temperature bonding. The method includes a first step wherein, on at least one of the bonded surfaces of two materials to be bonded having a smooth surface, a thin film of noble metal with a volume diffusion coefficient greater than that of the base metal of the material to be bonded is formed using an atomic layer deposition method at a vacuum of 1.0 Pa or higher, a second step wherein a laminate is formed by overlapping the two materials to be bonded so that the bonded surfaces of the two materials are connected through the thin film, and a third step wherein the two materials to be bonded are bonded by holding the laminate at a predetermined temperature.
    Type: Grant
    Filed: April 3, 2020
    Date of Patent: June 13, 2023
    Assignees: WASEDA UNIVERSITY, HARIMA CHEMICALS, INC.
    Inventors: Jun Mizuno, Hiroyuki Kuwae, Kosuke Yamada, Masami Aihara, Takayuki Ogawa
  • Publication number: 20230063255
    Abstract: A transport device includes: a first transport body; a second transport body that is movable between a contact position and a separate position with respect to the first transport body and that nips a transported material with the first transport body at the contact position; and a transport section that includes a holder to hold a leading end portion of the transported material and that transports the transported material toward a nip region where the first transport body and the second transport body nip the transported material in a state in which the second transport body is located at the separate position. After holding of the leading end portion by the holder for the transported material transported by the transport section has been released, the second transport body nips the transported material with the first transport body and transports the transported material.
    Type: Application
    Filed: December 3, 2021
    Publication date: March 2, 2023
    Applicant: FUJIFILM Business Innovation Corp.
    Inventors: Masato YAMASHITA, Yoshiki SHIMODAIRA, Kosuke YAMADA, Tetsuro KODERA, Mitsuhiro MATSUMOTO, Takayuki YAMASHITA
  • Publication number: 20230060783
    Abstract: A transport device includes a rotating body including a recessed portion on an outer surface, a rotatable heat unit that is in contact with the outer surface of the rotating body and forms an interposition region in which a recording medium is interposed between the heat unit and the rotating body, a transport unit that: (i) includes a hold member capable of holding a portion of the recording medium near a leading edge, (ii) transports the recording medium by moving the hold member in a rotational direction of the rotating body with the hold member contained in the recessed portion, and (iii) causes the hold member to pass through the interposition region, and a controller that controls rotation of the rotating body such that the recessed portion stops at a position upstream or downstream of the interposition region in the rotational direction when an anomaly is detected.
    Type: Application
    Filed: December 20, 2021
    Publication date: March 2, 2023
    Applicant: FUJIFILM Business Innovation Corp.
    Inventors: Tetsuro KODERA, Takayuki YAMASHITA, Yoshiki SHIMODAIRA, Mitsuhiro MATSUMOTO, Kosuke YAMADA, Masato YAMASHITA
  • Publication number: 20230064278
    Abstract: A fixation device includes: a heating roll that heats a transported recording medium whose front end is gripped by a gripping part while rotating; a pressing roll that is disposed so as to face the heating roll, around which at least a part of the transported recording medium is wound, and presses the wound part of the recording medium toward the heating roll while rotating; a peeling part that peels the recording medium off from the pressing roll by lifting the front end of the recording medium up in a state where the front end of the recording medium has passed a portion where the pressing roll and the heating roll face each other and is no longer gripped by the gripping part; and a reducing part that reduces momentum of the peeling part lifting the front end of the recording medium up.
    Type: Application
    Filed: December 3, 2021
    Publication date: March 2, 2023
    Applicant: FUJIFILM Business Innovation Corp.
    Inventors: Tetsuro KODERA, Kosuke YAMADA
  • Patent number: 11592769
    Abstract: A fixation device includes: a heating roll that heats a transported recording medium whose front end is gripped by a gripping part while rotating; a pressing roll that is disposed so as to face the heating roll, around which at least a part of the transported recording medium is wound, and presses the wound part of the recording medium toward the heating roll while rotating; a peeling part that peels the recording medium off from the pressing roll by lifting the front end of the recording medium up in a state where the front end of the recording medium has passed a portion where the pressing roll and the heating roll face each other and is no longer gripped by the gripping part; and a reducing part that reduces momentum of the peeling part lifting the front end of the recording medium up.
    Type: Grant
    Filed: December 3, 2021
    Date of Patent: February 28, 2023
    Assignee: FUJIFILM Business Innovation Corp.
    Inventors: Tetsuro Kodera, Kosuke Yamada
  • Patent number: 11573509
    Abstract: A heating device includes a heating unit that heats in a non-contact manner an upper surface of a transport material that is transported; and a blowing unit that blows air against a lower surface of the transport material via multiple blowing holes that open with respect to the lower surface, the multiple blowing holes being disposed so that blowing holes that are closest and adjacent to each other in a transport direction of the transport material are shifted from each other in an intersection direction that intersects the transport direction.
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: February 7, 2023
    Assignee: FUJIFILM Business Innovation Corp.
    Inventors: Kosuke Yamada, Tetsuro Kodera, Takayuki Yamashita, Nobuyuki Nakayama
  • Patent number: 11561492
    Abstract: A transport device includes a transport unit that transports a sheet-like transport material without holding a one-end-side portion of the transport material in a transport direction and a blowing unit that blows air against a lower surface of the transport material that is transported by the transport unit via multiple blowing holes that open with respect to the lower surface, a wind speed of the blowing unit being higher on two end sides than on a central side in an intersection direction that intersects the transport direction.
    Type: Grant
    Filed: July 14, 2021
    Date of Patent: January 24, 2023
    Assignee: FUJIFILM Business Innovation Corp.
    Inventors: Tetsuro Kodera, Kosuke Yamada, Nobuyuki Nakayama, Takayuki Yamashita
  • Patent number: 11550242
    Abstract: A heating device includes a heating unit that heats in a non-contact manner an upper surface of a transport material that is transported, and a blowing unit that blows air against a lower surface of the transport material via a blowing hole that is provided in an opposing surface opposing the lower surface of the transport material, the opposing surface being obliquely disposed with respect to a horizontal direction.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: January 10, 2023
    Assignee: FUJIFILM Business Innovation Corp.
    Inventors: Kosuke Yamada, Tetsuro Kodera, Takayuki Yamashita, Nobuyuki Nakayama