Abstract: According to one embodiment, a semiconductor memory device comprises an input circuit configured to input data, a memory cell array which includes memory cells enabling data to be held and to which the input data is written, a control circuit configured to control operation of a memory relating to the data, and a training circuit configured to execute training of the input circuit in parallel with the operation of the memory.

Abstract: A method for manufacturing a semiconductor device of one embodiment of the present invention includes: forming an insulation layer to be processed over a substrate; forming a first sacrificial layer in a first area over the substrate, the first sacrificial layer being patterned to form in the first area a functioning wiring connected to an element; forming a second sacrificial layer in a second area over the substrate, the second sacrificial layer being patterned to form in the second area a dummy wiring; forming a third sacrificial layer at a side wall of the first sacrificial layer and forming a fourth sacrificial layer at a side wall of the second sacrificial layer, the third sacrificial layer and the fourth sacrificial layer being separated; forming a concavity by etching the insulation layer to be processed using the third sacrificial layer and the fourth sacrificial layer as a mask; and filling a conductive material in the concavity.

Abstract: According to one embodiment, a semiconductor memory device comprises an input circuit configured to input data, a memory cell array which includes memory cells enabling data to be held and to which the input data is written, a control circuit configured to control operation of a memory relating to the data, and a training circuit configured to execute training of the input circuit in parallel with the operation of the memory.

Abstract: According to one embodiment, a semiconductor memory device includes a memory including a memory cell array, and an input/output pin configured to transfer data, a command, and an address from an external to the memory. The memory includes a termination circuit provided between the input/output pin and the memory cell array, and configured to supply a first voltage having a first amplitude in a first transfer mode and supply a second voltage having a second amplitude in a second transfer mode, a first intermediate value of the first amplitude being different from a second intermediate value of the second amplitude.

Abstract: According to one embodiment, a ZQ calibration circuit comprises a replica buffer controller configured to apply electric stress to a replica buffer circuit with a circuit configuration substantially identical to a circuit configuration of an output buffer circuit according to a usage status of the output buffer circuit during a period when no calibration operation is performed.

Abstract: A method for manufacturing a semiconductor device of one embodiment of the present invention includes: forming an insulation layer to be processed over a substrate; forming a first sacrificial layer in a first area over the substrate, the first sacrificial layer being patterned to form in the first area a functioning wiring connected to an element; forming a second sacrificial layer in a second area over the substrate, the second sacrificial layer being patterned to form in the second area a dummy wiring; forming a third sacrificial layer at a side wall of the first sacrificial layer and forming a fourth sacrificial layer at a side wall of the second sacrificial layer, the third sacrificial layer and the fourth sacrificial layer being separated; forming a concavity by etching the insulation layer to be processed using the third sacrificial layer and the fourth sacrificial layer as a mask; and filling a conductive material in the concavity.

Abstract: A method for manufacturing a semiconductor device of one embodiment of the present invention includes: forming an insulation layer to be processed over a substrate; forming a first sacrificial layer in a first area over the substrate, the first sacrificial layer being patterned to form in the first area a functioning wiring connected to an element; forming a second sacrificial layer in a second area over the substrate, the second sacrificial layer being patterned to form in the second area a dummy wiring; forming a third sacrificial layer at a side wall of the first sacrificial layer and forming a fourth sacrificial layer at a side wall of the second sacrificial layer, the third sacrificial layer and the fourth sacrificial layer being separated; forming a concavity by etching the insulation layer to be processed using the third sacrificial layer and the fourth sacrificial layer as a mask; and filling a conductive material in the concavity.

Abstract: A control circuit of a semiconductor memory controls the semiconductor memory and configures a memory system with the semiconductor memory. The memory system is supplied with power from a power supply. The memory system transits between a first state and a second state in which a load current of the memory system is different from each other. The control circuit is configured to receive a terminal voltage of the power supply as a first terminal voltage when the memory system is in the first state. The control circuit is configured to receive a terminal voltage of the power supply as a second terminal voltage when the memory system is in the second state. The control circuit is configured to judge whether a difference between the first terminal voltage and the second terminal voltage is larger than a certain value.

Abstract: A method for manufacturing a semiconductor device of one embodiment of the present invention includes: forming an insulation layer to be processed over a substrate; forming a first sacrificial layer in a first area over the substrate, the first sacrificial layer being patterned to form in the first area a functioning wiring connected to an element; forming a second sacrificial layer in a second area over the substrate, the second sacrificial layer being patterned to form in the second area a dummy wiring; forming a third sacrificial layer at a side wall of the first sacrificial layer and forming a fourth sacrificial layer at a side wall of the second sacrificial layer, the third sacrificial layer and the fourth sacrificial layer being separated; forming a concavity by etching the insulation layer to be processed using the third sacrificial layer and the fourth sacrificial layer as a mask; and filling a conductive material in the concavity.

Abstract: A method for manufacturing a semiconductor device of one embodiment of the present invention includes: forming an insulation layer to be processed over a substrate; forming a first sacrificial layer in a first area over the substrate, the first sacrificial layer being patterned to form in the first area a functioning wiring connected to an element; forming a second sacrificial layer in a second area over the substrate, the second sacrificial layer being patterned to form in the second area a dummy wiring; forming a third sacrificial layer at a side wall of the first sacrificial layer and forming a fourth sacrificial layer at a side wall of the second sacrificial layer, the third sacrificial layer and the fourth sacrificial layer being separated; forming a concavity by etching the insulation layer to be processed using the third sacrificial layer and the fourth sacrificial layer as a mask; and filling a conductive material in the concavity.

Abstract: A buffer circuit includes a first current mirror circuit, a second current mirror circuit, a first transistor, and a second transistor. The first current mirror circuit passes a first mirror current through a second node, corresponding to a first current passed through a first node, and is activated based on a first activating signal. The second current mirror circuit is connected to the first node and the second node, passes a second mirror current through the second node, corresponding to a second current passed through the first node, and is activated based on a second activating signal. The first transistor has a gate to which a reference voltage is applied and has a drain connected to the first node. The second transistor has a gate to which an input voltage is applied and has a drain connected to the second node.

Abstract: A buffer circuit includes a first current mirror circuit, a second current mirror circuit, a first transistor, and a second transistor. The first current mirror circuit passes a first mirror current through a second node, corresponding to a first current passed through a first node, and is activated based on a first activating signal. The second current mirror circuit is connected to the first node and the second node, passes a second mirror current through the second node, corresponding to a second current passed through the first node, and is activated based on a second activating signal. The first transistor has a gate to which a reference voltage is applied and has a drain connected to the first node. The second transistor has a gate to which an input voltage is applied and has a drain connected to the second node.

Abstract: According to one embodiment, a first CMOS inverter receives an input signal corresponding to a first power supply voltage, and is driven by a second power supply voltage which is smaller than the first power supply voltage; a second CMOS inverter is connected to a rear stage of the first CMOS inverter, and is driven by the second power supply voltage; a first driving adjustment circuit adjusts a current driving force of a low level output of the first CMOS inverter; and a second driving adjustment circuit adjusts a current driving force of a low level output of the second CMOS inverter.

Abstract: According to one embodiment, an input buffer includes a comparator that compares an input signal with a reference voltage, an inverter that inverts an output signal of the comparator, and a drive adjusting circuit that adjusts a current driving force of the inverter.

Abstract: According to one embodiment, a first CMOS inverter receives an input signal corresponding to a first power supply voltage, and is driven by a second power supply voltage which is smaller than the first power supply voltage; a second CMOS inverter is connected to a rear stage of the first CMOS inverter, and is driven by the second power supply voltage; a first driving adjustment circuit adjusts a current driving force of a low level output of the first CMOS inverter; and a second driving adjustment circuit adjusts a current driving force of a low level output of the second CMOS inverter.

Abstract: A method for manufacturing a semiconductor device of one embodiment of the present invention includes: forming an insulation layer to be processed over a substrate; forming a first sacrificial layer in a first area over the substrate, the first sacrificial layer being patterned to form in the first area a functioning wiring connected to an element; forming a second sacrificial layer in a second area over the substrate, the second sacrificial layer being patterned to form in the second area a dummy wiring; forming a third sacrificial layer at a side wall of the first sacrificial layer and forming a fourth sacrificial layer at a side wall of the second sacrificial layer, the third sacrificial layer and the fourth sacrificial layer being separated; forming a concavity by etching the insulation layer to be processed using the third sacrificial layer and the fourth sacrificial layer as a mask; and filling a conductive material in the concavity.

Abstract: A method for manufacturing a semiconductor device of one embodiment of the present invention includes: forming an insulation layer to be processed over a substrate; forming a first sacrificial layer in a first area over the substrate, the first sacrificial layer being patterned to form in the first area a functioning wiring connected to an element; forming a second sacrificial layer in a second area over the substrate, the second sacrificial layer being patterned to form in the second area a dummy wiring; forming a third sacrificial layer at a side wall of the first sacrificial layer and forming a fourth sacrificial layer at a side wall of the second sacrificial layer, the third sacrificial layer and the fourth sacrificial layer being separated; forming a concavity by etching the insulation layer to be processed using the third sacrificial layer and the fourth sacrificial layer as a mask; and filling a conductive material in the concavity.

Abstract: There is provided a non-volatile memory having electrically rewritable non-volatile memory cells arranged therein. A controller controls operation at the non-volatile memory. The non-volatile memory comprises a status output section configured to output status information indicating a status of read operation, write operation or erase operation in the non-volatile memory cell. The controller comprises a control signal generating section configured to output a control signal for a certain operation in the non-volatile memory, and a control signal switching section configured to instruct the control signal generating section to switch the control signal based on the status information.

Abstract: The present invention provides a semiconductor memory device that can minimize the widening of the threshold voltage distribution of cell transistors during a data erasing operation.

Abstract: A nonvolatile semiconductor memory device includes a plurality of memory cells, a read/program circuit which supplies a program voltage and a program verification voltage to the plurality of memory cells and desired data is programmed, supplies a first program verification voltage to the plurality of memory cells and then supplies a second program verification voltage to the plurality of memory cells when programming the data, and a read/program control circuit which determines memory cells which reach a first data program state and memory cells which do not reach the first data program state when supplying the first program verification voltage, and determines memory cells which reach a second data program state and memory cells which do not reach the second data program state when supplying the second program verification voltage, and supplies a program control voltage which changes the program operation state for each memory cell.