Abstract: An upper board having an opening and forming a circuit on a surface layer, a connection sheet between boards having an opening and forming conductive holes filled with conductive paste in through-holes, and a lower board forming a circuit on a surface layer are stacked up, heated and pressed. In particular, the connection sheet between boards is made of a material different from the upper board and the lower board. A multi-layer circuit board having a cavity structure, and a full-layer IVH structure with high interlayer connection reliability can be manufactured.

Abstract: A lower sub-board of a circuit board includes a first base layer having an upper surface, and a first wiring pattern provided on the upper surface of the first base layer. An upper sub-board of a circuit board includes a second base layer having a lower surface, and a second wiring pattern provided on the lower surface of the second base layer. A connection layer between lower and upper sub-boards includes an insulating layer having a lower surface and an upper surface, the lower surface of connection layer being situated on the upper surface of the first base layer, the upper surface of connection layer being situated on the lower surface of the second base layer, and a via-conductor passing through the insulating layer and connected to the first and second wiring patterns. This circuit board connects the sub-boards to each other via a via-conductor densely.

Abstract: A solid printed circuit board is manufactured by bonding upper and lower printed circuit boards having different shapes and provided with wirings formed on surfaces thereof. A bonding layer is made of insulating material containing thermosetting resin and inorganic filler dispersed therein, and has a via-conductor made of conductive paste filling a through-hole perforated in a predetermined position of the bonding layer. This circuit board provides a packaging configuration achieving small size and thickness and three-dimensional mounting suitable for semiconductors of high performance and multiple-pin structure.

Abstract: A solid printed circuit board is manufactured by bonding upper and lower printed circuit boards having different shapes and provided with wirings formed on surfaces thereof. A bonding layer is made of insulating material containing thermosetting resin and inorganic filler dispersed therein, and has a via-conductor made of conductive paste filling a through-hole perforated in a predetermined position of the bonding layer. This circuit board provides a packaging configuration achieving small size and thickness and three-dimensional mounting suitable for semiconductors of high performance and multiple-pin structure.

Abstract: A lower sub-board of a circuit board includes a first base layer having an upper surface, and a first wiring pattern provided on the upper surface of the first base layer. An upper sub-board of a circuit board includes a second base layer having a lower surface, and a second wiring pattern provided on the lower surface of the second base layer. A connection layer between lower and upper sub-boards includes an insulating layer having a lower surface and an upper surface, the lower surface of connection layer being situated on the upper surface of the first base layer, the upper surface of connection layer being situated on the lower surface of the second base layer, and a via-conductor passing through the insulating layer and connected to the first and second wiring patterns. This circuit board connects the sub-boards to each other via a via-conductor densely.

Abstract: An upper board having an opening and forming a circuit on a surface layer, a connection sheet between boards having an opening and forming conductive holes filled with conductive paste in through-holes, and a lower board forming a circuit on a surface layer are stacked up, heated and pressed. In particular, the connection sheet between boards is made of a material different from the upper board and the lower board. A multi-layer circuit board having a cavity structure, and a full-layer IVH structure with high interlayer connection reliability can be manufactured.