Abstract: A method of manufacturing a bonded substrate includes: preparing one or plurality of products to be bonded, each including a brazing material layer and a copper plate laminated on both main surfaces of a ceramic substrate, laminating, one or a plurality of products bonded and a pair of clamping members that clamp them while providing a mold releasing layer between each thereof, heating the one or the plurality of products while pressing the one or the plurality of products in the pair of clamping members to obtain the one or the plurality of bonded substrates in which the ceramic substrate and the copper plate are bonded with a bonding layer, and removing the mold releasing layer from the bonded substrate by dissolving a portion in contact with the mold releasing layer of the copper plate included in the bonded substrate by wet etching.

Abstract: An image forming system includes an image forming apparatus including an image forming unit and a fixing unit; a folding processing portion; a pressure-bonding portion; and an input portion capable of selecting a pressure-bonding mode in which a pressure-bonding print prepared by subjecting the recording material to pressure-bonding processing by the folding processing portion and the pressure-bonding portion and capable of selecting a layout of the toner image formed on the recording material. When the pressure-bonding mode is selected, the layout depending on the pressure-bonding mode is selected.

Abstract: An image forming system includes an image forming apparatus including a fixing unit, a folding processing portion, and a pressure-bonding portion. A first recording material having a first basis weight is fixed at a first temperature by the fixing unit and then is pressure-bonded by the pressure-bonding portion after a lapse of a first period. A second recording material having a second basis weight is fixed at a second temperature by the fixing unit and then is pressure-bonded by the pressure-bonding portion after a lapse of a second period. The second basis weight is larger than the first basis weight. The second temperature is higher than the first temperature. The second period is longer than the first period.

Abstract: Provided are a reducing electroless silver plating solution and a reducing electroless silver plating method using the silver plating solution, the reducing electroless silver plating solution being capable of preventing decomposition of silver in the plating solution thereby to maintain stability of the solution and also being capable of preventing excessive roughening of an underlying metal or the like thereby to form a plating film having good film characteristics and a good appearance. The reducing electroless silver plating solution according to the present invention comprises a water-soluble silver salt and a reducing agent, wherein cyanide ions in a concentration of 0.006×10?3 mol/L to 12.5×10?3 mol/L are contained.