Patents by Inventor Kota Nakao
Kota Nakao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240107678Abstract: A method of manufacturing a bonded substrate includes: preparing one or plurality of products to be bonded, each including a brazing material layer and a copper plate laminated on both main surfaces of a ceramic substrate, laminating, one or a plurality of products bonded and a pair of clamping members that clamp them while providing a mold releasing layer between each thereof, heating the one or the plurality of products while pressing the one or the plurality of products in the pair of clamping members to obtain the one or the plurality of bonded substrates in which the ceramic substrate and the copper plate are bonded with a bonding layer, and removing the mold releasing layer from the bonded substrate by dissolving a portion in contact with the mold releasing layer of the copper plate included in the bonded substrate by wet etching.Type: ApplicationFiled: November 30, 2023Publication date: March 28, 2024Inventors: Kota KITAJIMA, Takahiko HONDA, Kazutaka NAKAO, Masayuki UETANI, Izumi MASUDA, Akihiro URANO
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Publication number: 20240092061Abstract: A joined article including: a resin (1) having a linear expansion coefficient at 30° C. to 200° C. of 17 ppm/° C. or higher and a thickness of 5 to 100 ?m; and a metal joined to a surface of the resin (1) and having a thickness of 5 to 50 ?m. The resin (1) includes a heat-affected layer that is close to the metal and that occupies 80% or less of the thickness of the resin (1), and the joined article is a dielectric material for a substrate. Also disclosed is a substrate including the joined article and a resin (2) stacked on the joined article.Type: ApplicationFiled: October 27, 2023Publication date: March 21, 2024Applicants: THE UNIVERSITY OF TOKYO, DAIKIN INDUSTRIES, LTD.Inventors: Keisuke NAGATO, Kota AONO, Yusuke EBIHARA, Masayuki NAKAO, Yuki UEDA, Shingo OKUNO, Hirokazu KOMORI, Akiyoshi YAMAUCHI, Yosuke KISHIKAWA
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Publication number: 20220298386Abstract: A pressure-sensitive adhesive tape of the present invention includes thermally expandable microspheres, wherein the thermally expandable microspheres are each formed of a shell and a volatile substance contained in the shell, and wherein the shell is formed of a resin having a glass transition temperature (Tg) of 120° C. or more. In one embodiment, the resin for forming the shell contains a constituent unit having a carboxyl group.Type: ApplicationFiled: July 28, 2020Publication date: September 22, 2022Applicant: NITTO DENKO CORPORATIONInventors: Kota NAKAO, Kazuki SOEJIMA
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Publication number: 20210257684Abstract: Provided is a gas adsorption sheet for a secondary battery, which contains gas adsorbent particles excellent in gas adsorption property, and allows the gas adsorption performance of the gas adsorbent particles to be sufficiently exhibited. According to one embodiment of the present invention, there is provided a gas adsorption sheet for a secondary battery, including: a heat-resistant base material; and a gas adsorption layer arranged on at least one surface of the heat-resistant base material, wherein the gas adsorption layer contains: a binder resin; and gas adsorbent particles each of which is formed of an inorganic porous material having pores, and is capable of adsorbing a gas.Type: ApplicationFiled: June 17, 2019Publication date: August 19, 2021Applicant: NITTO DENKO CORPORATIONInventors: Kota NAKAO, Daisuke SHIMOKAWA, Shigeki KAWABE, Mitsuru NOZUE, Minoru YAGI
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Patent number: 9683138Abstract: A pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer and a base including a metal layer and a resin layer, and a product of an initial elastic modulus of the base and a total thickness of the base is 3000 N/mm or less, and a separation distance is 2 mm or less, the separation distance is measured with a peel test with a constant load as follows: a test piece of the pressure-sensitive adhesive sheet having a 10 mm width and a 100 mm length is attached to a surface of a stainless steel test plate and then, the test plate is left standing at a temperature of 23° C. for twenty four hours and then, a load of 100 gf is applied to one end of a length dimension of the test piece vertical to the surface of the test plate and a separation distance of the test piece is measured after one hour.Type: GrantFiled: June 17, 2016Date of Patent: June 20, 2017Assignee: NITTO DENKO CORPORATIONInventors: Kenji Furuta, Yoshio Terada, Kota Nakao, Akira Hirao, Ryo Morioka
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Publication number: 20160376473Abstract: A pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer and a base including a metal layer and a resin layer, and a product of an initial elastic modulus of the base and a total thickness of the base is 3000 N/mm or less, and a separation distance is 2 mm or less, the separation distance is measured with a peel test with a constant load as follows: a test piece of the pressure-sensitive adhesive sheet having a 10 mm width and a 100 mm length is attached to a surface of a stainless steel test plate and then, the test plate is left stand at a temperature of 23° C. for twenty four hours and then, a load of 100 gf is applied to one end of a length dimension of the test piece vertical to the surface of the test plate and a separation distance of the test piece is measured after one hour.Type: ApplicationFiled: June 17, 2016Publication date: December 29, 2016Applicant: NITTO DENKO CORPORATIONInventors: Kenji FURUTA, Yoshio TERADA, Kota NAKAO, Akira HIRAO, Ryo MORIOKA
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Publication number: 20160208142Abstract: A pressure-sensitive adhesive sheet according to the present invention includes a pressure-sensitive adhesive layer including an acrylic polymer, and a release liner including a release layer made of a silicone release agent, the release layer being applied on the pressure-sensitive adhesive layer. The acrylic polymer includes at least one alkyl(meth)acrylate whose alkyl group being a linear or branched chain alkyl group with a carbon number of 1 to 18 as a monomer unit, and an amount of siloxane gas generated in a unit area of the pressure-sensitive adhesive layer where the release liner is removed is less than 20.0 ng/cm2 after heating at 120° C. for ten minutes.Type: ApplicationFiled: January 6, 2016Publication date: July 21, 2016Applicant: NITTO DENKO CORPORATIONInventors: Kenji FURUTA, Yoshio TERADA, Kota NAKAO
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Publication number: 20130040132Abstract: A conductive adhesive tape includes a conductive layer; an adhesive layer formed at one side in the thickness direction of the conductive layer and containing an adhesive and a conductive filler; and a metal layer interposed between the conductive layer and the adhesive layer. The maximum resistance value in the first cycle measured in a heat cycle test is 0.1? or less, and the resistance value increase rate is 100% or less.Type: ApplicationFiled: August 13, 2012Publication date: February 14, 2013Applicant: NITTO DENKO CORPORATIONInventors: Kota NAKAO, Noritsugu DAIGAKU, Yasushi BUZOJIMA, Hiroshi YAMAZAKI, Yoshihisa FURUTA
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Publication number: 20130004767Abstract: Provided is an electroconductive pressure-sensitive adhesive tape which can exhibit stable electrical conductivity even when used over a long duration and/or used under severe environmental conditions. The electroconductive pressure-sensitive adhesive tape has a metallic foil and, on one side thereof, a pressure-sensitive adhesive layer, in which the electroconductive pressure-sensitive adhesive tape has a maximum resistance in the first cycle of 1 ? or less and has a maximum resistance in the 200th cycle being 5 times or less the maximum resistance in the first cycle, as measured in a thermo-cycle test.Type: ApplicationFiled: February 28, 2011Publication date: January 3, 2013Applicant: NITTO DENKO CORPORATIONInventors: Noritsugu Daigaku, Kota Nakao, Ai Murakami, Takahiro Nonaka, Hironori Tamai, Yasushi Buzoujima, Shinya Nakano, Shinatarou Taira, Tetsuya Otsuka
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Publication number: 20120325518Abstract: Disclosed is a conductive adhesive tape which can exhibit extremely stable electroconductivity upon use over a long duration and/or use under severe environmental conditions even when applied in a small area. The conductive thermosetting adhesive tape includes a metallic foil; and a thermosetting adhesive layer on one side of the metallic foil. The thermosetting adhesive layer has a bond strength before curing of 2 N/20 mm or more and a bond strength after curing of 10 N/20 mm or more. The conductive thermosetting adhesive tape is preferably one including the metallic foil; the thermosetting adhesive layer on one side of the metallic foil; and a terminal exposed from the surface of the thermosetting adhesive layer, in which the conductive thermosetting adhesive tape has a total area of the terminal present per 30 mm2 of the surface of the thermosetting adhesive layer of from 0.1 to 5 mm2.Type: ApplicationFiled: June 22, 2012Publication date: December 27, 2012Applicant: NITTO DENKO CORPORATIONInventors: Kota NAKAO, Noritsugu DAIGAKU, Yasushi BUZOJIMA, Yoshihisa FURUTA, Takahiro NONAKA
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Publication number: 20120160539Abstract: A conductive adhesive tape includes a conductive layer, and an adhesive layer formed on the surface of the conductive layer. In the adhesive layer, an adhesive layer through-hole penetrating the adhesive layer in the thickness direction thereof is formed. The conductive layer includes a conductive layer passage portion formed in the adhesive layer through-hole. A low melting point metal layer is provided at an end face of the conductive layer passage portion, the end face reaching surface of the adhesive layer.Type: ApplicationFiled: December 20, 2011Publication date: June 28, 2012Applicant: NITTO DENKO CORPORATIONInventors: Takahiro NONAKA, Noritsugu DAIGAKU, Ai MURAKAMI, Kota NAKAO, Hiroshi YAMAZAKI
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Publication number: 20110318573Abstract: The present invention has an object to provide an electroconductive pressure-sensitive adhesive tape that achieves excellent tackiness and high electrical conductivity even when it is used in a finer shape (in particular, a narrow shape) and that has a small change in resistance value over time and achieves stable electrical conductivity even when it is used for a long time or in a harsh environment. The electroconductive pressure-sensitive adhesive tape of the present invention is an adhesive tape including a metal foil and a pressure-sensitive adhesive layer having an electroconductive filler on at least one side of the metal foil. The electroconductive pressure-sensitive adhesive tape has a surface exposure ratio of the electroconductive filler on a surface of the pressure-sensitive adhesive layer of 2 to 5%.Type: ApplicationFiled: June 22, 2011Publication date: December 29, 2011Applicant: NITTO DENKO CORPORATIONInventors: Kota Nakao, Yasushi Buzojima, Ai Murakami, Takahiro Nonaka