Abstract: A method is provided for removing a coating from a coated magnesium alloy product. The method includes a first treatment step of immersing the coated magnesium alloy product in a first alkaline solution, and a second treatment step of immersing the magnesium alloy product, which has undergone the first treatment step, in a second alkaline solution or in an acid solution. The second alkaline solution is different from the first alkaline solution.

Abstract: A metal object is formed by die-casting with the use of a specially treated mold. The mold has cavity-defining surfaces covered by a heat-insulating layer made of a material that includes ceramic powder and heat-resistant resin. Molten metal is injected into the cavity coated with the heat-insulating layer.

Abstract: A method is provided for removing a coating from a coated magnesium alloy product. The method includes a first treatment step of immersing the coated magnesium alloy product in a first alkaline solution, and a second treatment step of immersing the magnesium alloy product, which has undergone the first treatment step, in a second alkaline solution or in an acid solution. The second alkaline solution is different from the first alkaline solution.

Abstract: A method is provided for removing a paint layer formed on a Mg-alloy material. The method includes a physical removing step and a chemical removing step. At the physical removing step, the paint layer is partially removed by using a cutter or by wet blasting. Then, the paint layer is peeled by immersing the Mg-alloy material in an alkali parting agent.

Abstract: A metal housing is composed of a housing base and auxiliary components such as a sidewall frame, internally threaded bosses and a rib. The housing base is prepared by sheet metal forming, while the auxiliary components are prepared by die-casting, thixo molding or forging. The auxiliary components are fixed to the housing base by an adhesive that contains metal powder consisting of metal particles.

Abstract: A method is provided for removing a paint layer formed on a Mg-alloy material. The method includes a physical removing step and a chemical removing step. At the physical removing step, the paint layer is partially removed by using a cutter or by wet blasting. Then, the paint layer is peeled by immersing the Mg-alloy material in an alkali parting agent.

Abstract: A metal object is formed by die-casting with the use of a specially treated mold. The mold has cavity-defining surfaces covered by a heat-insulating layer made of a material that includes ceramic powder and heat-resistant resin. Molten metal is injected into the cavity coated with the heat-insulating layer.

Abstract: A method is provided for removing a coating from a coated magnesium alloy product. The method includes a first treatment step of immersing the coated magnesium alloy product in a first alkaline solution, and a second treatment step of immersing the magnesium alloy product, which has undergone the first treatment step, in a second alkaline solution or in an acid solution. The second alkaline solution is different from the first alkaline solution.

Abstract: A metal housing is composed of a housing base and auxiliary components such as a sidewall frame, internally threaded bosses and a rib. The housing base is prepared by sheet metal forming, while the auxiliary components are prepared by die-casting, thixo molding or forging. The auxiliary components are fixed to the housing base by an adhesive that contains metal powder consisting of metal particles.

Abstract: A box-shaped plastic housing of integrally molded resin comprises a flat-shaped bottom wall having a peripheral edge and an upright wall extending upwardly from the peripheral edge of the bottom wall. The bottom wall and the upright wall cooperatively define an integral box-shaped molded product. The thickness of the bottom wall is in the range of two-thirds to one-third with respect to the thickness of the upright wall. The bottom wall is provided with at least one rib on its inner surface. The housing is produced by an injection molding process using a mold having a mold cavity which is provided with a groove on the inner surface of the cavity corresponding to each rib.

Abstract: An electronic apparatus comprising a housing, and an electronic part accommodated in the housing, wherein the housing includes a metallic member and a resin member molded integrally with the metallic member, the metallic member forming an outside part of the housing and being treated on its outer surface for enhancing a coefficient of heat radiation.

Abstract: A polyamide resin composition including 100 parts by weight of a resin composition containing of 20 to 80% by weight of an aromatic polyamide resin and 80 to 20% by weight of a modified polyphenylene ether resin (the total amount in% by weight of the aromatic polyamide resin and the modified polyphenylene ether resin being 100% by weight) and, incorporated in the resin composition, 0.5 to 30 parts by weight of a liquid-crystalline polymer, 0.01 to 3 parts by weight of a compatibilizing agent and 2 to 40 parts by weight of an inorganic filler and optionally a rubber component. The plate thickness of the resin molded articles may be reduced to 2 mm or less, and even further to 1 mm or less without deterioration of the properties thereof.

Abstract: A polyamide resin composition including 100 parts by weight of a resin composition containing of 20 to 80% by weight of an aromatic polyamide resin and 80 to 20% by weight of a modified polyphenylene ether resin (the total amount in % by weight of the aromatic polyamide resin and the modified polyphenylene ether resin being 100% by weight) and, incorporated in the resin composition, 0.5 to 30 parts by weight of a liquid-crystalline polymer, 0.01 to 3 parts by weight of a compatibilizing agent and 2 to 40 parts by weight of an inorganic filler and optionally a rubber component. The plate thickness of the resin molded articles may be reduced to 2 mm or less, and even further to 1 mm or less without deterioration of the properties thereof.

Abstract: An injection molding process for producing an integrally molded box-shaped plastic housing of a resin material. The housing includes integral portions of a bottom wall of a first thickness and an upright wall of a second thickness, the first thickness being in the range of from one-third to two-thirds of the second thickness and the bottom wall portion including at least one integral rib structure. A cavity is formed in a mold having cavity portions, respectively corresponding to the bottom and upright wall portions and the rib structure, in fluid communication. Fluid resin is injected through respective injection gates directly communicating with the rib structure cavity portion and the upright wall cavity portion, which provide passageways for flow of the liquid resin therethrough, thereby completely filling all cavity portions.

Abstract: A lower alkyl polysilsesquioxane having a general formula ##STR1## wherein R is CH.sub.3 is C.sub.2 H.sub.5, and n is an integer equal to about 50 to about 10,000, prepared by (a) dissolving a lower alkyl trifunctional silane in an organic solvent at a temperature of -31 20.degree. C. to -50.degree. C. to form an organic solution thereof; (b) hydrolyzing the lower alkyl trifunctional silane by dropping water into the organic solution at a temperature of -20.degree. C. to -50.degree. C. under an inert gas pressurized at 1,000 to 3,000 Pa; and (c) gradually heating the organic solution together with a water phase lying therebeneath up to a temperature of 60.degree. C. to 100.degree. C. under an inert gas pressurized at 1,000 to 3,000 Pa.

Abstract: A high-energy radiation-sensitive pattern-forming resist material consisting of polysilsesquioxane having no hydroxyl group in its molecule. The pattern-forming material of this invention has an improved sensitivity to high-energy radiation exposure, a high resistance to dry etching, a high resolution capability, and an improved thermal stability.

Abstract: A lower alkyl polysilsesquioxane having a general formula ##STR1## wherein R is CH.sub.3 or C.sub.2 H.sub.5, and n is an integer equal to about 50 to about 10,000, prepared by (a) dissolving a lower alkyl trifunctional silane in an organic solvent at a temperature of -20.degree. C. to -50.degree. C. to form an organic solution thereof; (b) hydrolyzing the lower alkyl trifunctional silane by dropping water into the organic solution at a temperature of -20.degree. C. to -50.degree. C. under an inert gas pressurized at 1,000 to 3,000 Pa; and (c) gradually heating the organic solution together with a water phase lying therebeneath up to a temperature of 60.degree. C. to 100.degree. C. under an inert gas pressurized at 1,000 to 3,000 Pa.

Abstract: A high-energy radiation-sensitive pattern-forming resist material consisting of polysilsesquioxane having no hydroxyl group in its molecule. The pattern-forming material of this invention has an improved sensitivity to high-energy radiation exposure, a high resistance to dry etching, a high resolution capability, and an improved thermal stability.