Abstract: Provided is a gas barrier laminate film capable of realizing excellent gas barrier property, water resistance, and adhesiveness, having a plastic substrate (A), a silicon oxide layer (B) formed on at least one surface of the plastic substrate (A), and a coat layer (C) formed by applying a coating solution onto a surface of the silicon oxide layer (B), wherein the coating solution comprises a mixture of a polyurethane-based resin (c1) and a silane coupling agent (c2) and contains a reaction product of (c1) with (c2) as a main component; and a number-average molecular weight of the reaction product is in the range of 100,000 to 1,000,000.

Abstract: Provided is a gas barrier laminate film capable of realizing excellent gas barrier property, water resistance, and adhesiveness, having a plastic substrate (A), a silicon oxide layer (B) formed on at least one surface of the plastic substrate (A), and a coat layer (C) formed by applying a coating solution onto a surface of the silicon oxide layer (B), wherein the coating solution comprises a mixture of a polyurethane-based resin (c1) and a silane coupling agent (c2) and contains a reaction product of (c1) with (c2) as a main component; and a number-average molecular weight of the reaction product is in the range of 100,000 to 1,000,000.

Abstract: Provided are a method for producing a film, which is satisfactory in productivity, exhibits high gas-barrier property immediately after production, and has excellent adhesive strength between constituent layers while maintaining the excellent gas-barrier property, and a gas-barrier film, which is obtained by the method. The method for producing a gas-barrier film includes the steps of: (1) forming an inorganic thin film by a vacuum deposition method on at least one surface of a base film; (2) forming a thin film by a plasma CVD method on the inorganic thin film formed in the step (1); and (3) forming an inorganic thin film by the vacuum deposition method on the thin film formed in the step (2), in which each of the steps (1) and (3), and the step (2) are sequentially carried out at a pressure of 1×10?7 to 1 Pa, and at a pressure of 1×10?3 to 1×102 Pa, respectively.

Abstract: Provided are a method for producing a film, which is satisfactory in productivity, exhibits high gas-barrier property immediately after production, and has excellent adhesive strength between constituent layers while maintaining the excellent gas-barrier property, and a gas-barrier film, which is obtained by the method. The method for producing a gas-barrier film includes the steps of; (1) forming an inorganic thin film by a vacuum deposition method on at least one surface of a base film; (2) forming a thin film by a plasma CVD method on the inorganic thin film formed in the step (1); and (3) forming an inorganic thin film by the vacuum deposition method on the thin film formed in the step (2), in which each of the steps (1) and (3), and the step (2) are sequentially carried out at a pressure of 1×10?7 to 1 Pa, and at a pressure of 1×10?3 to 1×102 Pa, respectively.