Abstract: A non-combustion flavor inhalation article includes a heating device including a heater to be heated to a temperature between 80 and 140° C., and a roll including a tobacco sheet to be disposed in contact with the heater.

Abstract: A semiconductor package includes a board, an under fill resin layer provided on the board, and a semiconductor chip having a first face and a second face at an opposite side to the first face, the semiconductor chip being flip-chip mounted on the board via the under fill resin layer with the first face facing the board. The semiconductor chip is covered with the under fill resin layer over the first face and from the first face to an edge part of the second face.

Abstract: A non-combustion flavor inhalation article includes a heating device including a heater to be heated to a temperature between 80 and 140° C., and a roll including a tobacco sheet to be disposed in contact with the heater.

Abstract: An automatic soldering apparatus which makes it possible to automate the whole steps, from the step of feeding the work to the step of collecting the same, as well as simultaneously enhance the reliability in transportation and the economy in soldering operation. The automatic soldering apparatus has a track type transportation mechanism for slidably transporting the body of the work having lead portions to be soldered, through a track constituted by a plurality of long guide members; a fluxing unit and a soldering unit provided with respect to the track of the track type transportation mechanism and adapted to flux and solder the lead portions, respectively; a work feed unit provided at the starting end of the track type transportation mechanism and adapted to feed the work to the track type transportation mechanism; and a work collecting unit provided at the terminating end of the track type transportation mechanism and adapted to collect the work from the track type transportation mechanism.