Abstract: An ultrasound image apparatus irradiates a bonded wafer in which two or more wafers are bonded with an ultrasonic wave to generate an image of the bonded surface between the wafers. An ultrasonic probe irradiates the bonded wafer with the ultrasonic wave on a lower side of the bonded wafer. A liquid ejection unit moves together with the ultrasonic probe while continuously ejecting a liquid toward a bottom surface such that a liquid film in contact with the bottom surface is formed between the liquid ejection unit and the bottom surface of the bonded wafer. Also, a gas ejection device ejects gas for pushing down the liquid toward an outer peripheral end portion of the bonded wafer so that the liquid ejected from the liquid ejection unit does not infiltrate into the bonded surface from the outer peripheral end portion of the bonded wafer.

Abstract: Provided is an ultrasonic testing device with which it is possible to suitably detect internal defects in an article to be tested. For this purpose, the ultrasonic testing device comprises: an ultrasonic probe that generates ultrasonic waves and transmits the same to the article to be tested, and that receives reflected waves reflected from the article to be tested; and a computation processing unit.