Patents by Inventor Kotaro Ooishi
Kotaro Ooishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220317451Abstract: An optical unit of a head-mounted display device includes: a light-emitting unit configured to condense light emitted from a light source; a display unit configured to generate image light by using the light condensed in the light-emitting unit as illumination light; a projection lens configured to project the image light transmitted from the display unit; an optical axis conversion element configured to displace an optical axis of the image light projected from the projection lens; and a light-guide plate configured to receive the image light of which the optical axis is displaced by the optical axis conversion element, and to guide the image light to a wearer's pupil.Type: ApplicationFiled: March 10, 2022Publication date: October 6, 2022Inventors: Kotaro OOISHI, Takahiro MOURI
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Patent number: 10867814Abstract: Disclosed is a liquid processing method of drying a substrate held horizontally after supplying deionized water to the substrate. The liquid processing method includes: supplying the deionized water to a front surface of the substrate; supplying a first solvent to the front surface of the substrate after supplying the deionized water; supplying a water-repellent agent to the front surface of the substrate to impart water-repellency to the front surface of the substrate; supplying a second solvent to the front surface of the substrate to which water-repellency is imparted; and removing the second solvent from the front surface of the substrate. A specific gravity of the first solvent is smaller than a specific gravity of the water-repellent agent, and a specific gravity of the second solvent is larger than the specific gravity of the water-repellent agent.Type: GrantFiled: February 14, 2017Date of Patent: December 15, 2020Assignee: TOKYO ELECTRON LIMITEDInventors: Yosuke Kawabuchi, Kouzou Tachibana, Mitsunori Nakamori, Kotaro Ooishi, Keisuke Egashira, Koji Tanaka, Hiroaki Inadomi, Masami Yamashita, Yoshiteru Fukuda, Koji Yamashita, Yu Tsurifune, Takuro Masuzumi
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Patent number: 9922849Abstract: Disclosed is a substrate liquid processing apparatus. The substrate liquid processing apparatus includes a processing unit, a nozzle, a silylation liquid supply mechanism, and a blocking fluid supply mechanism. The processing unit performs a water repellency imparting processing on a substrate by supplying a silylation liquid to the substrate. The nozzle includes an ejection port configured to supply the silylation liquid to the substrate positioned in the processing unit, and a silylation liquid flow path in which the silylation liquid flows toward the ejection port. The silylation liquid supply mechanism supplies the silylation liquid to the silylation liquid flow path in the nozzle through a silylation liquid supply line. The blocking fluid supply mechanism supplies a blocking fluid that blocks the silylation liquid within the silylation liquid flow path in the nozzle from an atmosphere outside the ejection port.Type: GrantFiled: April 17, 2015Date of Patent: March 20, 2018Assignee: Tokyo Electron LimitedInventors: Yasuyuki Ido, Naoki Shindo, Takehiko Orii, Keisuke Egashira, Yosuke Hachiya, Kotaro Ooishi, Hisashi Kawano, Shinichiro Shimomura
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Publication number: 20170301534Abstract: This liquid treatment method for substrates involves performing: a liquid treatment step for liquid-treating a substrate with a treatment liquid; a rinse treatment step for rinsing the liquid-treated substrate with a rinsing liquid; a water-repellency treatment step for subjecting the rinsed substrate to a water-repellency treatment using a water-repellency-imparting solution; next, a substitution treatment step for subjecting the substrate subjected to the water-repellency treatment to a substitution treatment acceleration liquid; a cleaning treatment step for cleaning the substrate subjected to the water-repellency treatment by using a cleaning solution; and thereafter, a drying treatment step for substituting the cleaning solution with a drying solution having a higher volatility than that of the cleaning solution, and removing the drying solution from the substrate. Thus, it is possible to prevent pattern collapse during the drying treatment, and to decrease particles caused by watermarks.Type: ApplicationFiled: October 20, 2015Publication date: October 19, 2017Applicant: Tokyo Electron LimitedInventors: Mitsunori Nakamori, Teruomi Minami, Kotaro Ooishi, Jun Nonaka
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Publication number: 20170236729Abstract: Disclosed is a liquid processing method of drying a substrate held horizontally after supplying deionized water to the substrate. The liquid processing method includes: supplying the deionized water to a front surface of the substrate; supplying a first solvent to the front surface of the substrate after supplying the deionized water; supplying a water-repellent agent to the front surface of the substrate to impart water-repellency to the front surface of the substrate; supplying a second solvent to the front surface of the substrate to which water-repellency is imparted; and removing the second solvent from the front surface of the substrate. A specific gravity of the first solvent is smaller than a specific gravity of the water-repellent agent, and a specific gravity of the second solvent is larger than the specific gravity of the water-repellent agent.Type: ApplicationFiled: February 14, 2017Publication date: August 17, 2017Inventors: Yosuke Kawabuchi, Kouzou Tachibana, Mitsunori Nakamori, Kotaro Ooishi, Keisuke Egashira, Koji Tanaka, Hiroaki Inadomi, Masami Yamashita, Yoshiteru Fukuda, Koji Yamashita, Yu Tsurifune, Takuro Masuzumi
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Patent number: 9378940Abstract: The present disclosure provides a substrate processing apparatus including: a substrate processing chamber configured to process a substrate on which a target layer to be removed is formed on the surface of an underlying layer; a substrate holding unit provided in the substrate processing chamber and configured to hold the substrate; a mixed liquid supplying unit configured to supply a mixed liquid of sulfuric acid and hydrogen peroxide to the substrate held by the substrate holding unit in a mixing ratio of the hydrogen peroxide and a temperature that does not damage the underlying layer while removing the target layer; and an OH-group supplying unit configured to supply a fluid containing OH-group to the substrate in an amount that does not damage the underlying layer when the mixed liquid and the OH-group are mixed on the substrate.Type: GrantFiled: June 13, 2013Date of Patent: June 28, 2016Assignee: Tokyo Electron LimitedInventors: Hisashi Kawano, Norihiro Ito, Yosuke Hachiya, Jun Nogami, Kotaro Ooishi, Itaru Kanno
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Publication number: 20150318183Abstract: Disclosed is a substrate liquid processing apparatus. The substrate liquid processing apparatus includes a processing unit, a nozzle, a silylation liquid supply mechanism, and a blocking fluid supply mechanism. The processing unit performs a water repellency imparting processing on a substrate by supplying a silylation liquid to the substrate. The nozzle includes an ejection port configured to supply the silylation liquid to the substrate positioned in the processing unit, and a silylation liquid flow path in which the silylation liquid flows toward the ejection port. The silylation liquid supply mechanism supplies the silylation liquid to the silylation liquid flow path in the nozzle through a silylation liquid supply line. The blocking fluid supply mechanism supplies a blocking fluid that blocks the silylation liquid within the silylation liquid flow path in the nozzle from an atmosphere outside the ejection port.Type: ApplicationFiled: April 17, 2015Publication date: November 5, 2015Inventors: Yasuyuki Ido, Naoki Shindo, Takehiko Orii, Keisuke Egashira, Yosuke Hachiya, Kotaro Ooishi, Hisashi Kawano, Shinichiro Shimomura
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Publication number: 20130340796Abstract: The present disclosure provides a substrate processing apparatus including: a substrate processing chamber configured to process a substrate on which a target layer to be removed is formed on the surface of an underlying layer; a substrate holding unit provided in the substrate processing chamber and configured to hold the substrate; a mixed liquid supplying unit configured to supply a mixed liquid of sulfuric acid and hydrogen peroxide to the substrate held by the substrate holding unit in a mixing ratio of the hydrogen peroxide and a temperature that does not damage the underlying layer while removing the target layer; and an OH-group supplying unit configured to supply a fluid containing OH-group to the substrate in an amount that does not damage the underlying layer when the mixed liquid and the OH-group are mixed on the substrate.Type: ApplicationFiled: June 13, 2013Publication date: December 26, 2013Inventors: Hisashi Kawano, Norihiro Ito, Yosuke Hachiya, Jun Nogami, Kotaro Ooishi, Itaru Kanno
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Patent number: 8343284Abstract: A film removing device includes an approach stage having a flat approach part having a surface substantially flush with the surface of a substrate supported on a support member. The flat approach part faces a first side surface of the substrate at a corner of the substrate where the first side surface and a second side surface of the substrate join. A film removing nozzle spouts a solvent toward a peripheral part of the substrate and sucks a solution while being moved along the second side surface and the approach stage. A gas is spouted into a gap between the flat approach part and the corner of the substrate so that the gas flows through the gap toward the second side surface.Type: GrantFiled: June 17, 2011Date of Patent: January 1, 2013Assignee: Tokyo Electron LimitedInventors: Shigenori Kamei, Kotaro Ooishi, Masahito Hamada
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Publication number: 20110247659Abstract: A film removing device includes an approach stage having a flat approach part having a surface substantially flush with the surface of a substrate supported on a support member. The flat approach part faces a first side surface of the substrate at a corner of the substrate where the first side surface and a second side surface of the substrate join. A film removing nozzle spouts a solvent toward a peripheral part of the substrate and sucks a solution while being moved along the second side surface and the approach stage. A gas is spouted into a gap between the flat approach part and the corner of the substrate so that the gas flows through the gap toward the second side surface.Type: ApplicationFiled: June 17, 2011Publication date: October 13, 2011Applicant: TOKYO ELECTRON LIMITEDInventors: Shigenori KAMEI, Kotaro OOISHI, Masahito HAMADA
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Patent number: 8016976Abstract: A film removing device includes an approach stage having a flat approach part having a surface substantially flush with the surface of a substrate supported on a support member. The flat approach part faces a first side surface of the substrate at a corner of the substrate where the first side surface and a second side surface of the substrate join. A film removing nozzle spouts a solvent toward a peripheral part of the substrate and sucks a solution while being moved along the second side surface and the approach stage. A gas is spouted into a gap between the flat approach part and the corner of the substrate so that the gas flows through the gap toward the second side surface.Type: GrantFiled: July 31, 2007Date of Patent: September 13, 2011Assignee: Tokyo Electron LimitedInventors: Shigenori Kamei, Kotaro Ooishi, Masahito Hamada
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Publication number: 20080041523Abstract: A film removing device includes an approach stage having a flat approach part having a surface substantially flush with the surface of a substrate supported on a support member. The flat approach part faces a first side surface of the substrate at a corner of the substrate where the first side surface and a second side surface of the substrate join. A film removing nozzle spouts a solvent toward a peripheral part of the substrate and sucks a solution while being moved along the second side surface and the approach stage. A gas is spouted into a gap between the flat approach part and the corner of the substrate so that the gas flows through the gap toward the second side surface.Type: ApplicationFiled: July 31, 2007Publication date: February 21, 2008Applicant: TOKYO ELECTRON LIMITEDInventors: Shigenori Kamei, Kotaro Ooishi, Masahito Hamada