Patents by Inventor Kotaro Shirabe

Kotaro Shirabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Calibration plate having accurately defined calibration pattern
    Patent number: 6757629
    Abstract: A calibration plate includes a first pattern in which bars and spaces are repeated, and a second pattern in which bars having an identical width to the spaces of the first pattern and spaces having an identical width to the bars of the first pattern are repeated, wherein the first pattern and the second pattern adjoin each other, and the bars and spaces of the first pattern and the bars and spaces of the second pattern are staggered.
    Type: Grant
    Filed: July 18, 2001
    Date of Patent: June 29, 2004
    Assignee: Fujitsu Limited
    Inventors: Atsushi Takizawa, Kotaro Shirabe
  • Calibration plate having accurately defined calibration pattern
    Publication number: 20020082789
    Abstract: A calibration plate includes a first pattern in which bars and spaces are repeated, and a second pattern in which bars having an identical width to the spaces of the first pattern and spaces having an identical width to the bars of the first pattern are repeated, wherein the first pattern and the second pattern adjoin each other, and the bars and spaces of the first pattern and the bars and spaces of the second pattern are staggered.
    Type: Application
    Filed: July 18, 2001
    Publication date: June 27, 2002
    Applicant: FUJITSU LIMITED
    Inventors: Atsushi Takizawa, Kotaro Shirabe
  • Processes for forming resist pattern and for producing semiconductor device
    Patent number: 5906912
    Abstract: An electroconductive pattern is formed by coating a substrate with a solution comprising 100 parts by weight of a soluble electroconductive polymer containing an organic radical capable of cross-linking with a cross-linking agent, 5 to 1,000 parts by weight of a cross-linking agent, and 100 to 100,000 parts by weight of a solvent; effecting cross-linking of the resultant coated film to obtain a cured electroconductive film having a sheet resistance of 10.sup.10 .OMEGA./.quadrature. or less; forming a pattern as an upper layer on the cured electroconductive layer; and transferring the pattern of the upper layer to the cured electroconductive layer.
    Type: Grant
    Filed: April 11, 1997
    Date of Patent: May 25, 1999
    Assignee: Fujitsu Limited
    Inventors: Keiji Watanabe, Miwa Igarashi, Ei Yano, Keiko Yano, Takashi Maruyama, Eiichi Hoshino, Kotaro Shirabe, Masafumi Nakaishi