Patents by Inventor Kotaro Takagi
Kotaro Takagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12203602Abstract: A hydrogen supply system is configured to supply hydrogen to a fuel-cell vehicle by using a receptacle for hydrogen transport, and includes: a filling unit provided at a hydrogen filling facility and configured to fill the receptacle with hydrogen; a management unit configured to calculate a transport timing at which the hydrogen-filled receptacle is transported to a business facility that operates the fuel-cell vehicle; a transport unit configured to transport the hydrogen-filled receptacle to the business facility in accordance with the transport timing; and a disposition unit configured to dispose the hydrogen-filled receptacle transported to the business facility at a place to which the fuel-cell vehicle is capable of accessing to have a refill of the hydrogen in the business facility.Type: GrantFiled: November 18, 2020Date of Patent: January 21, 2025Assignee: JFE STEEL CORPORATIONInventors: Hiroshi Okano, Shusaku Takagi, Nobuyuki Ishikawa, Akihide Nagao, Kazuki Matsubara, Toshio Takano, Kotaro Kadota, Norikazu Yamaguchi, Takuya Hasegawa, Hiroki Kuno
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Patent number: 10966326Abstract: A wiring substrate includes a laminate having a through hole and including conductor layers and insulating layers interposed between the conductor layers, solder resist layers formed on the laminate and including a first solder resist layer covering first surface of the laminate and a second solder resist layer covering second surface of the laminate and that the first and second solder resist layers have openings exposing the through hole, and a resin film covering the laminate not covered by the solder resist layers such that the resin film is formed on the first and second surfaces of the laminate inside the openings of the first and second solder resist layers without overlapping with the solder resist layers on the first and second surfaces and that the resin film covers inner wall surface inside the through hole and at least part of the first and second surfaces exposed inside the openings.Type: GrantFiled: April 9, 2020Date of Patent: March 30, 2021Assignee: IBIDEN CO., LTD.Inventors: Kotaro Takagi, Yoji Mori
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Publication number: 20200329568Abstract: A wiring substrate includes a laminate having a through hole and including conductor layers and insulating layers interposed between the conductor layers, solder resist layers formed on the laminate and including a first solder resist layer covering first surface of the laminate and a second solder resist layer covering second surface of the laminate and that the first and second solder resist layers have openings exposing the through hole, and a resin film covering the laminate not covered by the solder resist layers such that the resin film is formed on the first and second surfaces of the laminate inside the openings of the first and second solder resist layers without overlapping with the solder resist layers on the first and second surfaces and that the resin film covers inner wall surface inside the through hole and at least part of the first and second surfaces exposed inside the openings.Type: ApplicationFiled: April 9, 2020Publication date: October 15, 2020Applicant: IBIDEN CO., LTD.Inventors: Kotaro Takagi, Yoji Mori
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Patent number: 10143092Abstract: A circuit substrate includes a core substrate having a cavity penetrating through the substrate, a metal block accommodated in the cavity of the substrate, a first build-up layer laminated on first side of the substrate and including insulating resin layers such that the first build-up layer is covering first surface of the block from the first side, and a second build-up layer laminated on second side of the substrate and including insulating resin layers such that the second build-up layer is covering second surface of the block from the second side. The first build-up layer includes an electronic component mounting structure formed on outermost portion of the first build-up layer, and the block is formed such that the first and second surfaces have roughened surfaces, respectively, and that the roughened surface of the first surface has surface roughness different from surface roughness of the roughened surface of the second surface.Type: GrantFiled: February 16, 2016Date of Patent: November 27, 2018Assignee: IBIDEN CO., LTD.Inventors: Yukinobu Mikado, Mitsuhiro Tomikawa, Koji Asano, Kotaro Takagi
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Patent number: 9831163Abstract: A circuit substrate includes a core substrate having a cavity, a metal block accommodated in the cavity of the core substrate, a first build-up layer including an insulating resin layer and laminated on a first surface of the core substrate such that the insulating resin layer is covering a first surface of the metal block in the cavity, and a second build-up layer including an insulating resin layer and laminated on a second surface of the core substrate such that the insulating resin layer is covering a second surface of the metal block in the cavity. The second build-up layer includes via conductors connected to the second surface of the metal block and common lands connecting the via conductors in parallel.Type: GrantFiled: February 24, 2016Date of Patent: November 28, 2017Assignee: IBIDEN CO., LTD.Inventors: Yukinobu Mikado, Mitsuhiro Tomikawa, Koji Asano, Kotaro Takagi
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Patent number: 9480156Abstract: A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the resists, and forming a wiring having a pad and a conductive circuit thinner than the pad by removing the metal film exposed through the removing of the plating resist, a solder-resist layer on the surface of the board and wiring, in the layer an opening exposing the pad and a portion of the circuit contiguous to the pad, a solder film on the pad and portion of the circuit exposed through the opening, and a solder bump on the pad by solder reflow.Type: GrantFiled: February 28, 2012Date of Patent: October 25, 2016Assignee: IBIDEN CO., LTD.Inventors: Toru Furuta, Kotaro Takagi, Michio Ido, Fumitaka Takagi
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Publication number: 20160268189Abstract: A circuit substrate includes a core substrate having a cavity, a metal block accommodated in the cavity of the core substrate, a first build-up layer including an insulating resin layer and laminated on a first surface of the core substrate such that the insulating resin layer is covering a first surface of the metal block in the cavity, and a second build-up layer including an insulating resin layer and laminated on a second surface of the core substrate such that the insulating resin layer is covering a second surface of the metal block in the cavity. The second build-up layer includes via conductors connected to the second surface of the metal block and common lands connecting the via conductors in parallel.Type: ApplicationFiled: February 24, 2016Publication date: September 15, 2016Applicant: IBIDEN CO., LTD.Inventors: Yukinobu MIKADO, Mitsuhiro Tomikawa, Koji Asano, Kotaro Takagi
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Publication number: 20160242293Abstract: A circuit substrate includes a core substrate having a cavity penetrating through the substrate, a metal block accommodated in the cavity of the substrate, a first build-up layer laminated on first side of the substrate and including insulating resin layers such that the first build-up layer is covering first surface of the block from the first side, and a second build-up layer laminated on second side of the substrate and including insulating resin layers such that the second build-up layer is covering second surface of the block from the second side. The first build-up layer includes an electronic component mounting structure formed on outermost portion of the first build-up layer, and the block is formed such that the first and second surfaces have roughened surfaces, respectively, and that the roughened surface of the first surface has surface roughness different from surface roughness of the roughened surface of the second surface.Type: ApplicationFiled: February 16, 2016Publication date: August 18, 2016Applicant: IBIDEN CO., LTD.Inventors: Yukinobu MIKADO, Mitsuhiro Tomikawa, Koji Asano, Kotaro Takagi
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Publication number: 20160143134Abstract: A wiring board with built-in metal block includes a substrate having a cavity penetrating through the substrate, a metal block accommodated in the cavity and having first surface, second surface, and side surface connecting outer edges of the first and second surface, filling resin filling gap between inner side surface of the substrate in the cavity and the side surface of the block, a first build-up layer laminated on first surface of the substrate and including an insulating layer such that the first layer is covering the cavity and the first surface of the block, and a second build-up layer laminated on second surface of the substrate and including an insulating layer such that the second layer is covering the cavity and the second surface of the block. The side surface of the block is recessed such that the side surface of the block is forming a groove shape.Type: ApplicationFiled: November 17, 2015Publication date: May 19, 2016Applicant: IBIDEN CO., LTD.Inventors: Mitsuhiro TOMIKAWA, Koji ASANO, Kotaro TAKAGI
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Patent number: 9294336Abstract: Provided is a router including a network interface that communicates with a network, a first communication interface that communicates with a mobile communication interface of a wireless communication device through a mobile communication control station, a second communication interface that communicates with a wireless LAN interface of the wireless communication device through a wireless LAN control station, and a conversion unit that converts an origin address of one of data to the network received from the mobile communication interface and data to the network received from the wireless LAN interface into an origin address of another one of the data.Type: GrantFiled: January 19, 2011Date of Patent: March 22, 2016Assignee: Sony CorporationInventors: Nishiki Mizusawa, Kotaro Takagi
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Patent number: 8592691Abstract: A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the etching and plating resists, and forming a wiring having a pad for wire-bonding an electrode of an electronic component and a conductive circuit thinner than the pad by removing the metal film exposed after the plating resist is removed, a solder-resist layer on the surface of the board and wiring, an opening in the layer exposing the pad and a portion of the circuit contiguous to the pad, and a metal coating on the pad and portion of the circuit exposed through the opening.Type: GrantFiled: January 12, 2010Date of Patent: November 26, 2013Assignee: Ibiden Co., Ltd.Inventors: Toru Furuta, Kotaro Takagi, Michio Ido, Akihiro Miyata, Fumitaka Takagi
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Patent number: 8410374Abstract: A printed wiring board has an insulative board having a first surface and a second surface on the opposite side of the first surface, a wiring formed on the first surface of the insulative board and having a pad and a conductive circuit contiguous to the pad, and a metal film formed on the pad. The pad is provided to mount an electronic component having a gold bump. The pad has a thickness which is greater than a thickness of the conductive circuit.Type: GrantFiled: October 20, 2009Date of Patent: April 2, 2013Assignee: Ibiden Co., Ltd.Inventors: Toru Furuta, Kotaro Takagi, Michio Ido, Fumitaka Takagi
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Publication number: 20120151764Abstract: A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the resists, and forming a wiring having a pad and a conductive circuit thinner than the pad by removing the metal film exposed through the removing of the plating resist, a solder-resist layer on the surface of the board and wiring, in the layer an opening exposing the pad and a portion of the circuit contiguous to the pad, a solder film on the pad and portion of the circuit exposed through the opening, and a solder bump on the pad by solder reflow.Type: ApplicationFiled: February 28, 2012Publication date: June 21, 2012Applicant: IBIDEN CO., LTD.Inventors: Toru FURUTA, Kotaro Takagi, Michio Ido, Fumitaka Takagi
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Publication number: 20120103931Abstract: A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the etching and plating resists, and forming a wiring having a pad for wire-bonding an electrode of an electronic component and a conductive circuit thinner than the pad by removing the metal film exposed after the plating resist is removed, a solder-resist layer on the surface of the board and wiring, an opening in the layer exposing the pad and a portion of the circuit contiguous to the pad, and a metal coating on the pad and portion of the circuit exposed through the opening.Type: ApplicationFiled: January 10, 2012Publication date: May 3, 2012Applicant: IBIDEN CO., LTD.Inventors: Toru Furuta, Kotaro Takagi, Michio Ido, Akihiro Miyata, Fumitaka Takagi
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Patent number: 8153905Abstract: A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the resists, and forming a wiring having a pad and a conductive circuit thinner than the pad by removing the metal film exposed through the removing of the plating resist, a solder-resist layer on the surface of the board and wiring, in the layer an opening exposing the pad and a portion of the circuit contiguous to the pad, a solder film on the pad and portion of the circuit exposed through the opening, and a solder bump on the pad by solder reflow.Type: GrantFiled: January 12, 2010Date of Patent: April 10, 2012Assignee: Ibiden Co., Ltd.Inventors: Toru Furuta, Kotaro Takagi, Michio Ido, Fumitaka Takagi
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Publication number: 20110182275Abstract: Provided is a router including a network interface that communicates with a network, a first communication interface that communicates with a mobile communication interface of a wireless communication device through a mobile communication control station, a second communication interface that communicates with a wireless LAN interface of the wireless communication device through a wireless LAN control station, and a conversion unit that converts an origin address of one of data to the network received from the mobile communication interface and data to the network received from the wireless LAN interface into an origin address of another one of the data.Type: ApplicationFiled: January 19, 2011Publication date: July 28, 2011Applicant: Sony CorporationInventors: Nishiki Mizusawa, Kotaro Takagi
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Publication number: 20100218983Abstract: A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the etching and plating resists, and forming a wiring having a pad for wire-bonding an electrode of an electronic component and a conductive circuit thinner than the pad by removing the metal film exposed after the plating resist is removed, a solder-resist layer on the surface of the board and wiring, an opening in the layer exposing the pad and a portion of the circuit contiguous to the pad, and a metal coating on the pad and portion of the circuit exposed through the opening.Type: ApplicationFiled: January 12, 2010Publication date: September 2, 2010Applicant: IBIDEN CO., LTD.Inventors: Toru Furuta, Kotaro Takagi, Michio Ido, Akihiro Miyata, Fumitaka Takagi
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Publication number: 20100218986Abstract: A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the resists, and forming a wiring having a pad and a conductive circuit thinner than the pad by removing the metal film exposed through the removing of the plating resist, a solder-resist layer on the surface of the board and wiring, in the layer an opening exposing the pad and a portion of the circuit contiguous to the pad, a solder film on the pad and portion of the circuit exposed through the opening, and a solder bump on the pad by solder reflow.Type: ApplicationFiled: January 12, 2010Publication date: September 2, 2010Applicant: IBIDEN CO., LTDInventors: Toru Furuta, Kotaro Takagi, Michio Ido, Fumitaka Takagi
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Publication number: 20100218980Abstract: A printed wiring board has an insulative board having a first surface and a second surface on the opposite side of the first surface, a wiring formed on the first surface of the insulative board and having a pad and a conductive circuit contiguous to the pad, and a metal film formed on the pad. The pad is provided to mount an electronic component having a gold bump. The pad has a thickness which is greater than a thickness of the conductive circuit.Type: ApplicationFiled: October 20, 2009Publication date: September 2, 2010Applicant: IBIDEN CO., LTD.Inventors: Toru Furuta, Kotaro Takagi, Michio Ido, Fumitaka Takagi
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Publication number: 20100221414Abstract: A method for manufacturing a printed wiring board includes preparing insulative board having first and second surfaces, forming metal film on the first surface, plating resist on the metal film and plated-metal film on the metal film exposed by the plating resist, covering portion of the plated-metal film with etching resist, etching to reduce thickness of the plated-metal film exposed by the etching resist, removing the etching and plating resists, by removing the metal film exposed after removing the plating resist, forming wiring comprising pad for electronic component having gold bump and conductive circuit which is thinner than the pad, forming solder-resist layer on the first surface and the wiring, and forming opening in the solder-resist layer to expose the pad and portion of the conductive circuit contiguous to the pad and metal coating on the pad and portion of the conductive circuit, which are exposed through the opening.Type: ApplicationFiled: June 25, 2009Publication date: September 2, 2010Applicant: IBIDEN CO., LTDInventors: Toru Furuta, Kotaro Takagi, Michio Ido, Fumitaka Takagi