Patents by Inventor Kotaro Yamaura

Kotaro Yamaura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11441011
    Abstract: Provided is a thermally conductive molded resin article that can be inexpensively mass-produced and that exhibits a low thermal resistance value as a result of reducing internal thermal resistance by high filling and reducing interfacial thermal resistance by improving cutting precision. The thermally conductive molded resin article is characterized by comprising a resin and thermally conductive fillers including a first thermally conductive filler and a second thermally conductive filler having a smaller particle size than the first thermally conductive filler. The thermally conductive molded resin article is also characterized in that: the first thermally conductive filler has an aspect ratio of 10 or more and is oriented approximately in the thickness direction of the thermally conductive molded resin article; the resin is a silicone resin, an acrylic rubber, or a fluororubber; and the second thermally conductive filler has a thermal conductivity surpassing 5 W/mK.
    Type: Grant
    Filed: January 31, 2017
    Date of Patent: September 13, 2022
    Assignee: BANDO CHEMICAL INDUSTRIES, LTD.
    Inventors: Fumihiro Mukai, Kotaro Yamaura, Hiroki Naito, Yasuhiro Sako
  • Publication number: 20210163708
    Abstract: Provided is a thermally conductive molded resin article that can be inexpensively mass-produced and that exhibits a low thermal resistance value as a result of reducing internal thermal resistance by high filling and reducing interfacial thermal resistance by improving cutting precision. The thermally conductive molded resin article is characterized by comprising a resin and thermally conductive fillers including a first thermally conductive filler and a second thermally conductive filler having a smaller particle size than the first thermally conductive filler. The thermally conductive molded resin article is also characterized in that: the first thermally conductive filler has an aspect ratio of 10 or more and is oriented approximately in the thickness direction of the thermally conductive molded resin article; the resin is a silicone resin, an acrylic rubber, or a fluororubber; and the second thermally conductive filler has a thermal conductivity surpassing 5 W/mK.
    Type: Application
    Filed: January 31, 2017
    Publication date: June 3, 2021
    Applicant: BANDO CHEMICAL INDUSTRIES, LTD.
    Inventors: Fumihiro MUKAI, Kotaro YAMAURA, Hiroki NAITO, Yasuhiro SAKO
  • Patent number: 10433798
    Abstract: An aperture comprises blocking members and for blocking X-rays. The blocking member has: an edge formed on an arc A1 lying on a circumference CF2 of a circle with radius r2 around a focal spot f in an XY-plane; an edge connected to one endpoint of the edge, the edge being formed to lie on the side of the X-ray detector with respect to an arc A11 contiguous to the arc A1; and an edge connected to the other endpoint of the edge, the edge being formed to lie on the side of the X-ray detector with respect to an arc A12 contiguous to the arc A1.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: October 8, 2019
    Assignee: General Electric Company
    Inventors: Kentaro Ogata, Kotaro Yamaura, Brandon Allan Smith
  • Publication number: 20190099136
    Abstract: An aperture comprises blocking members and for blocking X-rays. The blocking member has: an edge formed on an arc A1 lying on a circumference CF2 of a circle with radius r2 around a focal spot f in an XY-plane; an edge connected to one endpoint of the edge, the edge being formed to lie on the side of the X-ray detector with respect to an arc A11 contiguous to the arc A1; and an edge connected to the other endpoint of the edge, the edge being formed to lie on the side of the X-ray detector with respect to an arc A12 contiguous to the arc A1.
    Type: Application
    Filed: September 29, 2017
    Publication date: April 4, 2019
    Inventors: Kentaro Ogata, Kotaro Yamaura, Brandon Allan Smith