Patents by Inventor Kougo Endou

Kougo Endou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5847796
    Abstract: A driving IC is face-down bonded to a substrate. The thickness T of the driving IC is greater than the thickness t of an opposing substrate of a liquid crystal panel and an upper surface of the driving IC is made higher than an upper surface of the opposing substrate. The upper surface of the driving IC is heated and pressed by a bonding tool to bond bumps of the driving IC to interconnecting lines and bond the driving IC to the substrate with an adhesive. It is thus possible to sufficiently heat and press the driving IC without contact between the bonding tool and the opposing substrate, thereby permitting bonding with high reliability.
    Type: Grant
    Filed: March 6, 1997
    Date of Patent: December 8, 1998
    Assignee: Seiko Epson Corporation
    Inventors: Kenji Uchiyama, Kougo Endou