Patents by Inventor Kouhei Orikawa

Kouhei Orikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device having protruding electrodes higher than a sealed portion
    Patent number: 6388333
    Abstract: A plurality of semiconductor devices can be mounted on a mounting board in a three-dimensional structure by stacking one on another with a simple structure. A semiconductor element is mounted on a first surface of an interposer. Electrode pads connected to the semiconductor element are arranged around the semiconductor element on the first surface of the interposer. Protruding electrodes are provided on the respective electrode pads. Through holes are formed in the interposer so as to extend from a second surface opposite to the first surface of the redistribution substrate to the respective electrode pads. The semiconductor element is encapsulated by a seal resin. Each of the protruding electrodes is higher than the sealed portion of the semiconductor element.
    Type: Grant
    Filed: June 27, 2000
    Date of Patent: May 14, 2002
    Assignee: Fujitsu Limited
    Inventors: Fumihiko Taniguchi, Kouhei Orikawa, Tadashi Uno, Fumihiko Ando, Akira Takashima, Hiroshi Onodera, Eiji Yoshida, Kazuo Teshirogi