Patents by Inventor Kouichi Araki

Kouichi Araki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6438826
    Abstract: A resin seal apparatus includes a movable bottom die vertically moved by an elevator mechanism, a transport mechanism horizontally moving the movable bottom die having placed thereon a printed circuit board with a semiconductor chip mounted thereon, an intermediate die abutting against a periphery of the printed circuit board when the movable bottom die is moved upward, a film of resin stretched by a film stretch mechanism over the intermediate die and the printed circuit board, a die for a chip, pressing a back surface of the semiconductor chip via the film of resin, and a top die pressing a top surface of the intermediate die via the film of resin. This apparatus allows a PCB with a semiconductor chip mounted thereon in the form of a flip chip to be sealed with resin in a reduced period of time to fabricate an electronic component.
    Type: Grant
    Filed: February 5, 2001
    Date of Patent: August 27, 2002
    Assignee: Towa Corporation
    Inventors: Shinji Takase, Hirotaka Okamoto, Michio Osada, Kouichi Araki
  • Publication number: 20010013424
    Abstract: A resin seal apparatus includes a movable bottom die vertically moved by an elevator mechanism, a transport mechanism horizontally moving the movable bottom die having placed thereon a printed circuit board with a semiconductor chip mounted thereon, an intermediate die abutting against a periphery of the printed circuit board when the movable bottom die is moved upward, a film of resin stretched by a film stretch mechanism over the intermediate die and the printed circuit board, a die for a chip, pressing a back surface of the semiconductor chip via the film of resin, and a top die pressing a top surface of the intermediate die via the film of resin. This apparatus allows a PCB with a semiconductor chip mounted thereon in the form of a flip chip to be sealed with resin in a reduced period of time to fabricate an electronic component.
    Type: Application
    Filed: February 5, 2001
    Publication date: August 16, 2001
    Inventors: Shinji Takase, Hirotaka Okamoto, Michio Osada, Kouichi Araki
  • Patent number: 6159902
    Abstract: The invention relates to 1,3-oxazin-4-one derivatives of formula (I): ##STR1## and to their use as herbicides.
    Type: Grant
    Filed: June 10, 1998
    Date of Patent: December 12, 2000
    Assignees: Mitsubishi Chemical Corporation, Rhone-Poulenc Agriculture LTD
    Inventors: Tetsuya Murata, Hideshi Mukaida, Yoshie Yamada, Yukiko Oe, Norishige Toshima, Sachio Kudo, Kouichi Araki, Atsushi Go, Masahito Ito, Virginia Smith, Thomas Yarwood, Michael Gingell, Lyn Jennens
  • Patent number: 6048984
    Abstract: The invention relates to compounds of formula (I): and to their use as herbicides, and to intermediates useful in their preparation.
    Type: Grant
    Filed: August 19, 1999
    Date of Patent: April 11, 2000
    Assignee: Rhone-Poulenc Agriculture Limited
    Inventors: Kouichi Araki, Takako Brett, Kei Domom, Atsushi Go, Masahito Ito, Hideshi Mukaida, Yukiko Oe
  • Patent number: 5977376
    Abstract: The invention relates to compounds of formula (I): ##STR1## and to their use as herbicides.
    Type: Grant
    Filed: July 17, 1998
    Date of Patent: November 2, 1999
    Assignee: Rhone-Poulenc Agriculture Limited
    Inventors: Kouichi Araki, Takako Brett, Kei Domom, Atsushi Go, Masahito Ito, Hideshi Mukaida, Yukiko Oe
  • Patent number: 4816064
    Abstract: A 1,3,5-triazine derivative represented by the following formula (I) ##STR1## wherein R.sup.1, R.sup.2, R.sup.3 and R.sup.4, independently from each other, represent a hydrogen atom or a group selected from the class consisting of linear or branched C.sub.1 -C.sub.6 alkyl groups, C.sub.2 -C.sub.6 alkenyl groups, C.sub.2 -C.sub.6 alkynyl groups, C.sub.1 -C.sub.6 alkyl groups substituted by C.sub.1 -C.sub.6 alkoxy or alkylthio, C.sub.3 -C.sub.6 cycloalkyl groups, a phenyl group unsubstituted or substituted by a substituent selected from halogen, nitro, cyano, lower alkyl, lower alkoxy, lower alkylthio and fluoro-substituted lower alkyl, C.sub.7 -C.sub.9 aralkyl groups unsubstituted or substituted by a substituent selected from halogen, nitro, cyano, lower alkyl, lower alkoxy, lower alkylthio and fluoro-substituted lower alkyl, and alkoxycarbonylmethyl groups having 1 to 6 carbon atoms in the alkoxy moiety; and Y represents a fluoro-substituted C.sub.1 -C.sub.3 alkyl group and a herbicidal use thereof.
    Type: Grant
    Filed: November 20, 1986
    Date of Patent: March 28, 1989
    Assignee: Mitsubishi Petrochemical Co., Ltd.
    Inventors: Kazuhiko Konno, Kouichi Araki, Norio Sasaki, Keiji Endo, Mitsuru Hikido, Kiyoshi Sugaya