Abstract: A resin sealed semiconductor device includes a metallic base plate and a covering case adhered to a peripheral section of the metallic base plate. Semiconductor elements are loaded on the metallic base plate, and lead-out terminals extend from an upper surface of a terminal-supporting plate made to adhere to lead-out terminals. The terminal-supporting plate forms an upper surface of the covering case 5 which is filled with a sealing resin. Uneven stripes are molded and extend circumferentially over the entire outer peripheral surface of terminal-supporting plate to roughen the peripheral surface, and the adhesion strength is reinforced by increasing the adhesive area between the terminal-supporting plate and the sealing resin.

Abstract: This invention relates to a method of fabricating a bottle-shaped container of saturated polyester having superior mechanical strength, very low degrees of age and high temperature deformation, and superior dimensional stability. The piece for forming the bottle-shaped container is heated to an orientation temperature, is biaxially oriented in a blowing mold and is then thermally set by maintaining the outer wall surface of the expanded container in contact with the inner wall surface of the mold, which is kept at a temperature in the range between the glass transition point and the crystallization temperature, for longer than 5 seconds. The blowing mold is formed with the size adjusted in capacity by approx. 6% to allow for shrinkage of the product container when the container is exposed to a high temperature greater than 70.degree. C. and then left to stand, so as to thereby obtain a container of accurate capacity.