Patents by Inventor Kouichi Hiratsuka

Kouichi Hiratsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090235878
    Abstract: In one embodiment of the present invention, a cooling water path that extends in the direction of a row of cylinders is provided between left and right banks. A communication port that communicates with a discharge port of the water pump is provided at a position on the front side between the left and right banks in the direction of the row of cylinders, and first to third and fourth to sixth introduction ports that introduce cooling water to a water jacket of the left and right banks of the cylinder block from the rear side in the direction of the row of cylinders, are formed in the cooling water path.
    Type: Application
    Filed: August 1, 2007
    Publication date: September 24, 2009
    Applicant: Toyota Jidosha Kabushiki Kaisha
    Inventors: Tooru Kitamura, Kouichi Hiratsuka, Takanori Kawazu, Satoshi Matsuno
  • Patent number: 6654578
    Abstract: A synthetic resin part connecting member connects at least two injection molded pieces that can be used as frames for a process cartridge detachably mountable on an image forming apparatus. The molded pieces are set in dies different from the dies used for forming the molded pieces, and a molten resin is injected into a gap formed between opposed surfaces of the molded pieces. An injection channel for the molten resin up to the gap is formed in one of the molded pieces. A rib for stopping resin is provided in the injection channel to stop the flow of the molten resin injected into the injection channel.
    Type: Grant
    Filed: September 6, 2001
    Date of Patent: November 25, 2003
    Assignee: Canon Kabushiki Kaisha
    Inventors: Akira Suzuki, Kenshiro Abe, Tadayuki Tsuda, Kouichi Hiratsuka
  • Patent number: 6415121
    Abstract: A bonding method for bonding molded resin products, includes the step of bonding a first one of the molded resin products and a second one of the molded resin products by injecting resin material through a resin material injection path to a bonding portion therebetween, wherein the resin material injection path is formed in one of or both of the first resin material molded product and the second resin material molded product.
    Type: Grant
    Filed: May 22, 2000
    Date of Patent: July 2, 2002
    Assignee: Canon Kabushiki Kaisha
    Inventors: Akira Suzuki, Kenshiro Abe, Tadayuki Tsuda, Shinichi Sasaki, Shigeo Miyabe, Kouichi Hiratsuka
  • Publication number: 20020037179
    Abstract: In a part connecting member made from synthetic resin, at least two molded pieces obtained by the injection molding of plastic are provisionally connected by being adjacently arranged or abut against each other. The provisionally connected body is set in a die different from the dies used for the formation of each molded piece. Then, in a state such that each molded piece and the die are positioned, the molded pieces are joined by the injection of a molten resin material for joining into a gap formed between the opposed surfaces of the molded pieces that are adjacently arranged or abut against each other. An injection channel of the molten resin up to the gap is formed by using one of the molded pieces forming the gap of the opposed surfaces that are adjacently arranged or abut against each other.
    Type: Application
    Filed: September 6, 2001
    Publication date: March 28, 2002
    Inventors: Akira Suzuki, Kenshiro Abe, Tadayuki Tsuda, Kouichi Hiratsuka