Abstract: A semiconductor device manufacturing method includes forming a plurality of semiconductor chips on a main surface of a semiconductor wafer, electrically testing each of the semiconductor chips, dicing the semiconductor wafer into individual semiconductor chips and assembling each of the semiconductor chips into a package to be a semiconductor device, subjecting the packages to a burn-in test, determining whether each of the semiconductor chips requires the burn-in test to be performed, and generating a determination model for determining whether the semiconductor chips require the burn-in test to be performed.

Abstract: A semiconductor device manufacturing method includes forming a plurality of semiconductor chips on a main surface of a semiconductor wafer, electrically testing each of the semiconductor chips, dicing the semiconductor wafer into individual semiconductor chips and assembling each of the semiconductor chips into a package to be a semiconductor device, subjecting the packages to a burn-in test, determining whether each of the semiconductor chips requires the burn-in test to be performed, and generating a determination model for determining whether the semiconductor chips require the burn-in test to be performed.

Abstract: A burn-in test process is omitted for some or all lots. In burn-in necessity determination processing, whether each semiconductor chip requires a burn-in test to be performed is determined based on measurement data obtained in a probe test process. In an assembly process, based on the results of determination made in the burn-in necessity determination processing, the assembled packages are sorted into a first lot which includes packages each including a semiconductor chip determined to require a burn-in test to be performed and a second lot which includes packages each including a semiconductor chip determined to require no burn-in test to be performed. In a burn-in test process, only the packages of the first lot are subjected to a burn-in test.

Abstract: A burn-in test process is omitted for some or all lots. In burn-in necessity determination processing, whether each semiconductor chip requires a burn-in test to be performed is determined based on measurement data obtained in a probe test process. In an assembly process, based on the results of determination made in the burn-in necessity determination processing, the assembled packages are sorted into a first lot which includes packages each including a semiconductor chip determined to require a burn-in test to be performed and a second lot which includes packages each including a semiconductor chip determined to require no burn-in test to be performed. In a burn-in test process, only the packages of the first lot are subjected to a burn-in test.