Patents by Inventor Kouichi Kusakawa

Kouichi Kusakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10190621
    Abstract: An outer casing for a control cable 10 has an inner tube 12, which includes a crystalline resin, and an outer tube 14, which includes an outer resin layer 16 covering the outer periphery of the inner tube and, in the outer resin layer, includes plural metal wires 18 buried in parallel with the axial direction of the inner tube and at equal intervals in the circumferential direction of the inner tube.
    Type: Grant
    Filed: August 8, 2014
    Date of Patent: January 29, 2019
    Assignee: NHK Spring Co., Ltd.
    Inventors: Akihiko Kitazawa, Iroku Suzuki, Kouichi Kusakawa
  • Publication number: 20160208846
    Abstract: An outer casing for a control cable 10 has an inner tube 12, which includes a resin tube having a tubular resin layer and two metal wires buried, in the resin layer of the resin tube, in parallel with an axial direction and at positions symmetrical with each other about an axis of the resin tube, in which when an outer diameter of the resin tube is D (mm) and a distance between the two metal wires is A (mm), the following formulae (1) and (2) are satisfied. 1.5?D?4??(1) 0.5 D?A?0.
    Type: Application
    Filed: August 8, 2014
    Publication date: July 21, 2016
    Applicant: NHK SPRING CO., LTD.
    Inventors: Akihiko Kitazawa, Iroku Suzuki, Kouichi Kusakawa
  • Publication number: 20160186797
    Abstract: An outer casing for a control cable 10 has an inner tube 12,which includes a crystalline resin, and an outer tube 14, which includes an outer resin layer 16 covering the outer periphery of the inner tube and, in the outer resin layer, includes plural metal wires 18 buried in parallel with the axial direction of the inner tube and at equal intervals in the circumferential direction of the inner tube.
    Type: Application
    Filed: August 8, 2014
    Publication date: June 30, 2016
    Inventors: Akihiko KITAZAWA, Iroku SUZUKI, Kouichi KUSAKAWA
  • Patent number: 8535809
    Abstract: Provided is an electrical insulating resin composition capable of forming an electrical insulating layer which has excellent flexibility and board adhesiveness, together with high thermal resistance and high humidity resistance, tolerates a high temperature treatment at soldering and can be stably used for a long time under a harsh environment with high temperature and vibration in an automobile. A resin composition containing as organic components at least a rubber like polymer compound (A) composed of a copolymer of an aromatic vinyl compound and a conjugated diene compound and a polymerizable monomer (B) having one or more terminal reactive double bonds is employed as the electrical insulating resin composition. The compound (A) may be partially hydrogenated. The composition may optionally contain an oligomer (C) having a ring structure and having a reactive unsaturated bond in the molecule thereof.
    Type: Grant
    Filed: April 27, 2005
    Date of Patent: September 17, 2013
    Assignee: NHK Spring Co., Ltd.
    Inventors: Hideto Komurasaki, Tomoyuki Itou, Nobuaki Koyama, Kouichi Kusakawa
  • Publication number: 20120193131
    Abstract: The metal base circuit board according to the present invention includes a metal substrate, an insulating layer provided on the metal substrate, and a conductive foil for circuit formation that is provided on the insulating layer. The metal substrate has a thermal conductivity of 60 W/mK or more and a thickness of 0.2 to 5.0 mm. The insulating layer is formed using an insulating material composition in which an inorganic filler having a thermal conductivity of 30 W/mK or more is dispersed in a non-anisotropic liquid crystal polyester solution. According to the present invention, a metal base circuit board can be provided that can be applied in an inverter and applications requiring high heat dissipation properties, and that has high thermal conductivity, as well as having high thermal stability and electrical reliability.
    Type: Application
    Filed: April 7, 2010
    Publication date: August 2, 2012
    Applicants: SUMITOMO CHEMICAL COMPANY, LIMITED, NHK SPRING CO., LTD.
    Inventors: Kouichi Kusakawa, Kazuhiko Konomi, Satoshi Okamoto, Toyonari Ito
  • Publication number: 20070298272
    Abstract: Provided are a gasket that is less likely to deform and installable with excellent workability when it is installed at a portion to be sealed and that can be produced at low cost, a method of producing the gasket, and a gasket installation method. A previously prepared thermoplastic resin film with a predetermined shape is placed in a metal mold composed of a stationary side metal mold and a movable side metal mold. Then, thermoplastic elastomer as an elastic body is insert molded on the film by an injection molding machine to form a gasket. After the molding, the gasket is removed from the metal molds.
    Type: Application
    Filed: July 8, 2005
    Publication date: December 27, 2007
    Applicant: NHK SPRING CO., LTD.
    Inventors: Kouichi Kusakawa, Shigeki Ichimura, Taisuke Suwa
  • Publication number: 20050276958
    Abstract: Provided is an electrical insulating resin composition capable of forming an electrical insulating layer which has excellent flexibility and board adhesiveness, together with high thermal resistance and high humidity resistance, tolerates a high temperature treatment at soldering and can be stably used for a long time under a harsh environment with high temperature and vibration in an automobile. A resin composition containing as organic components at least a rubber like polymer compound (A) composed of a copolymer of an aromatic vinyl compound and a conjugated diene compound and a polymerizable monomer (B) having one or more terminal reactive double bonds is employed as the electrical insulating resin composition. The compound (A) may be partially hydrogenated. The composition may optionally contain an oligomer (C) having a ring structure and having a reactive unsaturated bond in the molecule thereof.
    Type: Application
    Filed: April 27, 2005
    Publication date: December 15, 2005
    Applicant: NHK SPRING CO., LTD.
    Inventors: Hideto Komurasaki, Tomoyuki Itou, Nobuaki Koyama, Kouichi Kusakawa