Abstract: A surface-mount type crystal oscillator has: a container body having a bottom wall and a frame wall having an opening and provided on one principal surface of the bottom wall; a quartz crystal blank hermetically encapsulated in a recess of the container body, which is formed by the opening of the frame wall; and an IC chip on which an oscillating circuit using the crystal blank is integrated. A region which is a region on the one principal surface of the bottom wall and other than formation regions of the frame wall and the recess is made a flat part, and the IC chip is fixed to the one principal surface of the bottom wall by flip-chip bonding, in the flat part. A crystal inspection terminal electrically connected to the crystal blank is provided on a surface of the flat part.

Abstract: A crystal device for surface mounting is provided with at least: a container body having a substantially rectangular outer shape and mounting electrodes formed in the four corners of the outside bottom surface of the container body; and a crystal blank hermetically sealed within the container body. The spacing of mounting electrodes on at least one side of the outside bottom surface is less than the length of the mounting electrodes in the direction along that side. A jetty having a height greater than the thickness of the mounting electrodes is provided in the cross-shaped area interposed between the mounting electrodes on the outside bottom surface.

Abstract: A surface mount type temperature-compensated crystal oscillator includes a crystal blank; an IC chip integrating an oscillation circuit using the crystal blank and a temperature compensation mechanism of compensating frequency temperature characteristics of the crystal blank; and a substantially rectangular parallelepiped container body for surface mounting having a first recess of housing the crystal blank and a second recess of housing the IC chip. Respective side surfaces corresponding to the long sides of the container body are provided with crystal inspection terminals for inspecting oscillation characteristics of the crystal blank and respective side surfaces corresponding to the short sides are provided with data writing terminals for writing temperature compensation data to the temperature compensation mechanism.

Abstract: A surface mount type crystal oscillator includes: a container body composed of a laminated ceramic including a plate-shaped center layer, and first and second frame layers stacked on opposite surfaces of the center layer respectively; a crystal blank hermetically sealed in a first recess formed by the first frame layer and the center layer; an IC chip accommodated in a second recess formed by the second frame layer and the center layer; and a test terminal provided on the outer side surface of the container body and used to test the crystal blank. The center layer has at least a first layer and a second layers, and the test terminal is electrically connected to a crystal retaining terminal provided on the bottom surface of the first recess in order to retain the crystal blank through a conductive path provided on an interface between the first and second layers.

Abstract: A surface mount type crystal oscillator includes a container main body including a recess on one main surface thereof and hermetically encapsulating an IC (integrated circuit) chip and a quartz crystal blank, and a mounting terminal electrically connected to the IC chip. The container main body includes a laminated ceramic made by laminating a flat layer and a frame wall layer, and a notch portion which is opened to the outer periphery of the container main body is formed on the flat layer within a region where the frame wall layer is laminated to the flat layer. A probe contact terminal electrically connected to the IC chip and/or the crystal blank is provided on the exposed surface of the frame wall layer by the notch portion. The mounting terminal is provided on the outer bottom face of the flat layer.

Abstract: A surface mount type crystal oscillator includes: a container body composed of a laminated ceramic including a plate-shaped center layer, and first and second frame layers stacked on opposite surfaces of the center layer respectively; a crystal blank hermetically sealed in a first recess formed by the first frame layer and the center layer; an IC chip accommodated in a second recess formed by the second frame layer and the center layer; and a test terminal provided on the outer side surface of the container body and used to test the crystal blank. The center layer has at least a first layer and a second layers, and the test terminal is electrically connected to a crystal retaining terminal provided on the bottom surface of the first recess in order to retain the crystal blank through a conductive path provided on an interface between the first and second layers.

Abstract: A surface mount crystal oscillator comprises: a crystal blank; an IC chip in which at least an oscillator circuit using the crystal blank is integrated; a mounting substrate having one main surface on which the crystal blank is disposed, and the other main surface used to mounting the crystal oscillator on a wiring board; and a cover bonded to the mounting substrate for hermetically sealing the crystal blank within a space between the mounting substrate and the cover. The mounting substrate has the one main surface extending outward from a region in which the cover is disposed such that a portion of the one main surface exposes. Test terminals which are electrically connected to the crystal blank are disposed on the exposed region of the one main surface.

Abstract: A surface mount crystal oscillator has a package body having a recess and formed with a step on an inner wall of the recess, a flat base plate having a peripheral region secured to the step, a crystal blank secured to the flat base plate, an IC chip having an oscillation circuit, using the crystal blank, integrated therein, and secured to a bottom surface of the recess, and a cover for closing the recess. The crystal blank is disposed above the IC chip within the recess, and the IC chip and the crystal blank are hermetically sealed within the recess.

Abstract: A surface mount type crystal oscillator is provided with: a container body having a bottom plate layer and a frame wall layer which has an opening, the frame wall layer being laminated on the bottom plate layer wherein a recess of the container body is formed by the opening; a crystal blank housed inside the recess; and an IC chip in which an oscillation circuit that uses the crystal blank is integrated. The IC chip has IC terminals used for external connections on one principal surface of the IC chip and is secured to the bottom plate layer. The IC chip is secured to the bottom plate layer by way of an anisotropic conductive material such that the one principal surface of the IC chip confronts the bottom plate layer.

Abstract: A crystal device for surface mounting is provided with at least: a container body having a substantially rectangular outer shape and mounting electrodes formed in the four corners of the outside bottom surface of the container body; and a crystal blank hermetically sealed within the container body. The spacing of mounting electrodes on at least one side of the outside bottom surface is less than the length of the mounting electrodes in the direction along that side. A jetty having a height greater than the thickness of the mounting electrodes is provided in the cross-shaped area interposed between the mounting electrodes on the outside bottom surface.

Abstract: A surface mount type crystal oscillator comprises: a package body comprised of laminated ceramic including a flat central layer made up of a first layer and a second layer, and a first and a second frame layer; a crystal blank hermetically sealed in a first recess defined by the first layer and the first frame layer; an IC chip placed in a second recess defined by the central layer and second frame layer; and a shield electrode disposed on a laminated surface of the second layer with the first layer. First and second electrode through-holes are formed through the first layer and second layer, respectively, for electrically connecting the crystal blank to the IC chip. The first and second electrode through-holes are positioned in areas outside the mounting position of the IC chip on the second recess.

Abstract: A surface mount crystal oscillator comprises a crystal blank, an IC chip having an oscillation circuit integrated thereon, and a hermetic package for accommodating the crystal blank and IC chip therein. The hermetic package comprises a substantially rectangular ceramic substrate formed with a metal film which makes a round on one main surface thereof, and a concave metal cover having an open end face bonded to the metal film. The IC chip is secured to the one main surface of the ceramic substrate through ultrasonic thermo-compression bonding using bumps, the crystal blank is disposed above the IC chip, and the ceramic substrate has the one main surface formed as a flat surface.

Abstract: A surface mount type crystal oscillator is provided with a crystal blank, an IC chip which incorporates an oscillation circuit using the crystal blank, a substantially rectangular parallelepiped container body for surface mounting which houses the crystal blank and the IC chip, and mounting electrodes provided in four corners of an outer bottom surface of the container body. Each of the mounting electrodes is provided so as to extend over a side surface of the container body as an end face electrode. At least one adjustment terminal is disposed above the end face electrode on the side surface of the container body electrically isolated from the end face electrode. The adjustment terminal is longer along the height direction of the container body than the end face electrode.

Abstract: A surface mount type temperature-compensated crystal oscillator includes a crystal blank; an IC chip integrating an oscillation circuit using the crystal blank and a temperature compensation mechanism of compensating frequency temperature characteristics of the crystal blank; and a substantially rectangular parallelepiped container body for surface mounting having a first recess of housing the crystal blank and a second recess of housing the IC chip. Respective side surfaces corresponding to the long sides of the container body are provided with crystal inspection terminals for inspecting oscillation characteristics of the crystal blank and respective side surfaces corresponding to the short sides are provided with data writing terminals for writing temperature compensation data to the temperature compensation mechanism.

Abstract: A surface-mount crystal oscillator including a container body, a mounting terminal arranged on an outer bottom surface of the container body, a crystal blank hermetically sealed in said container body, and an IC chip having an oscillation circuit electrically connected to the crystal blank and hermetically sealed in the container body is mounted on a circuit board. A discrete part is arranged on the outer bottom surface of the container body, and the circuit board is provided with a connection terminal corresponding to the mounting terminal and an opening corresponding to the discrete part. The mounting terminal and the connection terminal are electrically and mechanically connected in a manner that the discrete part is accommodated in the opening, whereby the surface-mount crystal oscillator is surface-mounted on the circuit board.

Abstract: A surface mounting quartz crystal oscillator has an IC chip containing an oscillator circuit, and a quartz crystal unit which are sealed in a container body by a metal cover, wherein stray capacitances C1, C2 are equivalently in parallel with oscillation capacitors Ca, Cb connected to one and the other ends of the crystal unit, respectively. A gap between the IC chip and a crystal blank of the crystal unit, and a gap between the crystal blank and metal cover are set in accordance with a changing amount of the oscillation frequency due to a change in the stray capacitances C1, C2 in a direction in which a change in equivalent series capacitance is reduced, as viewed from the crystal unit, while maintaining a spacing between the IC chip and metal cover.

Abstract: A surface mounting quartz crystal oscillator has an IC chip containing an oscillator circuit, and a quartz crystal unit which are sealed in a container body by a metal cover, wherein stray capacitances C1, C2 are equivalently in parallel with oscillation capacitors Ca, Cb connected to one and the other ends of the crystal unit, respectively. A gap between the IC chip and a crystal blank of the crystal unit, and a gap between the crystal blank and metal cover are set in accordance with a changing amount of the oscillation frequency due to a change in the stray capacitances C1, C2 in a direction in which a change in equivalent series capacitance is reduced, as viewed from the crystal unit, while maintaining a spacing between the IC chip and metal cover.

Abstract: A fuel supply control system for an internal combustion engine has first and second step motor drivers for driving a step motor operatively coupled to a fuel supply control means such as a throttle valve. An initial step position setting memory stores an initial preset step position of the step motor, and a target step memory stores a target step position of the step motor dependent on an accelerator pedal position. A driver selector selects the first step motor driver for driving the step motor to the initial preset step position in response to a signal from a power-on detector, and selects the second step motor driver for driving the step motor to the target step position in response to a signal from an engine self-operation detector.

Abstract: A fuel supply control system for an internal combustion engine has a step motor driver for outputting excitation pulses to an excitation circuit for a step motor and a comparator supplied with a target step position of the step motor from a target step position memory and a present step position of the step motor from a current step position memory. The comparator is responsive to an output from a step motor speed setting unit which corresponds to a main power supply voltage detected by a voltage detector for comparing the target and present step positions. The step motor driver is responsive to an output from the comparator for issuing excitation pulses to the excitation circuit to turn the step motor by one step in one direction or the other until the present step position is equal to the target step position.