Patents by Inventor Kouichi Nagao
Kouichi Nagao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8283775Abstract: A semiconductor device including a semiconductor element 1 having an active element region 1a, a plurality of element electrodes 2 formed on a principal face of the semiconductor element, external terminals 6 and 7 connected to one or more element electrodes via connection members 8 and 9, one or more first heat-dissipation protrusions 4 formed on the principal face of the semiconductor element, an insulation resin layer 10 covering the principal face of the semiconductor element and the first heat-dissipation protrusions, and a heat-dissipation medium 11 contacting a face of the insulation resin layer on a side opposite to a side contacting front faces of the first heat-dissipation protrusions.Type: GrantFiled: March 16, 2011Date of Patent: October 9, 2012Assignee: Panasonic CorporationInventors: Nozomi Shimoishizaka, Yoshifumi Nakamura, Kouichi Nagao
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Publication number: 20110163436Abstract: A semiconductor device including a semiconductor element 1 having an active element region 1a, a plurality of element electrodes 2 formed on a principal face of the semiconductor element, external terminals 6 and 7 connected to one or more element electrodes via connection members 8 and 9, one or more first heat-dissipation protrusions 4 formed on the principal face of the semiconductor element, an insulation resin layer 10 covering the principal face of the semiconductor element and the first heat-dissipation protrusions, and a heat-dissipation medium 11 contacting a face of the insulation resin layer on a side opposite to a side contacting front faces of the first heat-dissipation protrusions.Type: ApplicationFiled: March 16, 2011Publication date: July 7, 2011Applicant: PANASONIC CORPORATIONInventors: Nozomi SHIMOISHIZAKA, Yoshifumi NAKAMURA, Kouichi NAGAO
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Patent number: 7800913Abstract: A wiring board includes: a flexible insulating base; a plurality of conductive wirings arranged on the insulating base, end portions of the conductive wirings defining inner leads at a region where a semiconductor chip is to be mounted; and bump electrodes that are provided respectively at the inner leads of the conductive wirings. The wiring board further includes: dummy inner leads having a shape and a pitch corresponding to a shape and a pitch of the inner leads and aligned with the inner leads, the dummy inner leads being provided with dummy bump electrodes corresponding to the bump electrodes; a trunk conductive wiring provided for a group of one or an adjacent plurality of the dummy inner leads; and a branch wiring branching off from the trunk conductive wiring, the branch wiring being connected with the dummy inner leads belonging to the group corresponding to the trunk conductive wiring.Type: GrantFiled: October 9, 2006Date of Patent: September 21, 2010Assignee: Panasonic CorporationInventors: Michiharu Torii, Kouichi Nagao, Nozomi Shimoishizaka
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Patent number: 7582968Abstract: A wiring board according to the present invention includes: an insulating base 22; a plurality of first conductor wirings 23a aligned in an inner region on the insulating base; bumps 24 formed on the respective first conductor wirings; and a protective film 25a that is formed on the insulating base so as to cover the first conductor wirings and has an opening region through which the bumps are exposed. The height of at least part of a surface of the protective film from a surface of the insulating base is greater than the height of the bumps from the surface of the insulating base. With this configuration, it is possible to decrease the thickness in the state where a protective tape is placed on the wiring board to protect bumps, thereby increasing the length of the wiring board that can be held by a reel for supplying the wiring board.Type: GrantFiled: November 10, 2006Date of Patent: September 1, 2009Assignee: Panasonic CorporationInventors: Nozomi Shimoishizaka, Kouichi Nagao, Hiroyuki Imamura
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Publication number: 20090154126Abstract: A wiring board includes a first bonding wiring array that is formed by extending conductor wirings, and that extends from an external side of a semiconductor element region and is bonded individually to a first element electrode array of a semiconductor element, and a second bonding wiring array that extends from the external side of the semiconductor element region and is bonded individually to a second element electrode array of the semiconductor element.Type: ApplicationFiled: December 8, 2008Publication date: June 18, 2009Applicant: PANASONIC CORPORATIONInventors: Nozomi SHIMOISHIZAKA, Kouichi NAGAO
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Patent number: 7514802Abstract: A flexible insulating base, a plurality of conductor wirings aligned on the flexible insulating base, and bump electrodes provided respectively in end portions of the plurality of conductor wirings in a region where a semiconductor chip is to be placed are provided. The semiconductor chip is mounted on the conductor wirings by bonding electrode pads formed on the semiconductor chip to the bump electrodes. An auxiliary conductor wiring formed similarly to the conductor wirings is provided on the insulating base, and an auxiliary bump electrode formed similarly to the bump electrodes is provided on the auxiliary conductor wiring, so that the electrode pads formed on the semiconductor chip can be registered with respect to the bump electrodes on the conductor wirings by positioning the semiconductor chip with reference to the auxiliary bump electrode.Type: GrantFiled: September 13, 2006Date of Patent: April 7, 2009Assignee: Panasonic CorporationInventors: Michinari Tetani, Takayuki Tanaka, Hiroyuki Imamura, Nozomi Shimoishizaka, Kouichi Nagao
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Patent number: 7442074Abstract: A wiring board includes first and second feeding electrodes (2, 3) provided along both sides of an insulating substrate (1), feeding bus lines (4) extending in a traverse direction and connected to both the feeding electrodes, and conductor wirings (6, 8, 12) having one side terminals forming inner leads having protruding electrodes (9, 11, 13) and the other side terminals connected to the feeding bus lines. The inner leads in each unit region are arranged in two lines extending in the traverse direction. The inner leads of a first group are arranged with a dense wiring pitch, and the inner leads of a second group include a dense pitch region in which a wiring pitch is the same as that of the inner leads of the first group, and a sparse pitch region in which a wiring pitch is longer than that of the inner leads of the first group.Type: GrantFiled: November 10, 2006Date of Patent: October 28, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Nozomi Shimoishizaka, Nobuyuki Koutani, Kouichi Nagao, Michiharu Torii, Yoshifumi Nakamura, Takayuki Tanaka
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Patent number: 7250575Abstract: A wiring board includes: a flexible insulating base 1; a plurality of conductive wirings 2 arranged on the flexible insulating base 1; protruding electrodes 3 provided respectively at an end portion of the same side of each of the conductive wirings; external terminals 4, 5 formed respectively at the other end portions of each of the conductive wirings; metal plating layers applied on the conductive wirings, the protruding electrodes and the external terminals; and solder resist layers 7 formed respectively by coating the conductive wirings in regions between the end portions at which the protruding electrodes are provided and the external terminals. In the regions where the solder resist layers are formed, no metal plating layers are formed on the conductive wirings, and the surfaces of the conductive wirings to be contacted with the flexible insulating base are rougher than the surfaces not to be contacted with the flexible insulating base.Type: GrantFiled: May 26, 2006Date of Patent: July 31, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kouichi Nagao, Yoshifumi Nakamura, Hiroyuki Imamura, Michinari Tetani
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Publication number: 20070120235Abstract: A wiring board according to the present invention includes: an insulating base 22; a plurality of first conductor wirings 23a aligned in an inner region on the insulating base; bumps 24 formed on the respective first conductor wirings; and a protective film 25a that is formed on the insulating base so as to cover the first conductor wirings and has an opening region through which the bumps are exposed. The height of at least part of a surface of the protective film from a surface of the insulating base is greater than the height of the bumps from the surface of the insulating base. With this configuration, it is possible to decrease the thickness in the state where a protective tape is placed on the wiring board to protect bumps, thereby increasing the length of the wiring board that can be held by a reel for supplying the wiring board.Type: ApplicationFiled: November 10, 2006Publication date: May 31, 2007Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Nozomi Shimoishizaka, Kouichi Nagao, Hiroyuki Imamura
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Publication number: 20070119614Abstract: A wiring board includes first and second feeding electrodes (2, 3) provided along both sides of an insulating substrate (1), feeding bus lines (4) extending in a traverse direction and connected to both the feeding electrodes, and conductor wirings (6, 8, 12) having one side terminals forming inner leads having protruding electrodes (9, 11, 13) and the other side terminals connected to the feeding bus lines. The inner leads in each unit region are arranged in two lines extending in the traverse direction. The inner leads of a first group are arranged with a dense wiring pitch, and the inner leads of a second group include a dense pitch region in which a wiring pitch is the same as that of the inner leads of the first group, and a sparse pitch region in which a wiring pitch is longer than that of the inner leads of the first group.Type: ApplicationFiled: November 10, 2006Publication date: May 31, 2007Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Nozomi SHIMOISHIZAKA, Nobuyuki KOUTANI, Kouichi NAGAO, Michiharu TORII, Yoshifumi NAKAMURA, Takayuki TANAKA
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Publication number: 20070109759Abstract: A wiring board includes: a flexible insulating base; a plurality of conductive wirings arranged on the insulating base, end portions of the conductive wirings defining inner leads at a region where a semiconductor chip is to be mounted; and bump electrodes that are provided respectively at the inner leads of the conductive wirings. The wiring board further includes: dummy inner leads having a shape and a pitch corresponding to a shape and a pitch of the inner leads and aligned with the inner leads, the dummy inner leads being provided with dummy bump electrodes corresponding to the bump electrodes; a trunk conductive wiring provided for a group of one or an adjacent plurality of the dummy inner leads; and a branch wiring branching off from the trunk conductive wiring, the branch wiring being connected with the dummy inner leads belonging to the group corresponding to the trunk conductive wiring.Type: ApplicationFiled: October 9, 2006Publication date: May 17, 2007Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Michiharu TORII, Kouichi NAGAO, Nozomi SHIMOISHIZAKA
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Publication number: 20070075426Abstract: A flexible insulating base, a plurality of conductor wirings aligned on the flexible insulating base, and bump electrodes provided respectively in end portions of the plurality of conductor wirings in a region where a semiconductor chip is to be placed are provided. The semiconductor chip is mounted on the conductor wirings by bonding electrode pads formed on the semiconductor chip to the bump electrodes. An auxiliary conductor wiring formed similarly to the conductor wirings is provided on the insulating base, and an auxiliary bump electrode formed similarly to the bump electrodes is provided on the auxiliary conductor wiring, so that the electrode pads formed on the semiconductor chip can be registered with respect to the bump electrodes on the conductor wirings by positioning the semiconductor chip with reference to the auxiliary bump electrode.Type: ApplicationFiled: September 13, 2006Publication date: April 5, 2007Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Michinari TETANI, Takayuki TANAKA, Hiroyuki IMAMURA, Nozomi SHIMOISHIZAKA, Kouichi NAGAO
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Publication number: 20060268530Abstract: A wiring board includes: a flexible insulating base 1; a plurality of conductive wirings 2 arranged on the flexible insulating base 1; protruding electrodes 3 provided respectively at an end portion of the same side of each of the conductive wirings; external terminals 4, 5 formed respectively at the other end portions of each of the conductive wirings; metal plating layers applied on the conductive wirings, the protruding electrodes and the external terminals; and solder resist layers 7 formed respectively by coating the conductive wirings in regions between the end portions at which the protruding electrodes are provided and the external terminals. In the regions where the solder resist layers are formed, no metal plating layers are formed on the conductive wirings, and the surfaces of the conductive wirings to be contacted with the flexible insulating base are rougher than the surfaces not to be contacted with the flexible insulating base.Type: ApplicationFiled: May 26, 2006Publication date: November 30, 2006Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Kouichi Nagao, Yoshifumi Nakamura, Hiroyuki Imamura, Michinari Tetani
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Publication number: 20060267219Abstract: A flexible insulating base, a plurality of conductor wirings provided on the base, and a plurality of bump electrodes that are formed on the plurality of conductor wirings, respectively, are provided. A semiconductor chip having electrode pads is to be mounted by placing the semiconductor chip on the bump electrodes and bonding the electrode pads and the bump electrodes, respectively. The bump electrodes are placed on the conductor wirings, respectively, in edge portions of at least two sides of a chip mounting region in which the semiconductor chip is to be mounted. The conductor wiring corresponding to at least one of the bump electrodes placed in the edge portions of the two sides passes through the chip mounting region so as to be routed via a side different from the side on which the at least one of the bump electrodes is placed, and then led to an outside of the chip mounting region.Type: ApplicationFiled: May 26, 2006Publication date: November 30, 2006Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Yoshifumi Nakamura, Kouichi Nagao, Hiroyuki Imamura
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Patent number: 5526563Abstract: A flexible wiring board is constructed by placing, on a surface of a flexible ultraviolet-transmissive base member in the form of a layer, a conductive member in the form of a layer and a covering member in the form of a layer. The conductive member has an exposed leading area not covered with the covering member. A lead is aligned with an electrode and they are connected together with pressure exerted by a pressure applying jig which is ultraviolet-transmissive. A photosetting adhesive resin capable of shrinking in volume is injected between the flexible wiring board and a printed circuit board. The photosetting adhesive resin is irradiated with ultraviolet passing through the pressure applying jig and the base member. When irradiated with the ultraviolet rays, the photosetting adhesive resin hardens. Volume shrinkage force exerted by the photosetting adhesive resin enhances the connection between the lead and the electrode.Type: GrantFiled: March 9, 1995Date of Patent: June 18, 1996Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Tomohiro Tamaki, Kouichi Nagao, Hiroaki Fujimoto, Kazunari Nishihara
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Patent number: 5234522Abstract: A flexible printed-circuit board covered with a coverlay is produced by bonding (a) a flexible printed-circuit board that comprises a flexible base having a surface bearing a circuit and (b) a polyimide film having a surface treated to increase adhering property and another surface not treated to increase adhering property, each of the surfaces being coated with an adhesive layer, with the adhesive layer on the surface treated to increase adhering property interposed between the polyimide film and the surface bearing the circuit, and then peeling off the adhesive layer coating the polyimide film on the surface not treated to increase adhering property.Type: GrantFiled: November 27, 1991Date of Patent: August 10, 1993Assignee: Hitachi Chemical Company, Inc.Inventors: Masakatsu Suzuki, Junichi Imaizumi, Hiroshi Nomura, Kouichi Nagao, Yasushi Katoh, Takato Oti, Eikichi Satou
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Patent number: 5171826Abstract: A heat resistant adhesive composition comprising a specific polyamic acid solution and a bis-maleimide compound exhibits flexibility and excellent heat resistance after bonding two material bodies, and therefore, it can be suitably used for producing of flexible metal-clad laminates, double-sided flexible metal-clad laminates, and multilayer printed circuit boards, and for attaching coverlay films to printed circuit boards.Type: GrantFiled: November 13, 1991Date of Patent: December 15, 1992Assignee: Hitachi Chemical Company, Ltd.Inventors: Junichi Imaizumi, Hiroshi Nomura, Kouichi Nagao, Masakatsu Suzuki, Koushi Sakairi, Eikichi Satou
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Patent number: 5089346Abstract: A heat resistant adhesive composition comprising a specific polyamic acid solution and a bis-maleimide compound exhibits flexibility and excellent heat resistance after bonding two material bodies, and therefore, it can be suitably used for producing of flexible metal-clad laminates, double-sided flexible metal-clad laminates, and multilayer printed circuit boards, and for attaching coverlay films to printed circuit boards.Type: GrantFiled: March 16, 1990Date of Patent: February 18, 1992Assignee: Hitachi Chemical Company, Ltd.Inventors: Junichi Imaizumi, Hiroshi Nomura, Kouichi Nagao, Masakatsu Suzuki, Koushi Sakairi, Eikichi Satou
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Patent number: 4389854Abstract: A high speed freezing apparatus in use for a refrigerator. In the freezing apparatus, evaporators for the cold and freezing chambers are coupled in a series relation with respect to a compressor. An electromagnetic valve is provided in parallel with the evaporator for the cold chamber. When a high speed freezing start signal is produced from an operating section mounted on a front panel of a door for the freezing chamber, a timer circuit provided in a control section is operated. An operating condition of the compressor is detected by a detecting transformer and a given signal is produced from a start-failure preventing circuit. The start signal is transferred through a gate circuit to a relay portion only during the time that the given signal is transmitted to a gate circuit. Through the relay portion, the compressor and the electromagnetic valve are driven, so that the refrigerant is supplied to only the evaporator for the freezing chamber to start the high speed freezing operation.Type: GrantFiled: September 29, 1981Date of Patent: June 28, 1983Assignee: Tokyo Shibaura Denki Kabushiki KaishaInventors: Yasuhiro Ogita, Kazuya Kawasaki, Kouichi Nagao, Naoki Mori