Abstract: Provided is a resin composition having electrical conductivity and low water absorbency. The resin composition comprises a carbon fiber and a thermoplastic resin, the carbon fiber having a relative intensity ratio (ID/IG) of the peak intensity ID in a wavenumber range of 1,320 cm?1 to 1,370 cm?1 to the peak intensity IG in a wavenumber range of 1,560 cm?1 to 1,600 cm?1 of 0.6 or less in the Raman spectrum measured by microscopic Raman spectroscopy, the resin composition having a surface resistance value in a range of 1×102 ? to 1×1012 ?.

Abstract: A resin compound having high slidability is provided, comprising (A) polyphenylene sulfide resin, (B) polyethylene modified with an ethylenic unsaturated carboxylic acid and/or an ethylenic unsaturated carboxylic acid anhydride, (C) a silane coupling agent having an epoxy group, (D) polytetrafluoroethylene and (E) graphite.

Abstract: A process for producing a resin compound applicable to precise electronic parts, especially sliding member from thermoplastic engineering plastics is disclosed, comprising compounding (I) a carbon masterbatch comprising polyethylene having a density of not less than 0.92 g/cm.sup.3 and an MI of from 0.1 to 30 g/10 min, conductive carbon black, and talc and (II) a thermoplastic engineering plastic. The carbon black is satisfactorily dispersed to impart satisfactory heat conductivity to a molded article to thereby providing a sliding member with little wear and long durability.