Abstract: The present invention is directed to a polyimide film with a uniform orientation angle in the transverse direction of the film. A polyimide film characterized by the fact that the width of the fabricated film is ?1.5 m, 2 points positioned inside by 200 mm from both ends of the width of the fabricated film are selected on a linear line in the vertical direction to the machine direction (MD) of the film, 1 point within center part ±200 mm, and 2 optional points are further selected on a linear line that includes said 2 points within the range of the linear line that connects said 2 points, and the orientation angle (?) is within a range of 90°±23° in at least all of these 8 points.

Abstract: The present invention is directed to a polyimide film with a uniform orientation angle in the transverse direction of the film. A polyimide film characterized by the fact that the width of the fabricated film is ?1.5 m, 2 points positioned inside by 200 mm from both ends of the width of the fabricated film are selected on a linear line in the vertical direction to the machine direction (MD) of the film, 1 point within center part ±200 mm, and 2 optional points are further selected on a linear line that includes said 2 points within the range of the linear line that connects said 2 points, and the orientation angle (?) is within a range of 90°±23° in at least all of these 8 points.

Abstract: A copper clad laminate that is suited to use in high-performance flexible printed circuit boards, which meets both dimensional change and heat resistance requisites, has a small percent dimensional change after etching, and has properties that are applicable to AOI, and which further has excellent slickness (slip) and adhesion is provided. A copper clad laminate that uses a polyimide film that primarily uses paraphenylenediamine and 4,4?-diaminodiphenylether as diamine ingredients, and pyromellitic dianhydride and 3,3?,4,4?-biphenyltetracarboxylic dianhydride as acid dianhydride ingredients, which further has slip caused by producing surface protrusions by adding inorganic particles. One copper foil is adhered to one side of the polyimide film using an adhesive; and a second copper layer is directly adhered to the second side of the polyimide film.

Abstract: The invention provides a polyimide film manufactured from a polyamic acid prepared from pyromellitic dianhydride in combination with 10 to 60 mol % of phenylenediamine and 40 to 90 mol % of 3,4?-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

Abstract: The invention provides a polyimide film manufactured from a polyamic acid prepared from pyromellitic dianhydride in combination with 10 to 60 mol % of phenylenediamine and 40 to 90 mol % of 3,4′-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

Abstract: A polyimide film is manufactured from a random copolymeric, block copolymeric or interpenetrating polymer network-type polyamic acid prepared from pyromellitic dianhydride in combination with 22 to 78 mol % of 4,4′-oxydianiline and 22 to 78 mol % of 3,4′-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

Abstract: A polyimide film is produced by copolymerizing pyromellitic dianhydride in combination with phenylenediamine, methylenedianiline and 3,4′-oxydianiline in a specific molar ratio. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

Abstract: A polyimide film is manufactured from a random copolymeric, block copolymeric or interpenetrating polymer network-type polyamic acid prepared from pyromellitic dianhydride in combination with 22 to 78 mol % of 4,4′-oxydianiline and 22 to 78 mol % of 3,4′-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

Abstract: A polyimide film is produced by copolymerizing pyromellitic dianhydride in combination with phenylenediamine, methylenedianiline and 3,4′-oxydianiline in a specific molar ratio. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

Abstract: A polyimide copolymer containing a block polyimide polymer component composed of a rigid aromatic diamine compound and an aromatic tetracarboxylic acid compound and a random polyimide copolymer component composed of a flexible aromatic diamine compound and at least two types of aromatic tetracarboxylic acid compounds is prepared by a two-stage polymerization process. Resin molded products prepared from the polyimide copolymer have high modulus, low thermal expansion and low water absorption and can be used as TAB base films that require higher processability and precision.