Patents by Inventor Kouichi Suzaki
Kouichi Suzaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240093332Abstract: Free-cutting copper alloy comprises Cu: more than 59.7% but less than 64.7%, Si: more than 0.60% but less than 1.30%, Pb: more than 0.001% but less than 0.20%, Bi: more than 0.001% but less than 0.10 mass %, and P: more than 0.001% but less than 0.15%, with remainder being Zn and unavoidable impurities, wherein total amount of Fe, Mn, Co, and Cr is less than 0.45%, the total amount of Sn and Al is less than 0.45%, 56.7?Cu?4.7×Si+0.5×Pb+0.5×Bi?0.5×P?59.7 and 0.003?Pb+Bi<0.25 are satisfied, 0.02?Bi/(Pb+Bi)?0.98 is satisfied if 0.003?Pb+Bi<0.08, 0.01?Bi/(Pb+Bi)?0.40 or 0.85?Bi/(Pb+Bi)?0.98 is satisfied if 0.08?Pb+Bi<0.13.Type: ApplicationFiled: November 30, 2020Publication date: March 21, 2024Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto
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Patent number: 11814712Abstract: This free-cutting copper alloy contains Cu: more than 57.5% but less than 64.5%, Si: more than 0.20% but less than 1.20%, Pb: more than 0.001% but less than 0.20%, Bi: more than 0.10% but less than 1.00%, and P: more than 0.001% but less than 0.20%, with the balance being Zn and unavoidable impurities, wherein the total amount of Fe, Mn, Co and Cr is less than 0.45%, the total amount of Sn and Al is less than 0.45%, relationships of 56.3?f1=[Cu]?4.8×[Si]+0.5×[Pb]+0.5×[Bi]?0.5×[P]?59.5 and 0.12?f2=[Pb]+[Bi]<1.0 are satisfied.Type: GrantFiled: March 16, 2020Date of Patent: November 14, 2023Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto
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Patent number: 11788173Abstract: This free-cutting copper alloy includes Cu: more than 58.0% and less than 65.0%, Si: more than 0.30% and less than 1.30%, Pb: more than 0.001% and 0.20% or less, Bi: more than 0.020% and 0.10% or less, and P: more than 0.001% and less than 0.20%, with the remainder being Zn and unavoidable impurities, a total amount of Fe, Mn, Co and Cr is less than 0.45%, a total amount of Sn and Al is less than 0.45%, relationships of 56.5?[Cu]?4.7×[Si]+0.5×[Pb]+0.5×[Bi]?0.5×[P]?59.5, and 0.025?[Pb]+[Bi]<0.25 are satisfied, in constituent phases of a metallographic structure, relationships of 20?(?)<85, 15<(?)?80, 0?(?)<5, 8.0?([Bi]+[Pb]?0.002)1/2×10+([P]?0.001)1/2×5+((?)?7)1/2×([Si]?0.1)1/2×1.2+(?)1/2×0.5?17.0, and 0.9?([Bi]+[Pb]?0.002)1/2×((?)?7)1/2×([Si]?0.1)1/2?4.0 are satisfied, and a particle containing Bi is present in ? phase.Type: GrantFiled: December 23, 2019Date of Patent: October 17, 2023Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto
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Patent number: 11512370Abstract: This free-cutting copper alloy contains Cu: 58.5 to 63.5%, Si: more than 0.4% and 1.0% or less, Pb: 0.003 to 0.25%, and P: 0.005 to 0.19%, with the remainder being Zn and inevitable impurities, a total amount of Fe, Mn, Co and Cr is less than 0.40%, a total amount of Sn and Al is less than 0.40%, a relationship of 56.3?f1=[Cu]?4.7×[Si]+0.5×[Pb]?0.5×[P]?59.3 is satisfied, constituent phases of a metal structure have relationships of 20?(?)?75, 25?(?)?80, 0?(?)<2, 20?(?)1/2×3+(?)×(?0.5×([Si])2+1.5×[Si])?78, and 33?(?)1/2×3+(?)×(?0.5×([Si])2+1.5×[Si])+([Pb])1/2×33+([P])1/2×14, and a compound including P is present in ? phase.Type: GrantFiled: December 11, 2019Date of Patent: November 29, 2022Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto
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Patent number: 11479834Abstract: This free-cutting copper alloy includes Cu: more than 61.0% and less than 65.0%, Si: more than 1.0% and less than 1.5%, Pb: 0.003% to less than 0.20%, and P: more than 0.003% and less than 0.19%, with the remainder being Zn and unavoidable impurities, a total content of Fe, Mn, Co, and Cr is less than 0.40%, a total content of Sn and Al is less than 0.40%, a relationship of 56.5?f1=[Cu]?4.5×[Si]+0.5×[Pb]?[P]?59.5 is satisfied, constituent phases of a metallographic structure have relationships of 20?(?)?80, 15?(?)?80, 0?(?)<8, 18×(?)/(?)<9, 20?(?)1/2×3+(?)×([Si])1/2?88, and 33?(?)1/2×3+(?)×([Si])1/2+([Pb])1/2×35+([P])1/2×15, and a compound including P is present in ? phase.Type: GrantFiled: December 11, 2019Date of Patent: October 25, 2022Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto
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Patent number: 11434548Abstract: This free-cutting copper alloy comprises 75.4-78.7% Cu, 3.05-3.65% Si, 0.10-0.28% Sn, 0.05-0.14% P, and at least 0.005% to less than 0.020% Pb, with the remainder comprising Zn and inevitable impurities. The composition satisfies the following relations: 76.5?f1=Cu+0.8×Si?8.5×Sn+P?80.3; 60.7?f2=Cu?4.6×Si?0.7×Sn?P?62.1; and 0.25?f7=P/Sn?1.0. The area percentage (%) of respective constituent phases satisfies the following relations: 28???67; 0???1.0; 0???0.2; 0???1.5; 97.4?f3=?+?; 99.4?f4=?+?+?+?; 0?f5=?+??2.0; and 30?f6=?+6×?1/2+0.5×??70. The long side of the ? phase is at most 40 ?m, the long side of the ? phase is at most 25 ?m, and ? phase is present in ? phase.Type: GrantFiled: February 21, 2018Date of Patent: September 6, 2022Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Keiichiro Oishi, Kouichi Suzaki, Shinji Tanaka, Takayuki Oka
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Publication number: 20220275479Abstract: This copper alloy casting includes, in terms of mass %: Cu: higher than 58.5% and lower than 65.0%; Si: higher than 0.40% and lower than 1.40%; Pb: higher than 0.002% and lower than 0.25%; P: higher than 0.003% and lower than 0.19%; and Bi: 0.001% to 0.100% as an optional element, with the balance being Zn and inevitable impurities, the total content of Fe, Mn, Co, and Cr is lower than 0.45% and the total content of Sn and Al is lower than 0.45%, a relationship of 56.0?f1=[Cu]?5×[Si]+0.5×[Pb]+0.5×[Bi]?0.5×[P]?59.5 is satisfied, when Bi is included, a relationship of 0.003<f0=[Pb]+[Bi]<0.25 is further satisfied.Type: ApplicationFiled: February 17, 2020Publication date: September 1, 2022Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto
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Patent number: 11421302Abstract: This free-cutting copper alloy comprises 76.0-78.7% Cu, 3.1-3.6% Si, 0.40-0.85% Sn, 0.05-0.14% P, and at least 0.005% to less than 0.020% Pb, with the remainder comprising Zn and inevitable impurities. The composition satisfies the following relations: 75.0?f1=Cu+0.8×Si?7.5×Sn+P+0.5×Pb?78.2; 60.0?f2=Cu?4.8×Si?0.8×Sn?P+0.5×Pb?61.5; and 0.09?f3=P/Sn?0.30. The area percentage (%) of respective constituent phases satisfies the following relations: 30???65; 0???2.0; 0???0.3; 0???2.0; 96.5?f4=?+?; 99.4?f5=?+?+?+?; 0?f6=?+??3.0; and 35?f7=1.05×?+6×?1/2+0.5×??70. ? phase is present in ? phase, the long side of the ? phase is at most 50 ?m, and the long side of the ? phase is at most 25 ?m.Type: GrantFiled: February 21, 2018Date of Patent: August 23, 2022Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto, Shinji Tanaka
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Patent number: 11421301Abstract: This free-cutting copper alloy casting contains: 76.0-79.0% Cu, 3.1-3.6% Si, 0.36-0.85% Sn, 0.06-0.14% P, 0.022-0.10% Pb, with the remainder being made up of Zn and unavoidable impurities. This composition satisfies the following relations: 75.5?f1=Cu+0.8×Si?7.5×Sn+P+0.5×Pb?78.7, 60.8?f2=Cu?4.5×Si—0.8×Sn?P+0.5×Pb?62.2, 0.09?f3=P/Sn?0.35. The area ratios (%) of the constituent phases satisfy the following relations, 30???63, 0???2.0, 0???0.3, 0???2.0, 96.5?f4=?+?, 99.3?f5=?+?+?+?, 0?f6=?+??3.0, and 37?f7=1.05×?+6×?1/2+0.5×??72. The ? phase is present within the ? phase, the long side of the ? phase does not exceed 50 ?m, and the long side of the ? phase does not exceed 25 ?m.Type: GrantFiled: August 15, 2017Date of Patent: August 23, 2022Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Keiichiro Oishi, Kouichi Suzaki, Shinji Tanaka, Yoshiyuki Goto
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Publication number: 20220259711Abstract: This free-cutting copper alloy contains Cu: more than 57.5% but less than 64.5%, Si: more than 0.20% but less than 1.20%, Pb: more than 0.001% but less than 0.20%, Bi: more than 0.10% but less than 1.00%, and P: more than 0.001% but less than 0.20%, with the balance being Zn and unavoidable impurities, wherein the total amount of Fe, Mn, Co and Cr is less than 0.45%, the total amount of Sn and Al is less than 0.45%, relationships of 56.3?f1=[Cu]?4.8×[Si]+0.5×[Pb]+0.5×[Bi]?0.5×[P]?59.5 and 0.12?f2=[Pb]+[Bi]<1.0 are satisfied.Type: ApplicationFiled: March 16, 2020Publication date: August 18, 2022Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto
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Publication number: 20220186352Abstract: This free-cutting copper alloy includes Cu: more than 58.0% and less than 65.0%, Si: more than 0.30% and less than 1.30%, Pb: more than 0.001% and 0.20% or less, Bi: more than 0.020% and 0.10% or less, and P: more than 0.001% and less than 0.20%, with the remainder being Zn and unavoidable impurities, a total amount of Fe, Mn, Co and Cr is less than 0.45%, a total amount of Sn and Al is less than 0.45%, relationships of 56.5?[Cu]?4.7×[Si]+0.5×[Pb]+0.5×[Bi]?0.5×[P]?59.5, and 0.025?[Pb]+[Bi]<0.25 are satisfied, in constituent phases of a metallographic structure, relationships of 20?(?)<85, 15<(?)?80, 0?(?)<5, 8.0?([Bi]+[Pb]?0.002)1/2×10+([P]?0.001)1/2×5+((?)?7)1/2×([Si]?0.1)1/2×1.2+(?)1/2×0.5?17.0, and 0.9?([Bi]+[Pb]?0.002)1/2×((?)?7)1/2×([Si]?0.1)1/2?4.0 are satisfied, and a particle containing Bi is present in ? phase.Type: ApplicationFiled: December 23, 2019Publication date: June 16, 2022Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto
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Patent number: 11313013Abstract: This free-cutting copper alloy contains more than 77.0% but less than 81.0% Cu, more than 3.4% but less than 4.1% Si, 0.07% to 0.28% Sn, 0.06% to 0.14% P, and more than 0.02% but less than 0.25% Pb, with the remainder being made up of Zn and unavoidable impurities. The composition satisfies the following relations: 1.0?f0=100×Sn/(Cu+Si+0.5×Pb+0.5×P?75.5)?3.7, 78.5?f1=Cu+0.8×Si?8.5×Sn+P+0.5×Pb?83.0, 61.8?f2=Cu?4.2×Si?0.5×Sn?2×P?63.7. The area ratios (%) of the constituent phases satisfy the following relations, 36???72, 0???2.0, 0???0.5, 0???2.0, 96.5?f3=?+?, 99.4?f4=?+?+?+?, 0?f5=?+??3.0, 38?f6=?+6×?1/2+0.5×??80. The long side of the ? phase does not exceed 50 ?m, and the long side of the ? phase does not exceed 25 ?m.Type: GrantFiled: August 15, 2017Date of Patent: April 26, 2022Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Keiichiro Oishi, Kouichi Suzaki, Shinji Tanaka, Yoshiyuki Goto
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Publication number: 20220090249Abstract: This free-cutting copper alloy includes Cu: more than 61.0% and less than 65.0%, Si: more than 1.0% and less than 1.5%, Pb: 0.003% to less than 0.20%, and P: more than 0.003% and less than 0.19%, with the remainder being Zn and unavoidable impurities, a total content of Fe, Mn, Co, and Cr is less than 0.40%, a total content of Sn and Al is less than 0.40%, a relationship of 56.5?f1=[Cu]?4.5×[Si]+0.5×[Pb]?[P]?59.5 is satisfied, constituent phases of a metallographic structure have relationships of 20?(?)?80, 15?(?)?80, 0?(?)<8, 18×(?)/(?)<9, 20?(?)1/2×3+(?)×([Si])1/2?88, and 33?(?)1/2×3+(?)×([Si])1/2+([Pb])1/2×35+([P])1/2×15, and a compound including P is present in ? phase.Type: ApplicationFiled: December 11, 2019Publication date: March 24, 2022Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto
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Publication number: 20220042141Abstract: This free-cutting copper alloy contains Cu: 58.5 to 63.5%, Si: more than 0.4% and 1.0% or less, Pb: 0.003 to 0.25%, and P: 0.005 to 0.19%, with the remainder being Zn and inevitable impurities, a total amount of Fe, Mn, Co and Cr is less than 0.40%, a total amount of Sn and Al is less than 0.40%, a relationship of 56.3?f1=[Cu]?4.7×[Si]+0.5×[Pb]?0.5×[P]?59.3 is satisfied, constituent phases of a metal structure have relationships of 20?(?)?75, 25?(?)?80, 0?(?)<2, 20?(?)1/2×3+(?)×(?0.5×([Si])2+1.5×[Si])?78, and 33?(?)1/2×3+(?)×(?0.5×([Si])2+1.5×[Si])+([Pb])1/2×33+([P])1/2×14, and a compound including P is present in ? phase.Type: ApplicationFiled: December 11, 2019Publication date: February 10, 2022Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto
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Patent number: 11155909Abstract: This high-strength free-cutting copper alloy comprises 75.4-78.0% Cu, 3.05-3.55% Si, 0.05-0.13% P and 0.005-0.070% Pb, with the remainder comprising Zn and inevitable impurities, wherein the amount of Sn existing as inevitable impurities is at most 0.05%, the amount of Al is at most 0.05%, and the total amount of Sn and Al is at most 0.06%. The composition satisfies the following relations: 78.0?f1=Cu+0.8×Si+P+Pb?80.8; and 60.2?f2=Cu?4.7×Si?P+0.5×Pb?61.5. The area percentage (%) of respective constituent phases satisfies the following relations: 29???60; 0???0.3; ?=0; 0???1.0; 98.6?f3=?+?; 99.7?f4=?+?+?+?; 0?f5=?+??1.2; and 30?f6=?+6×?1/2+0.5×??62. The long side of the ? phase is at most 25 ?m, the long side of the ? phase is at most 20 ?m, and the ? phase is present within the ? phase.Type: GrantFiled: August 22, 2019Date of Patent: October 26, 2021Assignee: Mitsubishi Materials CorporationInventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto
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Patent number: 11136648Abstract: This free-cutting copper alloy contains 76.0%-79.0% Cu, 3.1%-3.6% Si, 0.36%-0.84% Sn, 0.06%-0.14% P, 0.022%-0.10% Pb, with the remainder being made up of Zn and unavoidable impurities. The composition satisfies the following relations: 74.4?f1=Cu+0.8×Si?8.5×Sn+P+0.5×Pb?78.2, 61.2?f2=Cu?4.4×Si?0.7×Sn?P+0.5×Pb?62.8, 0.09?f3=P/Sn?0.35. The area ratio (%) of the constituent phases satisfies the following relations: 30???65, 0???2.0, 0???0.3, 0???2.0, 96.5?f4=?+?, 99.4?f5=?+?+?+?, 0?f6=?+??3.0, 36?f7=1.05×?+6×?1/2+0.5×??72. The ? phase is present within the ? phase, the long side of the ? phase does not exceed 50 ?m, and the long side of the ? phase does not exceed 25 ?m.Type: GrantFiled: August 15, 2017Date of Patent: October 5, 2021Assignee: Mitsubishi Materials CorporationInventors: Keiichiro Oishi, Kouichi Suzaki, Shinji Tanaka, Yoshiyuki Goto
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Patent number: 11131009Abstract: This high-strength free-cutting copper alloy comprises 75.4-78.0% Cu, 3.05-3.55% Si, 0.05-0.13% P and 0.005-0.070% Pb, with the remainder comprising Zn and inevitable impurities, wherein the amount of Sn existing as inevitable impurities is at most 0.05%, the amount of Al is at most 0.05%, and the total amount of Sn and Al is at most 0.06%. The composition satisfies the following relations: 78.0?f1=Cu+0.8×Si+P+Pb?80.8; and 60.2?f2=Cu?4.7×Si?P+0.5×Pb?61.5. The area percentage (%) of respective constituent phases satisfies the following relations: 29???60; 0???0.3; ?=0; 0???1.0; 98.6?f3=?+?; 99.7?f4=?+?+?+?; 0?f5=?+??1.2; and 30?f6=?+6×?1/2+0.5×??62. The long side of the ? phase is at most 25 ?m, the long side of the ? phase is at most 20 ?m, and the ? phase is present within the ? phase.Type: GrantFiled: February 21, 2018Date of Patent: September 28, 2021Assignee: Mitsubishi Materials CorporationInventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto
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Publication number: 20200181739Abstract: This high-strength free-cutting copper alloy comprises 75.4-78.0% Cu, 3.05-3.55% Si, 0.05-0.13% P and 0.005-0.070% Pb, with the remainder comprising Zn and inevitable impurities, wherein the amount of Sn existing as inevitable impurities is at most 0.05%, the amount of Al is at most 0.05%, and the total amount of Sn and Al is at most 0.06%. The composition satisfies the following relations: 78.0?f1=Cu+0.8×Si+P+Pb?80.8; and 60.2?f2=Cu?4.7×Si?P+0.5×Pb?61.5. The area percentage (%) of respective constituent phases satisfies the following relations: 29???60; 0???0.3; ?=0; 0???1.0; 98.6?f3=?+?; 99.7?f4=?+?+?+?; 0?f5=?+??1.2; and 30?f6=?+6×?1/2+0.5×??62. The long side of the ? phase is at most 25 ?m, the long side of the ? phase is at most 20 ?m, and the ? phase is present within the ? phase.Type: ApplicationFiled: February 21, 2018Publication date: June 11, 2020Inventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto
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Publication number: 20200181748Abstract: This free-cutting copper alloy comprises 76.0-78.7% Cu, 3.1-3.6% Si, 0.40-0.85% Sn, 0.05-0.14% P, and at least 0.005% to less than 0.020% Pb, with the remainder comprising Zn and inevitable impurities. The composition satisfies the following relations: 75.0?f1=Cu+0.8×Si?7.5×Sn+0.5×Pb?78.2; 60.0?f2=Cu?4.8×Si—0.8×Sn?P+0.5×Pb?61.5; and 0.09?f3=P/Sn?0.30. The area percentage (%) of respective constituent phases satisfies the following relations: 30???65; 0???2.0; 0???0.3; 0???2.0; 96.5?f4=?+?; 99.4?f5=?+?+?+?; 0?f6=?+??3.0; and 35?f7=1.05×?+6×?1/2+0.5×??70. ? phase is present in ? phase, the long side of the ? phase is at most 50 ?m, and the long side of the ? phase is at most 25 ?m.Type: ApplicationFiled: February 21, 2018Publication date: June 11, 2020Inventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto, Shinji Tanaka
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Publication number: 20200165706Abstract: This free-cutting copper alloy comprises 75.4-78.7% Cu, 3.05-3.65% Si, 0.10-0.28% Sn, 0.05-0.14% P, and at least 0.005% to less than 0.020% Pb, with the remainder comprising Zn and inevitable impurities. The composition satisfies the following relations: 76.5?f1=Cu+0.8×Si?8.5×Sn+P?80.3; 60.7?f2=Cu?4.6×Si?0.7×Sn?P?62.1; and 0.25?f7=P/Sn?1.0. The area percentage (%) of respective constituent phases satisfies the following relations: 28???67; 0???1.0; 0???0.2; 0???1.5; 97.4?f3=?+?; 99.4?f4=?+?+?+?; 0?f5=?+??2.0; and 30?f6=?+6×?1/2+0.5×??70. The long side of the ? phase is at most 40 ?m, the long side of the ? phase is at most 25 ?m, and ? phase is present in ? phase.Type: ApplicationFiled: February 21, 2018Publication date: May 28, 2020Inventors: Keiichiro Oishi, Kouichi Suzaki, Shinji Tanaka, Takayuki Oka