Patents by Inventor Kouichi Suzaki

Kouichi Suzaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200181748
    Abstract: This free-cutting copper alloy comprises 76.0-78.7% Cu, 3.1-3.6% Si, 0.40-0.85% Sn, 0.05-0.14% P, and at least 0.005% to less than 0.020% Pb, with the remainder comprising Zn and inevitable impurities. The composition satisfies the following relations: 75.0?f1=Cu+0.8×Si?7.5×Sn+0.5×Pb?78.2; 60.0?f2=Cu?4.8×Si—0.8×Sn?P+0.5×Pb?61.5; and 0.09?f3=P/Sn?0.30. The area percentage (%) of respective constituent phases satisfies the following relations: 30???65; 0???2.0; 0???0.3; 0???2.0; 96.5?f4=?+?; 99.4?f5=?+?+?+?; 0?f6=?+??3.0; and 35?f7=1.05×?+6×?1/2+0.5×??70. ? phase is present in ? phase, the long side of the ? phase is at most 50 ?m, and the long side of the ? phase is at most 25 ?m.
    Type: Application
    Filed: February 21, 2018
    Publication date: June 11, 2020
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto, Shinji Tanaka
  • Publication number: 20200181739
    Abstract: This high-strength free-cutting copper alloy comprises 75.4-78.0% Cu, 3.05-3.55% Si, 0.05-0.13% P and 0.005-0.070% Pb, with the remainder comprising Zn and inevitable impurities, wherein the amount of Sn existing as inevitable impurities is at most 0.05%, the amount of Al is at most 0.05%, and the total amount of Sn and Al is at most 0.06%. The composition satisfies the following relations: 78.0?f1=Cu+0.8×Si+P+Pb?80.8; and 60.2?f2=Cu?4.7×Si?P+0.5×Pb?61.5. The area percentage (%) of respective constituent phases satisfies the following relations: 29???60; 0???0.3; ?=0; 0???1.0; 98.6?f3=?+?; 99.7?f4=?+?+?+?; 0?f5=?+??1.2; and 30?f6=?+6×?1/2+0.5×??62. The long side of the ? phase is at most 25 ?m, the long side of the ? phase is at most 20 ?m, and the ? phase is present within the ? phase.
    Type: Application
    Filed: February 21, 2018
    Publication date: June 11, 2020
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto
  • Publication number: 20200165706
    Abstract: This free-cutting copper alloy comprises 75.4-78.7% Cu, 3.05-3.65% Si, 0.10-0.28% Sn, 0.05-0.14% P, and at least 0.005% to less than 0.020% Pb, with the remainder comprising Zn and inevitable impurities. The composition satisfies the following relations: 76.5?f1=Cu+0.8×Si?8.5×Sn+P?80.3; 60.7?f2=Cu?4.6×Si?0.7×Sn?P?62.1; and 0.25?f7=P/Sn?1.0. The area percentage (%) of respective constituent phases satisfies the following relations: 28???67; 0???1.0; 0???0.2; 0???1.5; 97.4?f3=?+?; 99.4?f4=?+?+?+?; 0?f5=?+??2.0; and 30?f6=?+6×?1/2+0.5×??70. The long side of the ? phase is at most 40 ?m, the long side of the ? phase is at most 25 ?m, and ? phase is present in ? phase.
    Type: Application
    Filed: February 21, 2018
    Publication date: May 28, 2020
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Shinji Tanaka, Takayuki Oka
  • Publication number: 20200157658
    Abstract: This free-cutting copper alloy casting contains: 76.0-79.0% Cu, 3.1-3.6% Si, 0.36-0.85% Sn, 0.06-0.14% P, 0.022-0.10% Pb, with the remainder being made up of Zn and unavoidable impurities. This composition satisfies the following relations: 75.5?f1=Cu+0.8×Si?7.5×Sn+P+0.5×Pb?78.7, 60.8?f2=Cu?4.5×Si—0.8×Sn?P+0.5×Pb?62.2, 0.09?f3=P/Sn?0.35. The area ratios (%) of the constituent phases satisfy the following relations, 30???63, 0???2.0, 0???0.3, 0???2.0, 96.5?f4=?+?, 99.3?f5=?+?+?+?, 0?f6=?+??3.0, and 37?f7=1.05×?+6×?1/2+0.5×??72. The ? phase is present within the ? phase, the long side of the ? phase does not exceed 50 ?m, and the long side of the ? phase does not exceed 25 ?m.
    Type: Application
    Filed: August 15, 2017
    Publication date: May 21, 2020
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Shinji Tanaka, Yoshiyuki Goto
  • Publication number: 20200123633
    Abstract: This free-cutting copper alloy contains 76.0%-79.0% Cu, 3.1%-3.6% Si, 0.36%-0.84% Sn, 0.06%-0.14% P, 0.022%-0.10% Pb, with the remainder being made up of Zn and unavoidable impurities. The composition satisfies the following relations: 74.4?f1=Cu+0.8×Si?8.5×Sn+P+0.5×Pb?78.2, 61.2?f2=Cu?4.4×Si?0.7×Sn?P+0.5×Pb?62.8, 0.09?f3=P/Sn?0.35. The area ratio (%) of the constituent phases satisfies the following relations: 30???65, 0???2.0, 0???0.3, 0???2.0, 96.5?f4=?+?, 99.4?f5=?+?+?+?, 0?f6=?+??3.0, 36?f7=1.05×?+6×?1/2+0.5×??72. The ? phase is present within the ? phase, the long side of the ? phase does not exceed 50 ?m, and the long side of the ? phase does not exceed 25 ?m.
    Type: Application
    Filed: August 15, 2017
    Publication date: April 23, 2020
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Shinji Tanaka, Yoshiyuki Goto
  • Patent number: 10557185
    Abstract: This free-cutting copper alloy contains 75.0%-78.5% Cu, 2.95%-3.55% Si, 0.07%-0.28% Sn, 0.06%-0.14% P, and 0.022%-0.25% Pb, with the remainder being made up of Zn and inevitable impurities. The composition satisfies the following relations: 76.2?f1=Cu+0.8×Si?8.5×Sn+P+0.5×Pb?80.3, 61.5?f2=Cu?4.3×Si?0.7×Sn?P+0.5×Pb?63.3. The area ratios (%) of the constituent phases satisfy the following relations: 25???65, 0???1.5, 0???0.2, 0???2.0, 97.0?f3=?+?, 99.4?f4=?+?+?+?, 0?f5=?+??2.5, 27?f6=?+6×?1/2+0.5×??70. The long side of the ? phase does not exceed 40 ?m, the long side of the ? phase does not exceed 25 ?m, and the ? phase is present within the ? phase.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: February 11, 2020
    Assignee: Mitsubishi Shindoh Co., Ltd.
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Shinji Tanaka, Takayuki Oka
  • Publication number: 20200040437
    Abstract: This high-strength free-cutting copper alloy comprises 75.4-78.0% Cu, 3.05-3.55% Si, 0.05-0.13% P and 0.005-0.070% Pb, with the remainder comprising Zn and inevitable impurities, wherein the amount of Sn existing as inevitable impurities is at most 0.05%, the amount of Al is at most 0.05%, and the total amount of Sn and Al is at most 0.06%. The composition satisfies the following relations: 78.0?f1=Cu+0.8×Si+P+Pb?80.8; and 60.2?f2=Cu?4.7×Si?P+0.5×Pb?61.5. The area percentage (%) of respective constituent phases satisfies the following relations: 29???60; 0???0.3; ?=0; 0???1.0; 98.6?f3=?+?; 99.7?f4=?+?+?+?; 0?f5=?+??1.2; and 30?f6=?+6×?1/2+0.5×??62. The long side of the ? phase is at most 25 ?m, the long side of the ? phase is at most 20 ?m, and the ? phase is present within the ? phase.
    Type: Application
    Filed: August 22, 2019
    Publication date: February 6, 2020
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto
  • Patent number: 10538828
    Abstract: This free-cutting copper alloy contains 75.0 %-78.5% Cu, 2.95%-3.55% Si, 0.07%-0.28% Sn, 0.06%-0.14% P, and 0.022%-0.25% Pb, with the remainder being made up of Zn and inevitable impurities. The composition satisfies the following relations: 76.2?f1=Cu+0.8×Si?8.5×Sn+P+0.5×Pb?80.3, 61.5?f2=Cu?4.3×Si?0.7×Sn?P+0.5×Pb?63.3. The area ratios (%) of the constituent phases satisfy the following relations: 25???65, 0???1.5, 0???0.2, 0???2.0, 97.0?f3=?+?, 99.4?f4=?+?+?+?, 0?f5=?+??2.5, 27?f6=?+6×?1/2+0.5×??70. The long side of the ? phase does not exceed 40 ?m, the long side of the ? phase does not exceed 25 ?m, and the ? phase is present within the ? phase.
    Type: Grant
    Filed: August 15, 2017
    Date of Patent: January 21, 2020
    Assignee: Mitsubishi Shindoh Co., Ltd.
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Shinji Tanaka, Takayuki Oka
  • Patent number: 10538827
    Abstract: This free-cutting copper alloy casting contains 75.0-78.5% Cu, 2.95-3.55% Si, 0.07-0.28% Sn, 0.06-0.14% P, 0.022-0.20% Pb, with the remainder being made up of Zn and unavoidable impurities. The composition satisfies the following relations: 76.2?f1=Cu+0.8×Si?8.5×Sn+P+0.5×Pb?80.3, 61.2?f2=Cu?4.4×Si?0.8×Sn?P+0.5×Pb?62.8. The area ratios (%) of the constituent phases satisfy the following relations: 2.5??65, 0???2.0, 0???0.3, 0???2.0, 96.5?f3=?+?, 99.2?f4=?+?+?+?, 0?f6=?+??3.0, 29?f6=?+6×?1/2+0.5×??66. The long side of the ? phase does not exceed 50 ?m, the long side of the ? phase does not exceed 25 ?m, and the ? phase is present within the ? phase.
    Type: Grant
    Filed: August 15, 2017
    Date of Patent: January 21, 2020
    Assignee: Mitsubishi Shindoh Co., Ltd.
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Shinji Tanaka, Yoshiyuki Goto
  • Publication number: 20190256960
    Abstract: This free-cutting copper alloy casting contains 75.0-78.5% Cu, 2.95-3.55% Si, 0.07-0.28% Sn, 0.06-0.14% P, 0.022-0.20% Pb, with the remainder being made up of Zn and unavoidable impurities. The composition satisfies the following relations: 76.2?f1=Cu+0.8×Si?8.5×Sn+P+0.5×Pb?80.3, 61.2?f2=Cu?4.4×Si?0.8×Sn?P+0.5×Pb?62.8. The area ratios (%) of the constituent phases satisfy the following relations: 2.5??65, 0???2.0, 0???0.3, 0???2.0, 96.5?f3=?+?, 99.2?f4=?+?+?+?, 0?f6=?+??3.0, 29?f6=?+6×?1/2+0.5×??66. The long side of the ? phase does not exceed 50 ?m, the long side of the ? phase does not exceed 25 ?m, and the ? phase is present within the ? phase.
    Type: Application
    Filed: August 15, 2017
    Publication date: August 22, 2019
    Applicant: Mitsubishi Shindoh Co., Ltd.
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Shinji Tanaka, Yoshiyuki Goto
  • Publication number: 20190249276
    Abstract: This free-cutting copper alloy contains 75.0%-78.5% Cu, 2.95%-3.55% Si, 0.07%-0.28% Sn, 0.06%-0.14% P, and 0.022%-0.25% Pb, with the remainder being made up of Zn and inevitable impurities. The composition satisfies the following relations: 76.2?f1=Cu+0.8×Si?8.5×Sn+P+0.5×Pb?80.3, 61.5?f2=Cu?4.3×Si?0.7×Sn?P+0.5×Pb?63.3. The area ratios (%) of the constituent phases satisfy the following relations: 25???65, 0???1.5, 0???0.2, 0???2.0, 97.0?f3=?+?, 99.4?f4=?+?+?+?, 0?f5=?+??2.5, 27?f6=?+6×?1/2+0.5×??70. The long side of the ? phase does not exceed 40 ?m, the long side of the ? phase does not exceed 25 ?m, and the ? phase is present within the ? phase.
    Type: Application
    Filed: August 15, 2017
    Publication date: August 15, 2019
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Shinji Tanaka, Takayuki Oka
  • Publication number: 20190241999
    Abstract: This free-cutting copper alloy contains 75.0%-78.5% Cu, 2.95%-3.55% Si, 0.07%-0.28% Sn, 0.06%-0.14% P, and 0.022%-0.25% Pb, with the remainder being made up of Zn and inevitable impurities. The composition satisfies the following relations: 76.2?f1=Cu+0.8×Si?8.5×Sn+P+0.5×Pb?80.3, 61.5?f2=Cu?4.3×Si?0.7×Sn?P+0.5×Pb?63.3. The area ratios (%) of the constituent phases satisfy the following relations: 25???65, 0???1.5, 0???0.2, 0???2.0, , 97.0?f3=?+?, 99.4?f4=?+?+?+?, 0?f5=?+??2.5, 27?f6=?+6×?1/2+0.5×??70. The long side of the ? phase does not exceed 40 ?m, the long side of the ? phase does not exceed 25 ?m, and the ? phase is present within the ? phase.
    Type: Application
    Filed: February 13, 2019
    Publication date: August 8, 2019
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Shinji Tanaka, Takayuki Oka
  • Publication number: 20190169711
    Abstract: This free-cutting copper alloy contains more than 77.0% but less than 81.0% Cu, more than 3.4% but less than 4.1% Si, 0.07% to 0.28% Sn, 0.06% to 0.14% P, and more than 0.02% but less than 0.25% Pb, with the remainder being made up of Zn and unavoidable impurities. The composition satisfies the following relations: 1.0?f0=100×Sn/(Cu+Si+0.5×Pb+0.5×P?75.5)?3.7, 78.5?f1=Cu+0.8×Si?8.5×Sn+P+0.5×Pb?83.0, 61.8?f2=Cu?4.2×Si?0.5×Sn?2×P?63.7. The area ratios (%) of the constituent phases satisfy the following relations, 36???72, 0???2.0, 0???0.5, 0???2.0, 96.5?f3=?+?, 99.4?f4=?+?+?+?, 0?f5=?+??3.0, 38?f6=?+6×?1/2+0.5×??80. The long side of the ? phase does not exceed 50 ?m, and the long side of the ? phase does not exceed 25 ?m.
    Type: Application
    Filed: August 15, 2017
    Publication date: June 6, 2019
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Shinji Tanaka, Yoshiyuki Goto
  • Patent number: 9121086
    Abstract: An aspect of the copper alloy sheet contains 5.0 mass % to 12.0 mass % of Zn, 1.1 mass % to 2.5 mass % of Sn, 0.01 mass % to 0.09 mass % of P and 0.6 mass % to 1.5 mass % of Ni with a remainder of Cu and inevitable impurities, and satisfies a relationship of 20?[Zn]+7×[Sn]+15×[P]+4.5×[Ni]?32. The aspect of the copper alloy sheet is manufactured using a manufacturing process including a cold finishing rolling process in which a copper alloy material is cold-rolled, the average crystal grain diameter of the copper alloy material is 1.2 ?m to 5.0 ?m, round or oval precipitates are present in the copper alloy material, the average grain diameter of the precipitates is 4.0 nm to 25.0 nm or a proportion of precipitates having a grain diameter of 4.0 nm to 25.0 nm in the precipitates is 70 % or more.
    Type: Grant
    Filed: January 24, 2014
    Date of Patent: September 1, 2015
    Assignee: Mitsubishi Shindoh Co., Ltd.
    Inventors: Keiichiro Oishi, Kouichi Suzaki
  • Patent number: 9080228
    Abstract: An aspect of the copper alloy sheet contains 5.0 mass % to 12.0 mass % of Zn, 1.1 mass % to 2.5 mass % of Sn, 0.01 mass % to 0.09 mass % of P and 0.6 mass % to 1.5 mass % of Ni with a remainder of Cu and inevitable impurities, and satisfies a relationship of 20?[Zn]+7×[Sn]+15×[P]+4.5×[Ni]?32. The aspect of the copper alloy sheet is manufactured using a manufacturing process including a cold finishing rolling process in which a copper alloy material is cold-rolled, the average crystal grain diameter of the copper alloy material is 1.2 ?m to 5.0 ?m, round or oval precipitates are present in the copper alloy material, the average grain diameter of the precipitates is 4.0 nm to 25.0 nm or a proportion of precipitates having a grain diameter of 4.0 nm to 25.0 nm in the precipitates is 70% or more.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: July 14, 2015
    Assignee: Mitsubishi Shindoh Co., Ltd.
    Inventors: Keiichiro Oishi, Kouichi Suzaki
  • Publication number: 20140255248
    Abstract: An aspect of the copper alloy sheet contains 5.0 mass % to 12.0 mass % of Zn, 1.1 mass % to 2.5 mass % of Sn, 0.01 mass % to 0.09 mass % of P and 0.6 mass % to 1.5 mass % of Ni with a remainder of Cu and inevitable impurities, and satisfies a relationship of 20?[Zn]+7×[Sn]+15×[P]+4.5×[Ni]?32. The aspect of the copper alloy sheet is manufactured using a manufacturing process including a cold finishing rolling process in which a copper alloy material is cold-rolled, the average crystal grain diameter of the copper alloy material is 1.2 ?m to 5.0 ?m, round or oval precipitates are present in the copper alloy material, the average grain diameter of the precipitates is 4.0 nm to 25.0 nm or a proportion of precipitates having a grain diameter of 4.0 nm to 25.0 nm in the precipitates is 70% or more.
    Type: Application
    Filed: September 14, 2012
    Publication date: September 11, 2014
    Applicant: MITSUBISHI SHINDOH CO., LTD.
    Inventors: Keiichiro Oishi, Kouichi Suzaki
  • Publication number: 20140202602
    Abstract: An aspect of the copper alloy sheet contains 5.0 mass % to 12.0 mass % of Zn, 1.1 mass % to 2.5 mass % of Sn, 0.01 mass % to 0.09 mass % of P and 0.6 mass % to 1.5 mass % of Ni with a remainder of Cu and inevitable impurities, and satisfied a relationship of 20?[Zn]+7×[Sn]+15×[P]+4.5×[Ni]?32. The aspect of the copper alloy sheet is manufactured using a manufacturing process including a cold finishing rolling process in which a copper alloy material is cold-rolled, the average crystal grain diameter of the copper alloy material is 1.2 ?m to 5.0 ?m, round or oval precipitates are present in the copper alloy material, the average grain diameter of the precipitates is 4.0 nm to 25.0 nm or a proportion of precipitates having a grain diameter of 4.0 nm to 25.0 nm in the precipitates is 70 % or more.
    Type: Application
    Filed: January 24, 2014
    Publication date: July 24, 2014
    Applicant: MITSUBISHI SHINDOH CO., LTD.
    Inventors: Keiichiro Oishi, Kouichi Suzaki