Abstract: An intercooler has a case through which supercharging air passes, and a heat exchanger 4 mounted inside the case which allows heat exchange between the supercharging air and a cooling fluid. A frame body 15 is provided at the circumferential edges of air passage portions of the heat exchanger 4 on a supercharging air intake side and a supercharging air outlet side to reduce the gap between the heat exchanger and the inner wall of the case. The heat exchanger 4 has a pair of tanks 43 and 44, tubes communicating between the tanks, and a plurality of fins 46 set along the tubes, and assumes a structure that allows the supercharging air to pass through the heat exchanger a plurality of times by sequentially passing through blocks formed by dividing a heat exchanging unit 4A into a plurality of blocks with partitioning plates 15d.

Abstract: In order to provide an intercooler assuming a simple structure that enables cooling of supercharging air and absorption of any expansion/contraction of the cooling water pipe and the casing attributable to the heat of the supercharging air, intake/outlet pipes of a heat exchanger housed inside a cooling space formed within a case are inserted at cylindrical pipe insertion portions formed at the case, and any gap present between the intake/outlet pipes and the insertion portions are sealed by seal members each constituted of an elastic material formed in a staged cylindrical shape having a first cylindrical portion placed in complete contact with one of the pipe insertion portions and a second cylindrical portion placed in complete contact with either one of the intake/outlet pipes, which are also utilized to fit the heat exchanger in the case with a gap.

Abstract: In order to provide an intercooler assuming a simple structure that enables cooling of supercharging air and absorption of any expansion/contraction of the cooling water pipe and the casing attributable to the heat of the supercharging air, intake/outlet pipes of a heat exchanger housed inside a cooling space formed within a case are inserted at cylindrical pipe insertion portions formed at the case, any gap present between the intake/outlet pipes and the insertion portions are sealed by seal members each constituted of an elastic material formed in a staged cylindrical shape having a first cylindrical portion placed in complete contact with one of the pipe insertion portions and a second cylindrical portion placed in complete contact with either one of the intake/outlet pipes, which are also utilized to fit the heat exchanger in the case with a gap.

Abstract: In order to suppress any backfire with a high degree of reliability and reduce the required mounting space and the weight of an intercooler by achieving a flame arrester function in the intercooler mounted to cool supercharging air without having to provide a separate arrester device, the intercooler having a case through which the supercharging air passes through and a heat exchanger 4 that is mounted inside the case and engages in heat exchange between the supercharging air and a cooling fluid includes a frame body 15 provided at the circumferential edges of air passage portions of the heat exchanger 4 on a supercharging air intake side and a supercharging air outlet side to reduce the gap between the heat exchanger and the inner wall of the case.

Abstract: A semiconductor device includes a semiconductor chip having top and bottom surfaces, upper leads electrically coupled to the semiconductor chip, where a first gap is formed between the upper leads and the top surface of the semiconductor chip, lower leads electrically coupled to the semiconductor chip, where a second gap is formed between the lower leads and the bottom surface of the semiconductor chip, and an encapsulating resin which encapsulates the semiconductor chip so as to maintain the first and second gaps.

Abstract: A process for manufacturing semiconductor device including a semiconductor chip having top and bottom surfaces, upper leads electrically coupled to the semiconductor chip, where a first gap is formed between the upper leads and the top surface of the semiconductor chip, lower leads electrically coupled to the semiconductor chip, where a second gap is formed between the lower leads and the bottom surface of the semiconductor chip, and an encapsulating resin which encapsulates the semiconductor chip so as to maintain the first and second gaps.

Abstract: A lead frame for manufacturing a semiconductor device has at least one set of substantially parallel leads having inner ends for connection to a semiconductor chip, outer ends for external connection and central portions therebetween and an outer tiebar interconnecting the outer ends and having an elongated guide hole therein, the longer dimension of the guide hole being parallel to the leads. A lead bending die has a locating pin respectively corresponding to and received in sliding engagement in each guide hole. The die maintains a center portion of them lead frame in a first plane and, with each locating pin remaining in sliding engagement within the respective, elongated guide hole, bends the central portions of the leads thereby to dispose the respective outer ends of the leads in a second plane, displaced from the first plane. The outer tiebar and the sliding engagement of the locating pin in the guide hole serve to prevent undesirable deformation of the leads as a result of the bending operation.