Abstract: Provided is a conductive composition for molded film that enables production of a molded film for which tensile force-induced reductions in conductivity are suppressed. The conductive composition for molded film contains a resin (A), conductive fine particles (B), and a solvent (C), wherein the solvent (C) contains, in 100 parts by mass of the solvent (C), at least 40 parts by mass of a solvent (C?) that satisfies the following condition (1) and condition (2). (1) A boiling point of 180° C. to 270° C. (2) At least one of the following is satisfied: the polar parameter ?p of the Hansen solubility parameter (HSP) is 0??p?5.0, and the hydrogen-bond parameter ?h of the Hansen solubility parameter (HSP) is 9.8??h?4.0.