Abstract: An engraved plate which includes a substrate and an insulating layer on a surface of the substrate wherein a concave portion which increases in width toward an opening and to which the substrate is exposed is formed at the insulating layer, and an engraved plate, a substrate with conductor layer pattern manufactured by a transferring method using the engraved plate, and a conductor layer pattern are provided.

Abstract: Provided is a front structure of a vehicle 1, and the front structure includes a pair of side frames 2 and a first cross member 31. The pair of side frames 2 are disposed respectively on both sides of the vehicle in a vehicle-width direction and extend in a front-to-rear direction. The first cross member extends in the vehicle-width direction, and connects front-end portions 25 of the pair of side frames 2. Each of the front-end portions 25 of the side frames 2 includes a protruding portion 26 that extends frontwards integrally thereof beyond the first cross member 31. In the event of a frontal collision of the vehicle 1, the protruding portions 26 absorb the produced energy, so that the amount of deformation of portions respectively of the side frames 2 located at rear sides of the front-end portions 25 can be reduced.

Abstract: Provided is a front structure of a vehicle 1, and the front structure includes a pair of side frames 2 and a first cross member 31. The pair of side frames 2 are disposed respectively on both sides of the vehicle in a vehicle-width direction and extend in a front-to-rear direction. The first cross member extends in the vehicle-width direction, and connects front-end portions 25 of the pair of side frames 2. Each of the front-end portions 25 of the side frames 2 includes a protruding portion 26 that extends frontwards integrally thereof beyond the first cross member 31. In the event of a frontal collision of the vehicle 1, the protruding portions 26 absorb the produced energy, so that the amount of deformation of portions respectively of the side frames 2 located at rear sides of the front-end portions 25 can be reduced.

Abstract: An engraved plate which includes a substrate and an insulating layer on a surface of the substrate wherein a concave portion which increases in width toward an opening and to which the substrate is exposed is formed at the insulating layer, and an engraved plate, a substrate with conductor layer pattern manufactured by a transferring method using the engraved plate, and a conductor layer pattern are provided.

Abstract: When an external force acts on a front side of a cab 10 at the time of a car collision or the like, the front side of the cab is deformed, so that a passenger space 15 is reduced from a value C to a value d. On the other hand, a power plant 3 advances because of an inertia force, and an oil pan 2 of the power plant 3 is brought into striking engagement with a suspension cross member 1, and therefore is prevented from further advancing. The value of the distance b between the power plant 3 and a rising portion 16 of a floor panel 14, as well as the value of the distance a between the suspension cross member 1 and the oil pan 2, is suitably determined, and also deforming properties of deformable members of the oil pan 2 are suitably determined. By doing so, the reduction or deformation of the passenger space 15 from the power plant side is prevented, thereby securing the safety of the passengers.

Abstract: A current protector comprising an organic resin-made insulating substrate, a pair of terminals formed at both ends of the insulating substrate, and an electrical conductor electrically connecting the terminals and having a thickness of 3-8 .mu.m and formed in or on the insulating substrate, is excellent in suppressing ignition and smoking at the time of blowing, and can be improved in clearing characteristics by various modifications.

Abstract: Provided is an electrostatic protective device which is highly effective in protecting relatively vulnerable devices such as IC's and LSI's from electrostatic damages, and a method for fabricating an electrostatic protective device which can simplify the structure as compared with the conventional devices sealed in a glass container, and can reduce the size and cost of the device. The chip type electrostatic protective device comprises an inner insulating layer made of organic resin material and provided with a plurality of holes for defining air gaps, a pair of outer insulating layers placed on both sides of the inner insulating layer, and circuit segments defining a discharge gap in each of the air gaps. Holes for interconnection are formed in the laminated assembly, and the interior of each of the holes is turned electroconductive.

Abstract: A multilayer printed circuit board small in interlayer thickness, capable of fine wiring, minimized in IVH and BVH diameters, high in strength and also excellent in wire bonding workability can be produced by a process comprising the steps of coating a thermosetting resin varnish compounded with electrically insulating whiskers on a roughened side of a copper foil, semi-curing the resin by heating to form a thermosetting resin layer, integrally laminating it on an interlayer board in which plated through-holes and conductor circudits have been formed, and roughening the cured thermosetting resin layer on the via hole wall surfaces with a roughening agent.

Abstract: Provided is an electrostatic protective device which is highly effective in protecting relatively vulnerable devices such as IC's and LSI's from electrostatic damages, and a method for fabricating an electrostatic protective device which can simplify the structure as compared with the conventional devices sealed in a glass container, and can reduce the size and cost of the device. The chip type electrostatic protective device comprises an inner insulating layer made of organic resin material and provided with a plurality of holes for defining air gaps, a pair of outer insulating layers placed on both sides of the inner insulating layer, and circuit segments defining a discharge gap in each of the air gaps. Holes for interconnection are formed in the laminated assembly, and the interior of each of the holes is turned electroconductive.

Abstract: A metal foil for printed wiring boards comprising a first copper layer to be adhered to a resin, a second copper layer having a sufficient strength as a metal layer and a nickel-phosphorus alloy layer containing 1.1% by weight or more of phosphorus formed between the first and second copper layers is suitable for producing printed wiring boards having excellent heat resistance, particularly during production procedures.

Abstract: A process for producing a wiring board involves laminating a metal foil on both sides of an insulating substrate not completely cured, followed by pressing with heating; drilling holes in the resulting laminate for connecting circuits therein; removing portions of the metal foils in narrow areas around the holes to form hollow portions in the metal foils; and filling a flowable electroconductive substance in the holes and the hollow portions.

Abstract: A wiring board comprising one or more inner layer circuit substrates and outer circuit layers formed from metal foil layers on both sides of said dinner layer circuit substrates via prepregs, said inner layer circuit substrate comprising an insulating layer and metal foil layers formed on both sides of said insulating layer, at least one inner layer circuit substrate or said outer circuit layers or both having hollow portions in the metal foil layer filled with an electroconductive substance, said wiring board having one or more through-holes at least in the hollow portions and filled with the electroconductive substance, has high reliability and a high wiring density.

Abstract: A metal foil for printed wiring boards comprising a first copper layer to be adhered to a resin, a second copper layer having a sufficient strength as a metal layer and a nickel-phosphorus alloy layer containing 1.1% by weight or more of phosphorus formed between the first and second copper layers is suitable for producing printed wiring boards having excellent heat resistance, particularly during production procedures.

Abstract: A two-component developer comprising a magnetic carrier having a carbon black-containing resin-coating layer and a toner composed of a carbon black-containing resin composition is disclosed. A styrene resin, an acrylic resin or a styrene-acrylic copolymer resin is selected as each of the carrier-coating resin and the toner-forming resin, and the carbon black content A in the carrier-coating layer and the carbon black content B in the toner-forming layer satisfy requirements represented by the following formulae: ##STR1## Namely, by adjusting the carbon black contents A and B within specific ranges relatively to each other, a two-component developer which is well-balanced between the frictional chargeability characteristic and the electric resistance is provided.

Abstract: Crystallized glass roughened by using a roughening solution having a larger dissolving rate as to a non-crystalline phase compared with a crystalline phase, followed by metallizing by electroless plating shows strong adhesive strength between the crystallized glass substrate and the plated film.