Abstract: A semiconductor wafer protecting unit which enables a semiconductor wafer to be handled as required, without breakage of the semiconductor wafer, even when the back of the semiconductor wafer is ground to decrease the thickness of the semiconductor wafer markedly; and a semiconductor wafer processing method using such a semiconductor wafer protecting unit. The semiconductor wafer protecting unit is composed of a magnetized tape having one surface with tackiness, and a magnetic substrate having many pores formed at least in a central zone thereof.

Abstract: The present invention relates to cell models of Alzheimer's disease. Transgenic yeast cells are described as models for the tau-opathy in Alzheimer's disease. These cell models comprise recombinant DNA constructs comprising control sequences and a cDNA sequence encoding a human tau-isoform and another similar construct comprising a protein kinase that is capable, directly or indirectly, of modulating the phosphorylation of the microtubule-associated protein tau. The transgenic cells are useful for high-throughput testing for potential therapeutic agents for Alzheimer's disease and other neurodegenerative disorders.

Abstract: A method of picking up a plurality of semiconductor chips formed by dividing a semiconductor wafer comprises the step of adhesively holding the plurality of semiconductor chips on an elastic adhesive pad which has innumerable pores in the surface and generates adhesion force when negative pressure is produced by the pores crushed by restoration force generated by elasticity and adhesion, and the step of picking up the semiconductor chips in a state of air in the pores being expanded by heating the elastic adhesive pad which adhesively holds the plurality of semiconductor chips at a predetermined temperature.

Abstract: A method of processing a semiconductor wafer having a large number of rectangular areas sectioned by streets arranged in a lattice form on the front surface, circuits being formed in the respective areas. This method comprises the step of mounting a semiconductor wafer on a protective substrate in such a manner that the front surface of the semiconductor wafer is opposed to one side of the protective substrate having a large number of pores in at least its central area prior to the grinding of the back surface of the semiconductor wafer.

Abstract: A semiconductor chip pickup apparatus comprises support means for supporting a tape having many semiconductor chips adhered onto the face of the tape; and pickup means for individually picking up the semiconductor chips from the face of the tape supported on the support means. The support means includes a plurality of support lines, extending parallel at spaced locations, for supporting the back of the tape. Suction means is disposed for sucking the back of the tape, thereby peeling the tape from the semiconductor chips in regions other than the support lines.

Abstract: A method of separating a plate-like workpiece held by adhesion on an elastic adhesive pad from the pad. The elastic adhesive pad has innumerable pores in its surface and generates adhesive force when negative pressure is produced by the pores, after being crushed, by restoration force generated by elasticity and adhesion. The method includes the step of heating the elastic adhesive pad at a predetermined temperature to separate the plate-like workpiece from the elastic adhesive pad by air expanding in the pores.

Abstract: A method of picking up a plurality of semiconductor chips formed by dividing a semiconductor wafer comprises the step of adsorption-holding the plurality of semiconductor chips on an elastic adsorption pad which has innumerable pores in the surface and generates adsorption force when negative pressure is produced by the pores crushed by restoration force generated by elasticity and adhesion, and the step of picking up the semiconductor chips in a state of air in the pores being expanded by heating the elastic adsorption pad which adsorption-holds the plurality of semiconductor chips at a predetermined temperature.

Abstract: A method of separating a plate-like workpiece adsorption-held on an elastic adsorption pad from the elastic adsorption pad that has innumerable pores in the surface and generates adsorption force when negative pressure is produced by the pores crushed by restoration force generated by elasticity and adhesion, which comprises the step of separating the plate-like workpiece from the elastic adsorption pad in a state of air in the pores being expanded by heating the elastic adsorption pad at a predetermined temperature.