Patents by Inventor Kouichi Yamamoto
Kouichi Yamamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10733398Abstract: A detection device includes a switch unit, the switch unit performs switching to a gain reduction state in which a gain of a loop antenna is reduced or a gain non-reduction state in which the gain of the loop antenna is not reduced in correspondence with a state of a detection target. When a wavelength of an electric wave is set as ?, the switch unit includes switch terminals for reducing the gain of the loop antenna within a range K1 on the loop antenna from a first circuit terminal to a position that is spaced away from the first circuit terminal by ?/8. In addition, the switch unit includes switch terminals for reducing the gain of the loop antenna within a range on the loop antenna from a second circuit terminal to a position that is spaced away from the second circuit terminal by ?/8.Type: GrantFiled: May 20, 2019Date of Patent: August 4, 2020Assignee: YAZAKI CORPORATIONInventors: Kouichi Yamamoto, Kazutomo Fujinami, Hiroshi Miyamoto, Ryohei Nishizaki, You Yanagida, Kunihiko Yamada
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Publication number: 20200190301Abstract: There is provided an elastomer composition which can be molded like a thermoplastic resin by using a conventional plastics processing equipment, and has a very small compression set like a vulcanized rubber. The elastomer composition comprises: 100 parts by mass of an ethylene/?-olefin copolymer (A); 10 to 150 parts by mass of a propylene-based resin (B); and 5 to 150 parts by mass of a non-aromatic softener for rubber (C); 0.03 to 1 parts by mass of an organic peroxide (D); 0.5 to 7 parts by mass of a silane coupling agent (E); 0 to 2 parts by mass of a crosslinking aid (F); and 0 to 100 parts by mass of an inorganic filler (G).Type: ApplicationFiled: October 12, 2017Publication date: June 18, 2020Applicant: RIKEN TECHNOS CORPORATIONInventors: Kouichi YAMAMOTO, Rikuo SHIMIZU
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Publication number: 20190362112Abstract: A detection device includes a switch unit, the switch unit performs switching to a gain reduction state in which a gain of a loop antenna is reduced or a gain non-reduction state in which the gain of the loop antenna is not reduced in correspondence with a state of a detection target. When a wavelength of an electric wave is set as ?, the switch unit includes switch terminals for reducing the gain of the loop antenna within a range K1 on the loop antenna from a first circuit terminal to a position that is spaced away from the first circuit terminal by ?/8. In addition, the switch unit includes switch terminals for reducing the gain of the loop antenna within a range on the loop antenna from a second circuit terminal to a position that is spaced away from the second circuit terminal by ?/8.Type: ApplicationFiled: May 20, 2019Publication date: November 28, 2019Applicant: Yazaki CorporationInventors: Kouichi YAMAMOTO, Kazutomo FUJINAMI, Hiroshi MIYAMOTO, Ryohei NISHIZAKI, You YANAGIDA, Kunihiko YAMADA
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Patent number: 8632688Abstract: In a plasma processing apparatus in which a wafer is processed while supplying radio frequency power to electrodes disposed in a sample stage in a processing chamber within a reactor via a matching box, by matching a specific value of power at transition points of data values of at least two kinds among characteristic data including light emission intensity of the plasma, magnitude of its time variation, a matching position of the matching box, and a change of a value of a voltage of the radio frequency power supplied to the electrodes detected by varying the power to a plurality of values during the processing with a value detected by using characteristic data which is detected during the processing executed on a wafer of the same kind in a different reactor, the differences of the states inside the processing chamber or plasma among a plurality of semiconductor processing apparatuses or reactors are reduced.Type: GrantFiled: September 20, 2011Date of Patent: January 21, 2014Assignee: Hitachi High-Technologies CorporationInventors: Masaru Izawa, Kouichi Yamamoto, Kenji Nakata, Atsushi Itou
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Patent number: 8597843Abstract: A cooling system for a battery pack which can reduce the number of components, manufacturing cost and an installation space, is provided. The battery pack includes high-voltage electrically conductive paths connected to a positive electrode and a negative electrode thereof, respectively. The high-voltage electrically conductive path connected to the positive electrode serves as a cooling member. The high-voltage electrically conductive path connected to the positive electrode is arranged along the battery pack to absorb heat generated at the battery pack and dissipate the absorbed heat at a location distant from the battery pack. The invention takes an advantage of the superior heat conductivity of the high-voltage electrically conductive path to cool down the battery pack.Type: GrantFiled: February 22, 2010Date of Patent: December 3, 2013Assignee: Yazaki CorporationInventors: Kouichi Yamamoto, Akihito Shibuya, Hiroki Maegawa
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Publication number: 20130045547Abstract: In a plasma processing apparatus in which a wafer is processed while supplying radio frequency power to electrodes disposed in a sample stage in a processing chamber within a reactor via a matching box, by matching a specific value of power at transition points of data values of at least two kinds among characteristic data including light emission intensity of the plasma, magnitude of its time variation, a matching position of the matching box, and a change of a value of a voltage of the radio frequency power supplied to the electrodes detected by varying the power to a plurality of values during the processing with a value detected by using characteristic data which is detected during the processing executed on a wafer of the same kind in a different reactor, the differences of the states inside the processing chamber or plasma among a plurality of semiconductor processing apparatuses or reactors are reduced.Type: ApplicationFiled: September 20, 2011Publication date: February 21, 2013Inventors: Masaru IZAWA, Kouichi Yamamoto, Kenji Nakata, Atsushi Itou
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Publication number: 20120267741Abstract: A solid-state imaging device includes: a light receiving portion formed on a semiconductor substrate; a multilayer structure formed on the semiconductor substrate, that includes an interlayer insulating film and a first concave portion at a position corresponding to the light receiving portion; and an optical waveguide formed in the first concave portion. The optical waveguide includes a first film and a second film formed sequentially from a side of the multilayer structure. The first film covers a side face and a bottom face of the first concave portion and includes a second concave portion. The second film is in contact with the first film and fills up the second concave portion. The thickness of the first film formed on the side face of the first concave portion is thinner at a top portion of the first concave portion than at the bottom portion thereof.Type: ApplicationFiled: April 17, 2012Publication date: October 25, 2012Applicant: PANASONIC CORPORATIONInventors: SHIGERU SUZUKI, HIROFUMI OHNAKA, KOUICHI YAMAMOTO
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Publication number: 20120186747Abstract: A plasma processing apparatus is provided with a processing chamber which is arranged inside a vacuum container and plasma is formed inside, a circular shape plate member made of a dielectric material arranged above the processing chamber through which an electric field is transmitted, and a cavity part having a cylindrical shape arranged above the plate member and the electric field is introduced inside, in which the cavity part is provided with a first cylindrical cavity part having a cylindrical shape cavity with a large diameter and having the plate member as the bottom face, a second cylindrical cavity part arranged above to be connected to the first cylindrical cavity part and having a cylindrical shape cavity with a small diameter, and a step portion for connecting these between the first and the second cylindrical cavity parts.Type: ApplicationFiled: September 20, 2011Publication date: July 26, 2012Inventors: Shinji OBAMA, Masaru Izawa, Kenji Maeda, Yoshihide Kihara, Kouichi Yamamoto, Hitoshi Tamura
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Publication number: 20120174390Abstract: The present invention provides a method for manufacturing a substrate chip including the steps of: setting the thickness of at least a part of a metal wiring pattern unit provided on the raw substrate to be 0.1 ?m to 5 ?m; forming a groove for creating at least a crack in the surface of the ceramic substrate along a planned cutting line which passes through the part of the metal wiring pattern unit by using a cutting wheel having a cutter blade being formed into substantially V shape in cross section along the circumferential portion of the disk rotating wheel; and cutting the raw substrate by giving load from just behind of the groove.Type: ApplicationFiled: March 19, 2012Publication date: July 12, 2012Applicant: TOKUYAMA CORPORATIONInventors: Yasuyuki YAMAMOTO, Kouichi YAMAMOTO, Masakatsu MAEDA
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Patent number: 8203504Abstract: An image forming method and a charged particle beam apparatus suitable for suppressing the inclination of charging when scanning a two-dimensional area with a charged particle beam. A third scanning line located between a first scanning line and a second scanning line is scanned. After the first, second and third scanning lines have been scanned, a plurality of scanning lines are scanned between the first and third scanning lines and between the second and third scanning lines.Type: GrantFiled: October 19, 2010Date of Patent: June 19, 2012Assignee: Hitachi High-Technologies CorporationInventors: Atsushi Kobaru, Hidetoshi Morokuma, Hiroki Kawada, Sho Takami, Katsuhiro Sasada, Kouichi Yamamoto, Norio Satou, Kunio Nakanishi
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Patent number: 8128870Abstract: A drug discovery screening apparatus improves a testing operation efficiency. The drug discovery screening apparatus comprises an image measurement unit, an incubator unit integrally connected to the image measurement unit, a fixed stage disposed at the incubator unit, first conveyance for taking out one of plates stored in a carousel of the incubator unit and conveying the plate onto the fixed stage, second conveyance for taking out the plate conveyed onto the fixed stage and conveying the plate onto an XY stage disposed at the image measurement unit, and a control unit. The second conveyance comprises first and second conveyance arms, respectively supported horizontally by a conveyance unit support section, which convey the plates onto the fixed stage and XY stage so as to allow the respective plates to cross each other.Type: GrantFiled: February 12, 2010Date of Patent: March 6, 2012Assignee: Yokogawa Electric CorporationInventors: Taichirou Nedu, Kouichi Yamamoto, Takayuki Kei, Toshiyuki Suzuki
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Patent number: 7952020Abstract: A water stopping structure includes a water stopping member that has an outer peripheral face which is inclined with respect to an axis direction of a shielded wire, and that is adapted to contract a diameter thereof and attached on an outer face of the shielded wire in a state that the outer peripheral face of the water stopping member is positioned to an end portion of the sheath which is adjacent to an exposed portion of the outer sheath, and a fastening ring that has an inner peripheral face which is corresponded to the outer peripheral face of the water stopping member in inclination. The fastening ring is slid in the axis direction of the shielded wire so as to press the end portion of the sheath of the shielded wire for contracting the diameter of the water stopping member in a state that the inner peripheral face of the fastening ring is arranged on the outer peripheral face of the water stopping member.Type: GrantFiled: May 24, 2007Date of Patent: May 31, 2011Assignee: Yazaki CorporationInventors: Kouichi Yamamoto, Hidehiro Ichikawa, Shigemi Hashizawa
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Publication number: 20110032176Abstract: An image forming method and a charged particle beam apparatus suitable for suppressing the inclination of charging when scanning a two-dimensional area with a charged particle beam. A third scanning line located between a first scanning line and a second scanning line is scanned. After the first, second and third scanning lines have been scanned, a plurality of scanning lines are scanned between the first and third scanning lines and between the second and third scanning lines.Type: ApplicationFiled: October 19, 2010Publication date: February 10, 2011Inventors: Atsushi KOBARU, Hidetoshi Morokuma, Hiroki Kawada, Sho Takami, Katsuhiro Sasada, Kouichi Yamamoto, Norio Satou, Kunio Nakanishi
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Publication number: 20110020686Abstract: A cooling system for a battery pack which can reduce the number of components, manufacturing cost and an installation space, is provided. The battery pack includes high-voltage electrically conductive paths connected to a positive electrode and a negative electrode thereof, respectively. The high-voltage electrically conductive path connected to the positive electrode serves as a cooling member. The high-voltage electrically conductive path connected to the positive electrode is arranged along the battery pack to absorb heat generated at the battery pack and dissipate the absorbed heat at a location distant from the battery pack. The invention takes an advantage of the superior heat conductivity of the high-voltage electrically conductive path to cool down the battery pack.Type: ApplicationFiled: February 22, 2010Publication date: January 27, 2011Applicant: Yazaki CorporationInventors: Kouichi Yamamoto, Akihito Shibuya, Hiroki Maegawa
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Patent number: 7817105Abstract: An image forming method and a charged particle beam apparatus suitable for suppressing the inclination of charging when scanning a two-dimensional area with a charged particle beam. A third scanning line located between a first scanning line and a second scanning line is scanned. After the first, second and third scanning lines have been scanned, a plurality of scanning lines are scanned between the first and third scanning lines and between the second and third scanning lines.Type: GrantFiled: March 5, 2007Date of Patent: October 19, 2010Assignee: Hitachi High-Technologies CorporationInventors: Atsushi Kobaru, Hidetoshi Morokuma, Hiroki Kawada, Sho Takami, Katsuhiro Sasada, Kouichi Yamamoto, Norio Satou, Kunio Nakanishi
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Publication number: 20100211211Abstract: The invention is to provide a drug discovery screening apparatus capable of improving a testing operation efficiency. The drug discovery screening apparatus comprises an image measurement unit, an incubator unit integrally connected to the image measurement unit, a fixed stage disposed at the incubator unit, first conveyance means for taking out one of plates stored in a carousel of the incubator unit and conveying the plate onto the fixed stage, second conveyance means for taking out the plate conveyed onto the fixed stage and conveying the plate onto an XY stage disposed at the image measurement unit, and a control unit, wherein the second conveyance means comprises first and second conveyance arms, respectively supported horizontally by a conveyance unit support section, which convey the plates onto the fixed stage and XY stage so as to allow the respective plates to cross each other.Type: ApplicationFiled: February 12, 2010Publication date: August 19, 2010Applicant: YOKOGAWA ELECTRIC CORPORATIONInventors: Taichirou Nedu, Kouichi Yamamoto, Takayuki Kei, Toshiyuki Suzuki
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Patent number: 7719283Abstract: A switching circuit includes a capacitor, a combination battery having a plurality of unit cells connected in series, each of the unit cells containing battery, and a plurality of change-over switches sequentially connecting both ends of the each of the unit cells to the capacitor. The change-over switch has two semiconductor switches connected in series so that the source-drain directions thereof are oriented opposite to each other.Type: GrantFiled: December 3, 2004Date of Patent: May 18, 2010Assignee: Yazaki CorporationInventors: Satoshi Ishikawa, Kouichi Yamamoto
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Publication number: 20100065310Abstract: A method for manufacturing a substrate chip including the steps of: setting the thickness of at least a part of a metal wiring pattern unit provided on the raw substrate to be 0.1 ?m to 5 ?m; forming a groove for creating at least a crack in the surface of the ceramic substrate along a planned cutting line which passes through the part of the metal wiring pattern unit by using a cutting wheel having a cutter blade being formed into substantially V shape in cross section along the circumferential portion of the disk rotating wheel; and cutting the raw substrate by giving load from just behind of the groove. When manufacturing metallized ceramic substrate chips by cutting (dividing) the ceramic substrate on the surface of which wiring patterns made of a metal film is formed, the method is capable of effectively using the base material, inhibiting defects in the metallized portion, and efficiently manufacturing the substrate chips in high yield.Type: ApplicationFiled: November 29, 2007Publication date: March 18, 2010Inventors: Yasuyuki Yamamoto, Kouichi Yamamoto, Masakatsu Maeda
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Patent number: 7642796Abstract: A control system and method of a semiconductor inspection system are disclosed, wherein the inspection can be conducted without reducing the reliability of measurement even in the case where the supply voltage drops. The control system has a controller, a power supply for a power on-off circuit constituting a switching regulator designed to maintain the output voltage against a supply voltage drop, and a supply voltage drop detector. In the case where a supply voltage drop is detected during the measurement, the measurement is automatically suspended, and after restoring the supply voltage, the measurement is automatically restarted.Type: GrantFiled: March 22, 2007Date of Patent: January 5, 2010Assignee: Hitachi High-Technologies CorporationInventors: Kouichi Yamamoto, Shinobu Otsuka
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Patent number: 7612287Abstract: To simply provide a water-stopping structures for shielded electric wire in the shielded portion of the wire at a low cost, a water stop structure in a shielded electric wire is comprised by stripping a sheath 4 of the shielded electric wire in the middle part thereof; permeating an adhesive into the exposed shield member 3; overlaying a heat shrinkable tube 12 over the shield member via hot melt 14; and heat shrinking the heat shrinkable tube 12 in a state where both ends of the heat shrinkable tube 12 are overlapped with the outer periphery of the sheath 4.Type: GrantFiled: March 19, 2007Date of Patent: November 3, 2009Assignee: Yazaki CorporationInventors: Hidehiro Ichikawa, Kouichi Yamamoto, Shigemi Hashizawa