Abstract: An object of the present invention is to provide a handler and a testing method thereof which enable efficient measurements on a plurality of semiconductor devices. An arm control unit 106 controls, for each of contact arms 101a and 101b, the timing of control for performing contact control for bringing semiconductor devices 103a and 103b to be tested to one of a contact state and a non-contact state with test boards 108a and 108b connected to semiconductor testers 109a and 109b. The plurality of semiconductor devices are simultaneously measured using the handler 107, so that when a “defective item” is found on a specific measurement part, only the defective item on the measurement part can be replaced with another untested item and thus tests can be efficiently conducted.

Abstract: When a convex jig pushes up a bottom face of an adhesive sheet where a target semiconductor device is located, a non-target semiconductor device located near the target semiconductor device is lower in position than the target semiconductor device. Thus, the non-target semiconductor device is prevented from coming into contact with an impedance adjusting element and a coaxial connector each provided for high-frequency measurement near a socket.

Abstract: Provided are wrappings for foods comprising a laminated composite sheet which comprises an impermeable sheet, an absorbent fiber sheet and a hydrophobic fiber sheet, said hydrophobic fiber sheet having a water resistance of at least 5 cmH.sub.2 O and an air permeability of at least 10 c/cm.sup.2 /sec. Also provided are bags and boxed fabricated from the above wrappings.These wrappings are microwaveable and have heat insulation property.